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SX1302
Datasheet Rev 1.0
DS.SX1302.W.APP June 2019
LoRa Gateway Baseband
Transceiver
SX1302
www.semtech.com
Figure A: Block Diagram
General Description
The SX1302 is a new generation of baseband LoRa® chip for
gateways. It excels in reducing current consumption,
simplifies the thermal design of gateways, and reduces the
Bill Of Materials costs, yet it is capable of handling a higher
amount of traffic than preceding devices.
The high-speed baseband digital engines are clocked from
a single 32 MHz clock source, and the chip embeds the
capability to support SF5 and SF6 unlike previous
generations. To absorb the additional traffic that the radio
will be able to detect, more modems are now collaborating.
8 of them have been added to specifically handle the
high-speed SF5 and SF6 packets, whilst the 8 others are still
taking care of the SF7-SF12 traffic. The architecture has
been reworked to reduce power consumption very
significantly; it makes it easier to embed the SX1302 in
highly-integrated environments where power dissipation
might be a challenge.
The SX1302 is also serialized in production, with a globally
unique 64-bit number.
Key Features
• LoRaWAN, Class A/B/C, all regions
• 125 kHz LoRa reception with:
• 8 x 8 channels LoRa® packet detectors
• 8 x SF5-SF12 LoRa® demodulators
• 8 x SF5-SF10 LoRa® demodulators
• 125 /250 / 500 kHz LoRa® demodulator
• (G)FSK demodulator
• Direct interface to Semtech transceivers
• SX1255, SX1257 and SX1250
• Single 32 MHz clock
Ordering Information
QFN68 Package, operating range from -40 to +85°C
Pb-free, Halogen free, RoHS/WEEE compliant product
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Part Number Delivery Order Quantity
SX1302IMLTRT Tape and Reel 3000

SX1302
Datasheet Rev 1.0
DS.SX1302.W.APP June 2019
3 of 31
www.semtech.com
Table of Contents
General Description.............................................................................................................................................1
Key Features...........................................................................................................................................................1
Ordering Information .........................................................................................................................................1
Revision History ....................................................................................................................................................2
List of Figures ........................................................................................................................................................5
List of Tables .........................................................................................................................................................6
1. Introduction.......................................................................................................................................................7
1.1 RF Front End Interface ......................................................................................................................7
1.2 Power Distribution .............................................................................................................................7
1.3 Clocking .................................................................................................................................................7
1.4 Detection Engine and Modems ....................................................................................................7
1.5 Digital Interface and Control ..........................................................................................................7
1.6 Application Programming Interface ............................................................................................7
1.7 Application Information ...................................................................................................................7
2. Pin Connections ...............................................................................................................................................8
2.1 Pinout .....................................................................................................................................................8
2.2 Package View .................................................................................................................................... 11
3. Specifications ................................................................................................................................................. 12
3.1 ESD Notice .......................................................................................................................................... 12
3.2 Absolute Minimum and Maximum Ratings ........................................................................... 13
3.3 Operating Range .............................................................................................................................. 13
3.4 Electrical Specifications ................................................................................................................. 13
3.5 Digital I/O Specifications ............................................................................................................... 14
3.6 Example Reference Design Performance ............................................................................... 14
4. RF Front End Interface................................................................................................................................. 16
5. Power Distribution ....................................................................................................................................... 18
6. Clocking ........................................................................................................................................................... 19
7. Detection Engine - Modems..................................................................................................................... 20
8. Digital Interface and Control .................................................................................................................... 21
8.1 Host SPI Interface ............................................................................................................................. 21
8.1.1 HOST SPI Timings ................................................................................................................ 21
8.1.2 SPI Timings............................................................................................................................. 22
9. Application Programming Interface...................................................................................................... 23
9.1 Globally Unique EUI ........................................................................................................................ 23
10. Application Information .......................................................................................................................... 24
10.1 Geographical Designs ................................................................................................................. 24
10.2 Reference Block Diagram ........................................................................................................... 24
10.3 Reference Design Layout ........................................................................................................... 25
11. Packaging Information............................................................................................................................. 26
11.1 Package Outline Drawing .......................................................................................................... 26
11.2 Package Marking ........................................................................................................................... 27
11.3 Land Pattern ................................................................................................................................... 27
11.4 Reflow Profiles ................................................................................................................................ 28

SX1302
Datasheet Rev 1.0
DS.SX1302.W.APP June 2019
4 of 31
www.semtech.com
11.5 Tape and Reel Specification ...................................................................................................... 28
11.6 Thermal Impedance ..................................................................................................................... 28
Glossary ................................................................................................................................................................ 29

SX1302
Datasheet Rev 1.0
DS.SX1302.W.APP June 2019
5 of 31
www.semtech.com
List of Figures
Figure 2-1: Pin Locations, Top View........................................................................................................... 11
Figure 4-1: Receive Interconnection ......................................................................................................... 16
Figure 4-2: Transmit Interconnection ....................................................................................................... 16
Figure 8-1: SPI Timing Diagram................................................................................................................... 21
Figure 10-1: Application Design Block Diagram................................................................................... 24
Figure 10-2: Reference Design PCB Layout............................................................................................. 25
Figure 11-1: QFN 7x7 Package Outline Drawing................................................................................... 26
Figure 11-2: SX1302 Package Marking ..................................................................................................... 27
Figure 11-3: QFN 7x7mm Land Pattern.................................................................................................... 27
Figure 11-4: Tape and Reel Specification ................................................................................................ 28
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