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IEC60664-3-2016低压系统内设备的绝缘配合第3部分用于污染防护的涂层、封装或模塑的使用.pdf
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IEC60664-3-2016低压系统内设备的绝缘配合第3部分用于污染防护的涂层、封装或模塑的使用
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@
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
BASIC
SA
F
ETY
PUBLICAT
I
ON
P
UB
LI
CATI
ON
FO
N
DAME
N
TALE
DE
SECURI
T E
IEC 60664-3
Edition 3.0 2016-1 1
Insulation
c
。。
rdination
for
equipment
within
low
-
voltage
systems
-
Part
3: Use
of
c
。
ating
,
potting
。
rm
。
ulding
for
pr
。
tecti
。
n
against
polluti
。
n
c
。。
rdinati
。
n
de
l'isolement
des
materiels
dans
les
systemes
(陆
seaux)
a basse
tensi
。
n-
Partie 3:
Utilisation
de
revetement,
d
’
emp
。
tage
ou
de
m
。
ulage
p。
ur
la
protecti
。
n
c
。
ntre
la
polluti
。
n
INTERNATIONAL
ELECTROTECHNICAL
COMMISSI
ON
COMMISSI
ON
ELECTROTECHNIQUE
INTERNATIONALE
I
CS
29.080.30
I
SBN
978-2-8322-3693
-2
Warning! Make
sure
that
you
。
btained
this
publicati
。
n
from
an authorized
distributor.
Att
e
ntion!
Veuillez
vous
assurer
que
v。
us
avez
。
btenl
』
cett
e
publication
via
un
distributeur
agre
e.
®
Registe
r
ed
.
t
r
adema
r
k
.
of
拍
e
Inte
rn
a
ti
onal Electratechnical
c
。
mm
i
ssi
。
n
使用涂层,灌封或模塑来防止污染

IEC
60664-3
:
2016
© IEC
2016
- 2 -
CONTENTS
FOREWORD
.............
..
.
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-….4
INTR
ODUCT
I
ON
.. .. .. .. ... .. .. .. .. .. .. .. .. ... .. .. .. .. .. .. .. .
..............
6
Scope
.-
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··-
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……
.. 7
Normative
references
.. .. ... .. .. .. ... .. .. .. .. .. .. ... .. .. .. ... .. .. .. .. ... .. 7 2
Terms
and
definitions
.-
-…-
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--
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··-
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-…
.8
3
Design
requirements
.. .. .. ... .. .. .. .. .. .. .. .. .. .. ... .. .. .. .
..............
9 4
.
.
、
......
、
-
···
Principles
...-
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-…--……………
·…………
…
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.9
Application
range
with
regards
to
the
environment
.-
…·
-- -
…·
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··
-
--
-
……
-
--
-
··
-
….
...... 9
Requirements
for
the
types
of
protection
....... .... .... ..... .... .... .... ............. .... .... ..... .... .
10
D1mens1oning
procedures
... .. .. .. ... .. .. .. .. .. .. ... .. .. .. ... . .
......
10
4.1
4.2
4.4
4.3
Te
sts
··
-
……
..…-
··
-…-
-……
-
··
-…-
…·
-…-
--
-…-
…·
-…-
--
-
……·
-…-
--
-
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-…-
--
-
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··
-…. • •
••
.
11
5
General.
…·……-
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-
-………·…-
-
··
-
…·
-
-……-
-
…·
-
-………·……….
11
Specimens
for
testing
coatings
... ... .... ... ... .... .... .... ... .... .... .... ... ............. ... ... .
11
Specimens
for
testing
mouldings
and
potting
......
……
-
-…·
-
··
-
··
-
…·
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--
-
··
-
…..
......
12
P
『
eparation
of
test
specimens
....
..
.
……·
-…-
--
-
…·
-
··
-…-
-……
-
··
-…-
-…
··-
…·
-…. • • .•.•
12
Visual
examination
.-
-
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-
--
-
··
-
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-
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-
··
-
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--
-
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-
··
-
··
-
…·
-
--
-
··
-
··
-…. • • • • • 1 2
5.1
5.2
5.4
5.3
5.5
Scratch-resistance
test
.
…·
-
--
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--
-…-
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--
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12
Conditioning
of
the
test
specimens
.
..
.
…·
-
··
-
--
-
……
-
--
-
··
-
….
. • . .…-
··
-
--
-
……
. • • . • • 1 3
General
.........................................................................................
13
Cold
conditioning
…··
-
··
-
··
-
…·
-
··
-
··
-
··
-
…·
-
··
-
··
-
…·
-
…·
-
··
-
··
-
……
. • • . • • . • • • • • 1 3
Dry-h
e
at
conditioning
·-
--
-…-
……·
-
--
-…-
…·
-…-
--
-
……
-
……-
-…-
··
-
…·
-
--
-…-
…..
.
13
Rapid
change
of
temperature
..
……-
-
··
-
··
-
…·
-
…··
-
··
-
--
-
…·
-
··
-
--
-
··
-
….
. • • . • • . • •
14
Damp
heat,
steady-state
with
polarizing
voltage
.-
-……
-
··
-…-
…·
-…-
--
-…-
….
.... 1 5
Mechanical
and
electrical
tests
after
conditioning
and
electromigration
..
….
........... 1 5
5.6
5. 7 .1
5.7
.2
5.7.5
5.8
5.7
.3
5.7
.4
5.7
General
test
conditions
... ... .... ... ... .... .... ... ... ... ... .... ... ... .... .... .... ... ....
15
Adh
e
sion
of
coating
.-
-
··
-
··
-
…··-
-
··
-
··
-
…·
-
--
-
··
-
…··
-
-…··
-
··
-
--
-
….
. • • . • • . • • • • • 1 5
5.8
.1
5.8
.2
I
nsulation
resistance
between
conductors
…-
--
-…-
…·
-…-
--
-
……·
-…-
--
-
…·
-
··
-…
16
Voltage
test
..
..
.
…·
-
··
-
··
-
……
-
··
-
··
-
…·
-
··
-
··
-
··
-
…·
-
…·
-
··
-
··
-
…·
-
··
-
··
-
··
-
….
. •
16
Partial
discharge
extinction
voltage
E …-
--
-
……
-
……-
-…-
··
-
…·
-
--
-…-
…….
. • • .•.• 1 6
5.8
.3
5.8.5
5.8
.4
Additional
tests
.
..
.
..
.
…·
-
--
-
··
-
··
-
…·
-
--
-
··
-
…··-
-
··
-
··
-
……-
-
··
-
··
-
…·
-
--
-
··
-
…··
-
….
. •
16
5.9
General
.....
..
.
……-
-…-
--
-
…·
-
--
-…--……………
·…………
……. • . • • • • • .…-
--
-
…….
...
16
R
esistance
to
soldering
heat
.-
……-
-
··
-
··
-
…·
-
…··
-
··
-
--
-
…·
-
··
-
--
-
··
-
….
. • • . • • . • • 1 7
5. 9.1
5.9
.2
Flammability
..…-
…·
-…-
··
-
……·
-…-
··
-
…·
-
··
-…-
··
-
…·
- …··-
··
-…-
…·
-…-
··
-…-
….
... 1 7
Solvent
resistance
...-
-
··
-
··
-
…··-
-
··
-
··
-
…·
-
--
-
··
-
…··
-
-…··
-
··
-
--
-
…·
-
··
-
--
-
….
•
17
5.9
.3
Test
sequences
..
.…-
··
-
…·
-
--
-…-
··
-
…·
-
--
-…-
……·
-
--
-…-
……
··-
--
-…-
….
... 1 8
Decisions
to
be
taken
by
the
technical
committees
.....
……
-…............. 2 0
Annex
A
(normative)
Annex
B
(normative)
5.9
.4
General.
…··-
-…-
--
-
…·
-
--
-…-
-……
-
--
-…--……………
…·
-…-
--
-…-
…·
-…-
--
-
……-
-….
..
...
20
Decisions
required
by
technical
committees
.-
-
··
-
…··-
-
··
-
··
-…..
…··
-
··
-
--
-
……
....
20
Optional
test
conditions
E
…·
-
--
-…-
……·
-
--
-…-
……·
-
--
-…-
…·
-…-
--
-……··
-…
··-
-…. • • .
•••
2 0
B.1
B.2
Printed
wiring
board
for
te
sting
coatings
....·
-
··
-
··
-
……
-
··
-
··
-
….
. .
•••
.•
21
B.3
Annex
C
(no
r
mative)
General.
…··-
-…-
--
-
…·
-
--
-…-
-……
-
--
-…--……………
…·
-…-
--
-…-
…·
-…-
--
-
……-
-…. • • .
••
21
Specification
of
the
printed
wiring
board
...-
-
··
-
··
-
…·
-
--
-
··
-
··
-…..
…··
-
··
-
--
-
….
........
21
A
『
rangement
of
the
conductors
.-
--
-
……·
-…-
--
-
……·
-…-
--
-
…·
-
··
-…-
-…
··-
…·
-…. • • .•.•
21
Arrangement
of
lands
.-
-
…·
-
··
-
--
-
……
-
--
-
··
-
…·
-
--
-
··
-
··
-
…·
-
--
-
··
-
…··-
-
··
-
··
-…. • • • • •
22
Connections
for
the
te
sts
...
..
.…-
……·
-
--
-…-
……·
-
--
-…-
…·
-…-
--
-……··
-…
··-
-…-
··
-…
22
C.1
C.2
345
CCC
Bibliography
.
..
.
…·
-
-………·……·
-
…·
-
-……………·…-
-
··
-
…·
-
-………·…………·………
.
25
原则
关于环境的应用范围
保护类型的要求
尺寸标注
使用涂层,灌封或模塑来防止污染

IEC 60664-3:2016 © IEC 2016 - 3 -
Figure 1 - Scratch-resistance test
for
protecting layers .......
..
...............
..
...............
..
...........
..
. 13
Figure
C
.
1
一
Configuration
of
the test specimen
..
....
.. .... .... .... .... .... ....
....
.. .... .... .... .... .... .... ....
.. 23
Figure C.2 - Configuration
of
lands
and adjacent conductors
.... .... .... .... ....
....
.. .... .... ....
......
.. ..
24
Table
1 - Minimum spacings
for
type 2 protection
.... .... .... ....
....
.. .... .... .... .... .... ....
....
.. .... .... ....
. 10
Table
2 -
Dry
-heat condit1on1ng
.. ....
...............
..
...............
..
...........
..
...............
..
...............
..
..... 14
Table
3 - Degrees
of
severities
for
rapid
change
of
temperature
..
....
.. .... .... .... .... .... ....
......
..
... 14
Table
A.1 -
Test
sequence
1
.. .... .... .... .... ....
....
.. .... .... .... .... .... ....
....
.. .... .... .... .... .... .... ....
....
.. ....
18
Table
A.2 -
Test
sequence
2 additional conditioning with
respect
to electromigration
.... ....
... 19
Table
A.3 - Additional tests
.... .... .... .... .... ....
....
.. .... .... .... .... .... ....
....
.. .... .... .... .... .... .... ....
....
.. ....
19
··,
,
··,旷旷...

IEC
60664
-3:
2016
©
IEC
2016
- 4 -
INTERNATIONAL ELECTROTECHNICAL COMMISSION
INSULATION COORDINATION FOR EQUIPMENT
WITHIN
LOW-VOLTAGE
SYSTEMS -
Part
3:
Use
。
f
c。
ating,
potting
or
m
。
ulding
f
。
r
pr
。
tection
against
p。
llution
FOREWORD
The
I
nternat
i
ona
l
Elect
『
otechn
i
ca
l
Commission (IEC) is a
worldw
ide
organ
i
zation
for standar
dizat
ion comprisi
ng
all national electrotechnical
comm
ittees (IEC National Committees). T
he
object
of
IEC is to
promote
international co-operation on
al
l questions concerning standardization in the el
ectr
ical and
electronic
fields. To
this end and in addition to
other
activ
ities, IEC publishes
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ional
Standa
『
ds
,
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ficat
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Technical Reports, Publi
cly
Available Specifications (PAS) and Gui
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ter referred to as “IEC
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).
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ional Committee
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ticipate in this preparatory work.
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Standardi
zat
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dete
『『
n
i
ned
by
agreement between the two organi
zat
ions.
..
‘
,
‘
,
‘‘
The
formal
dec
isions
o
『
agreements
of
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nearly
as possibl
e,
an international
consensus
of
opinion on t
he
『
elevant
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ittee has
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ep
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nt
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3)
4)
In
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ormity, IEC National Committees undertake to
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6)
7)
Attention is drawn to
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Normat
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refe
rences cited in this publication. Use of t
he
referenced publi
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ndispe
nsab
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Attention
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ghts
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ld responsible
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identifying
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or
all such
patent
rights.
9)
committee
TC
109:
International
Standard
IE C
60664-3
has
been
prepared
by
IEC
technical
Insulation
co-ordination
for
low-voltage
equipment.
It
has
the
status
of
a
basic
safety
publication
in
accordance
with
IEC
Guide
104
.
published
in
2003
and
Amendment
replaces
the
second
edition
a
technical
revision.
This
third
edition
cancels
and
1:2010.
This
edition
constitutes
previous
with
respect
to
the
significant
technical
changes
This
edition
includes
the
following
edition
:
information
added
concerning
interpolation;
provided
scratch
test
is
only
for
ty
p e 2
pr
。
tecti
。
n
;
a)
b)

IEC 60664-3:2016 © IEC 2016 - 5 -
c) renumbered the scratch
test
to follow the visual examination test, since
it
makes
more
sense there;
d) separated the tables under
what
is now called
Annex
A, to make them clearer.
The
text
of
this standard is based on the following documents:
FDIS
109/153/FDIS
Re
po
『
t
on
vot
i
ng
109/154/RVD
Full information on the
vot
ing
for
the approval
of
this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
In this standard, the following types are used:
- Terms used
throughout
this standard
which
have
been defined in Clause
3:
b
。
Id
type
A list
of
all parts in the IEC 60664 series, published
under
the
general
title Insulation
coordination
for
equipment
within
low-voltage
systems, can be found on the IEC website.
The
committee
has
decided that the contents
of
this publication will remain unchanged until
the stability
date
indicated on the IEC website
under
”http://webstore.iec.ch” in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
•
withdrawn
,
• replaced by a revised edition,
or
• amended.
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,
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