德州仪器TMP006采用超小型芯片级封装的红外热电堆传感器.pdf

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Draft Cycle 1, 04-May-2011

Reference Guide

SBOU108–May 2011

TMP006 Layout and Assembly Guidelines

A specific printed circuit board (PCB) layout is required for the TMP006, a non-contact infrared (IR)

sensor, in order for the device to achieve optimal performance when calculating object temperatures. This

document explains the theory behind the board layout as well as measurement guidelines for constructing

the PCB. Additionally, guidelines for properly assembling the TMP006 on the evaluation module PCB are

discussed.

space

e2e is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

SBOU108–May 2011 TMP006 Layout and Assembly Guidelines

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Draft Cycle 1, 04-May-2011

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Contents

1 Introduction .................................................................................................................. 3

2 System Overview ........................................................................................................... 5

3 TMP006 Layout Theory .................................................................................................... 6

4 TMP006 Layout Guidelines ................................................................................................ 8

5 TMP006 Assembly Guidelines ........................................................................................... 18

List of Figures

1 Example of Materials with Different Coefficients of Thermal Conductivity and Corresponding Reactions to

a Step Input in Temperature............................................................................................... 3

2 TMP006 Target Object Temperature Measurement Overview ....................................................... 5

3 Effects of Thermal Time Constant Mismatches Between the TMP006 and PCB Area............................ 6

4 Isolating the TMP006 from Interaction with Other Devices on the PCB ............................................. 7

5 TMP006 Two-Layer PCB Layer Stack ................................................................................... 8

6 TMP006 Two-Layer PCB: Top Layer..................................................................................... 9

7 Enlarged View of Layer 1: TMP006 Land Pattern and Copper Fill ................................................. 10

8 TMP006 Two-Layer PCB: Bottom Layer ............................................................................... 11

9 TMP006EVM PCB Layer Stack ......................................................................................... 12

10 Correlation of Two-Layer and Four-Layer TMP006 PCB Designs .................................................. 12

11 TMP006EVM Four-Layer PCB: Top Layer............................................................................. 13

12 Enlarged View of Layer 1: TMP006EVM Land Pattern and Copper Fill ........................................... 14

13 TMP006EVM Four-Layer PCB: Mid Layer 1........................................................................... 15

14 TMP006EVM Four-Layer PCB: Mid Layer 2........................................................................... 16

15 TMP006EVM Four-Layer PCB: Bottom ................................................................................ 17

16 Thermal Profile for TMP006 IR Reflow Oven.......................................................................... 18

TMP006 Layout and Assembly Guidelines SBOU108–May 2011

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0 2.5

5 7.5

10 12.5 15 17.5 20

Time (s)

Temperature ( C)°

System Temperature

Material 3

Material 2

Material 1

k > k > k

Material1 Material2 Material3

Draft Cycle 1, 04-May-2011

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Introduction

1 Introduction

1.1 Terms and Definitions

The following list summarizes many of the terms and abbreviations used in this document.

• EVM: Evaluation module. The TMP006EVM demonstrates characteristics of the TMP006 integrated

circuit.

• IR: Infrared, or radiation that occurs in the infrared wavelengths (0.7 μm to 1000 μm). The TMP006

uses IR wavelengths from 4 μm to 8 μm.

• IR sensor, Sensor: The IR sensor within the TMP006 integrated circuit device.

• k

: Coefficient of thermal conductivity of a given material. This coefficient is defined as the rate at

which heat flows through a given material. k

is measured by heating a material through transients and

then measuring the change in temperature over time. This coefficient can be understood as a thermal

time constant because it is analogous to an RC time constant in electronics. Materials with larger k

values have smaller thermal time constants and tend to settle faster with regard to changes in system

temperature than do materials with smaller values of k. Figure 1 shows an example of three materials

with different k values and the respective reaction to a step increase in system temperature.

Figure 1. Example of Materials with Different Coefficients of Thermal Conductivity and

Corresponding Reactions to a Step Input in Temperature

• k

TMP006

: Coefficient of thermal conductivity of the entire TMP006 integrated circuit.

• k

SENSOR_PCB

: Coefficient of thermal conductivity of the area of the board directly under the TMP006 IR

sensor.

• k

BOARD

: Coefficient of thermal conductivity of the entire board. See Table 1 for a list of the coefficients of

thermal conductivity for common PCB materials.

• PCB: Printed circuit board. Specifically refers to the printed circuit board that the TMP006 is mounted

on.

• Target object, Target: The object for which the TMP006 measures the temperature.

SBOU108– May 2011 TMP006 Layout and Assembly Guidelines

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