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QCC3026 DATA_SHEET

QCC3026 高通csr蓝牙音频芯片技术手册,3026用于蓝牙5.0技术,可以用做TWS耳机等产品应用
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Device description
■
Tri-core processor architecture
■
High-performance Bluetooth
®
Audio SoC
■
Low power for extended battery life
Applications
■
Qualcomm TrueWireless
™
stereo earbuds
Features
■
Qualified to Bluetooth
®
v5.0
specification
■
120 MHz Qualcomm
®
Kalimba
™
audio DSP
■
32 MHz Developer
Processor for applications
■
Firmware Processor for
system
■
Flexible QSPI flash
programmable platform
■
Advanced audio algorithms
■
High-performance 24‑bit
audio interface
■
1 or 2 mic Qualcomm
®
cVc
™
headset speech
processing
■
Serial interfaces: UART, Bit
Serializer (I²C/SPI),
USB 2.0
■
Integrated PMU: Dual
SMPS for system/digital
circuits, Integrated Li-ion
battery charger
■
15 PIOs, 5 LED pads with
PWM
■
81-ball 3.9798 x 4.0184 x
0.54 mm, 0.4 mm pitch
WLCSP
System architecture
XTAL
Ext Memory
Bluetooth
Radio
Digital
Audio
Interface
I/O
and
USB
Qualcomm
®
Kalimba™
DSP
Apps
Developer
Processor
Apps
Firmware
Processor
UART/USB
PIO
I²C/SPI
Stereo HQ
ADC
Class-D
Earphone
Speaker
Output
LED Driver
with PWM
SMPS
LDOs
Li-Ion
Charger
Line In / Dual
Analog Mic In
Earphone
Battery
LED
DigMic
I²S/PCM
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com.
Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies International, Ltd. or its affiliated companies
without the express approval of Qualcomm Configuration Management.
Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of
Qualcomm Technologies International, Ltd.
All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. All Qualcomm products mentioned herein are
products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm and Qualcomm TrueWireless are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kalimba and Kymera are
trademarks of Qualcomm Technologies International, Ltd. cVc is a trademark of Qualcomm Technologies International, Ltd., registered in the United States and
other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.
This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly
prohibited.
Qualcomm Technologies International, Ltd. (formerly known as Cambridge Silicon Radio Limited) is a company registered in England and Wales with a registered
office at: Churchill House, Cambridge Business Park, Cowley Road, Cambridge, CB4 0WZ, United Kingdom.
Registered Number: 3665875 | VAT number: GB787433096
©
2017, 2018 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.
QCC3026 WLCSP
Production Information Data Sheet
80-CF475-1 Rev. AD
June 1, 2018

General descripon
QCC3026 WLCSP is a system on-chip (SoC) with on-chip Bluetooth, audio and programmable application
processor. It includes high-performance, analog, and digital audio codecs, Class-D earphone speaker driver,
advanced power management, Li-ion battery charger, light-emitting diode (LED) drivers, and flexible interfaces
including inter-integrated circuit sound (I²S) input, inter-integrated circuit interface (I²C), universal asynchronous
receiver transmitter (UART), and programmable input/output (PIO).
An application-dedicated Developer Processor and a system Firmware Processor run code from an external quad
serial peripheral interface (QSPI) flash. Both processors have tightly coupled memory (TCM) and an on-chip cache
for performance while executing from external flash memory. The system Firmware Processor provides functions
developed by Qualcomm Technologies International, Ltd. (QTIL). The Developer processor provides flexibility to the
product designer to customize their product.
The Audio subsystem contains a programmable Kalimba core running Qualcomm
®
Kymera
™
system DSP
architecture framework from read only memory (ROM). A range of audio processing capabilities are provided from
ROM which are configurable in fully flexible audio graphs.
The flexibility provided by the programmable applications processor plus the ability to configure the audio processor
enables manufacturers to easily differentiate products with new features.
QCC3026 WLCSP is driven by a flexible, software platform with powerful integrated development environment (IDE)
support. This enables rapid time-to-market.
For more information on development tools and audio development kit (ADK)s for the QCC3026 WLCSP, including
information on Bluetooth and other features supported, see createpoint.qti.qualcomm.com.
80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
2

Ordering informaon
Device
Package
Order number
Type Size Shipment method
QCC3026 WLCSP
WLCSP 81-ball
(Pb free)
3.9798 x 4.0184 x
0.54 mm 0.4 mm
pitch
Tape and reel QCC3026-0-81WLNSP
NOTE
Your attention is drawn to QTIL’s Terms of Supply, see http://www.qualcomm.com/salesterms or please
request a copy), in particular the section covering Product Warranties & Disclaimers. Please note that
the product warranty differs for production, pre-production, and other versions.
Production status minimum order quantity is 2 kpcs.
Supply chain: QTIL's manufacturing policy is to multisource volume products. For further details,
contact your local sales account manager or representative.
QCC3026 WLCSP Development Kit ordering informaon
QTIL supplies QCC3026 WLCSP development equipment.
Description Model Order number
QCC3026 WLCSP Development Kit DK-QCC3026-WLCSP81-A-0 65-CF988-260
TRBI200 Transaction Bridge Interface High-
Speed Debug Adaptor and Programmer
DK-TRBI200-CE684-1 65-CE684-1
The QCC3026 WLCSP Development Kit, includes a flexible development board that has a wide range of
interconnects, and QCC3026 WLCSP mounted on a plug-in module.
TRBI200 is a high-speed universal serial bus (USB) to transaction bus interface that supports high-speed debug and
flash programming.
NOTE
TRBI200 use is not mandatory for flash programming or other manufacturing operations. Those actions
are performable using direct USB connection to the QCC3026 WLCSP USB device interface.
QTIL contacts
General information www.qualcomm.com
Information on this product qcsales@qti.qualcomm.com
Customer support for this product createpoint.qti.qualcomm.com
Details of compliance and standards product.compliance@qti.qualcomm.com
Help with this document document.feedback@qti.qualcomm.com
80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
3

Device details
Audio subsystem
■
32‑bit Kalimba audio digital signal processor (DSP) core
with flexible clocking from 2 MHz to 120 MHz to allow
optimization and trade-off performance vs. power
consumption
■
DSP runs from ROM
■
80 KB program random access memory (RAM)
■
256 KB data RAM
■
5 Mb ROM
Application subsystem
■
Dual core application subsystem 32 MHz operation
■
32‑bit Firmware Processor:
□
Reserved for system use
□
Runs Bluetooth upper stack, profiles, house-keeping
code
■
32‑bit Developer Processor:
□
Runs developer applications
■
Both cores execute code from external flash memory using
QSPI clocked at 32 MHz
■
On-chip caches per core allow for optimized performance
and power consumption
Bluetooth subsystem
■
Qualified to Bluetooth v5.0 specification including 2 Mbps
Bluetooth low energy (Production parts)
■
Single ended antenna connection with on-chip balun and
Tx/Rx switch
■
Bluetooth, Bluetooth low energy, and mixed topologies
supported
■
Class 1 support
Li-ion battery charger
■
Integrated battery charger supporting up to 200 mA charge
current
■
Variable float (or termination) voltage adjustable in 50 mV
steps from 3.65 V to 4.4 V
■
Thermal monitoring and management are implementable
in application software
■
Pre-charge to fast charge transition configurable at 2.5 V,
2.9 V, 3.0 V, and 3.1 V
Power management
■
Integrated power management unit (PMU) to minimize
external components
■
QCC3026 WLCSP runs directly from a Li-ion, USB, or
external supply (2.8 V to 6.5 V)
■
Auto-switching between battery and USB (or other)
charging source
■
Power islands employed to optimize power consumption
for variety of use-cases
■
Dual switch-mode power supply (SMPS):
□
Automatic mode selection to minimize power
consumption
□
1.8 V SMPS generates power for both the device and
off-chip circuits
□
Dedicated digital SMPS (output voltage changes
automatically to minimize device power consumption)
80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
4

Audio engine and digital audio interfaces
■
1 x unidirectional 24‑bit I²S input
■
Differential high efficiency Class-D earphone speaker
driver output:
□
Class-D signal-to-noise ratio (SNR): 98.3 dBA typ.
□
Class-D total harmonic distortion plus noise (THD
+N): -87.5 dB typ.
■
Dual analog inputs configurable as single ended line inputs
or, unbalanced or balanced analog microphone inputs:
□
SNR single-ended: 101 dBA typ.
□
THD+N single-ended: -85 dB typ.
■
1 microphone bias (single bias shared by the two
channels):
□
Crosstalk attenuation between two inputs using
recommended application circuit: 65 dB
■
Digital microphone inputs with capability to interface up to
6 digital microphones
■
Both analog-to-digital converter (ADC)s and the digital-to-
analog converter (DAC) support sample rates of 8, 16, 32,
44.1, 48, 96 kHz. The DAC also supports 192 kHz.
Peripherals and physical interfaces
■
A UART interface
■
2 x Bit Serializers (programmable serial peripheral
interface (SPI) and I²C hardware accelerator)
■
1 x USB interface:
□
A full speed USB (USB-FS) Device (12 Mbps)
– USB interface includes ESD protection to
IEC-61000-4-2 (device level)
■
QSPI NOR flash interface
□
QSPI encryption to protect developer code and data
□
Encryption programmable with a 128‑bit security key of
original equipment manufacturer (OEM) choice stored in
on-chip one-time programmable (OTP) memory
■
Up to 15 PIO and 5 open drain/digital input LED pads with
pulse width modulation (PWM)
Package and compliance
■
81-ball 3.9798 x 4.0184 x 0.54 mm, 0.4 mm pitch WLCSP
■
Green (restriction of hazardous substances (RoHS)
compliant and no antimony or halogenated flame
retardants)
QCC3026 WLCSP Data Sheet Device details
80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
5
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