AP6210B Datasheet
AMPAK Technology Inc. www.ampak.com.tw
Proprietary & Confidential Information
Doc. NO:
2
Contents
Contents ................................................................................................................... 2
1. Introduction ......................................................................................................... 3
2. Features ............................................................................................................... 4
3. Deliverables ........................................................................................................ 5
3.1 Deliverables .................................................................................................... 5
3.2 Regulatory certifications ................................................................................. 5
4. General Specification ......................................................................................... 6
4.1 General Specification ...................................................................................... 6
4.2 Voltages .......................................................................................................... 6
4.2.1 Absolute Maximum Ratings .................................................................... 6
4.2.2 Recommended Operating Rating ........................................................... 6
The module requires two power supplies: VBAT and VDDIO .......................... 6
5. Bluetooth Specification ...................................................................................... 7
5.1 Bluetooth Specification ................................................................................... 7
6. Pin Assignments ................................................................................................. 8
6.1 Pin Outline ...................................................................................................... 8
6.2 Pin Definition .................................................................................................. 8
7. Dimensions ....................................................................................................... 10
7.1 Physical Dimensions..................................................................................... 10
7.2 Layout Recommendation .............................................................................. 11
8. External clock reference .................................................................................. 12
9. Host Interface Timing Diagram ........................................................................ 13
9.1 Power-up Sequence Timing Diagram ........................................................... 13
10.Recommended Reflow Profile ......................................................................... 14
11. Package Information ........................................................................................ 15
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1.1Label ............................................................................................................ 15
11.2 Dimension ................................................................................................... 16
11.3 MSL Level / Storage Condition .................................................................... 18
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