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镁光emmc datasheet
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镁光 micron eMMC datasheet,MTFC4GACAAAM-1M WT MTFC8GACAAAM-1M WT MTFC16GAAAADV-2M WT
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e·MMC™ Memory
MTFC4GACAAAM-1M WT
MTFC8GACAAAM-1M WT
MTFC16GAAAADV-2M WT
Features
• MultiMediaCard (MMC) controller and NAND Flash
• 153-ball VFBGA and 169-ball VFBGA
(RoHS compliant, "green package")
• V
CC
: 2.7–3.6V
• V
CCQ
(dual voltage): 1.65–1.95V; 2.7–3.6V
• Temperature ranges
– Operating temperature: –25˚C to +85˚C
– Storage temperature: –40˚C to +85˚C
MMC-Specific Features
• JEDEC/MMC standard version 4.51-compliant
(JEDEC Standard No. 84-B451) – SPI mode not
supported 1
– Advanced 11-signal interface
– x1, x4, and x8 I/Os, selectable by host
– SDR/DDR modes up to 52 MHz clock speed
– HS200 mode
– Real-time clock
– Command classes: class 0 (basic); class 2 (block
read); class 4 (block write); class 5 (erase);
class 6 (write protection); class 7 (lock card)
– Temporary write protection
– Boot operation (high-speed boot)
– Sleep mode
– Replay-protected memory block (RPMB)
– Secure erase and secure trim
– Hardware reset signal
– Multiple partitions with enhanced attribute
– Permanent and power-on write protection
– High-priority interrupt (HPI)
Figure 1: Micron e·MMC Device
MMC controller
MMC
power
NAND Flash
power
MMC
interface
NAND Flash
MMC-Specific Features (Continued)
– Background operation
– Reliable write
– Discard and sanitize
– Extended partitioning
– Context ID
– Data TAG
– Packed commands
– Dynamic device capacity
– Backward compatible with previous MMC
– Thermal specification
– Cache
• ECC and block management implemented
Note:
1. The JEDEC specification is available at
www.jedec.org/sites/default/files/docs/
JESD84-B451.pdf.
Micron Confidential and Proprietary
4GB, 8GB, 16GB: e·MMC
Features
09005aef856cd0da
emmc_ps8210_v451_80s_153b_wt.pdf - Rev. G 06/18 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

e·MMC Performance and Current Consumption
Table 1: MLC Partition Performance
Condition
1
Typical Values
Unit4GB 8GB 16GB
Sequential write 11 24 24 MB/s
Sequential read 80 120 120 MB/s
Random write 1000 1000 1000 IOPS
Random read 4000 4000 4000 IOPS
Note:
1. Bus in x8 I/O and HS200 modes. Sequential access of 1MB chunk; random access of 4KB chunk over 1GB span.
Additional performance data, such as system performance on a specific application board, will be provided
in a separate document upon customer request.
Table 2: 52 MHz DDR2 Performance
Condition
1
Typical Values
Unit4GB 8GB 16GB
Sequential write 11 24 24 MB/s
Sequential read 75 80 80 MB/s
Random write 1000 1000 1000 IOPS
Random read 3800 3800 3800 IOPS
Note:
1. Bus in x8 I/O and 52 MHz DDR2 modes. Sequential access of 1MB chunk; random access of 4KB chunk over
1GB span. Additional performance data, such as system performance on a specific application board, will be
provided in a separate document upon customer request.
Table 3: Current Consumption
Condition
1
Typical Values (I
CC
/I
CCQ
)
Unit4GB 8GB 16GB
Write 50/20 60/20 60/20 mA
Read 60/60 60/60 60/60 mA
Sleep 0/180 0/180 0/180 uA
Auto-standby 25/150 50/180 50/180 uA
Note:
1. Bus in x8 I/O and HS200 modes. V
CC
= 3.6V and V
CCQ
= 1.95V. 25°C. Measurements done as average RMS cur-
rent consumption. I
CCQ
in READ operation might be affected by tester load.
Micron Confidential and Proprietary
4GB, 8GB, 16GB: e·MMC
Features
09005aef856cd0da
emmc_ps8210_v451_80s_153b_wt.pdf - Rev. G 06/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.

Part Numbering Information
Micron
®
e·MMC memory devices are available in different configurations and densities.
Figure 2: e·MMC Part Numbering
MT FC xx x x xx - xx
Micron Technology
Product Family
FC = NAND Flash + controller
NAND Flash Density
NAND Flash Component
Controller Revision
Production Status
Operating Temperature Range
Package Codes
Reserved
Blank
Table 4: Ordering Information
Base Part Number Density Package Shipping
MTFC4GACAAAM-1M WT 4GB 153-ball VFBGA
11.5mm x 13.0mm x 1.0mm
Tray
Tape and reel
MTFC8GACAAAM-1M WT 8GB 153-ball VFBGA
11.5mm x 13.0mm x 1.0mm
Tray
Tape and reel
MTFC16GAAAADV-2M WT 16GB 169-ball VFBGA
12.0mm x 16.0mm x 1.0mm
Tray
Tape and reel
Device Marking
Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead,
an abbreviated device mark consisting of a 5-digit alphanumeric code is used. The abbreviated device marks are
cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder.
Micron Confidential and Proprietary
4GB, 8GB, 16GB: e·MMC
Features
09005aef856cd0da
emmc_ps8210_v451_80s_153b_wt.pdf - Rev. G 06/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.

Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-
cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-
demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo-
nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-
mental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-
cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-
URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-
vironmental damages will result from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
Micron Confidential and Proprietary
4GB, 8GB, 16GB: e·MMC
Important Notes and Warnings
09005aef856cd0da
emmc_ps8210_v451_80s_153b_wt.pdf - Rev. G 06/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.

General Description
Micron e·MMC is a communication and mass data storage device that includes a Multi-
MediaCard (MMC) interface, a NAND Flash component, and a controller on an ad-
vanced 11-signal bus, which is compliant with the MMC system specification. Its low
cost, small size, Flash technology independence, and high data throughput make
e·MMC ideal for smartphones, digital cameras, PDAs, MP3s, and other portable applica-
tions.
The nonvolatile e·MMC draws no power to maintain stored data, delivers high perform-
ance across a wide range of operating temperatures, and resists shock and vibration dis-
ruption.
Micron Confidential and Proprietary
4GB, 8GB, 16GB: e·MMC
General Description
09005aef856cd0da
emmc_ps8210_v451_80s_153b_wt.pdf - Rev. G 06/18 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
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