LS1088A
QorIQ LS1088A Data Sheet
Features
• LS1088A contains eight ARM® Cortex®-A53 (32/64
bit) cores with the following capabilities:
– Speed up to 1.6 GHz
– Arranged as two clusters of four cores
– 32 KB L1 instruction cache (ECC protection) and 32
KB L1 data cache (ECC protection)
– Two 1 MB unified I/D L2 cache (ECC protection),
one per Cortex-A53 core cluster
– NEON™ SIMD coprocessor
– ARMv8 cryptography extensions
• Hierarchical interconnect fabric:
– Hardware-managed data coherency
– Up to 700 MHz operation
• One 32/64-bit DDR4 SDRAM memory controller:
– ECC and interleaving support
– Up to 2.1 GT/s
• Datapath acceleration architecture 2.0 (DPAA2)
incorporates acceleration for the following functions:
– Packet parsing, classification, and distribution
(WRIOP)
– Queue management for scheduling, packet
sequencing, and congestion management (QMan)
– Hardware buffer management for buffer allocation
and de-allocation (BMan)
– Cryptography acceleration (SEC)
– IEEE 1588 support
– Advanced I/O processor (AIOP)
• Parallel Ethernet interfaces:
– Up to two RGMII interfaces
• Eight SerDes lanes for high-speed peripheral
interfaces:
– Three PCI Express 3.0 controllers (one supporting
x4 operation)
– One serial ATA (SATA 3.0) controller supporting
6 Gbps
– Up to two SGMII supporting 2500 Mbps
– Up to four SGMII supporting 1000 Mbps
– Up to two XFI (10 GbE) interfaces
– Up to two QSGMII
– Supports 1000Base-KX
– Supports 10GBase-KR
• Additional peripheral interfaces include:
– One quad serial peripheral interface (QSPI)
controller, one serial peripheral interface (SPI)
controller
– Integrated flash controller (IFC) supporting NAND
and NOR flash with 28-bit addressing and 16-bit
data
– Two USB 3.0 controllers with integrated PHY
– Enhanced secure digital host controller supporting
SD 3.0, eMMC 4.4, and eMMC 4.5 modes
– uQE supporting TDM/HDLC
– Four I2C controllers
– Two 16550-compliant DUARTs
– General purpose IO (GPIO), four FlexTimers, and
nine watchdog timers
– Trust architecture
– Debug support with run control, data acquisition,
high-speed trace, and performance/event monitoring
• 780 FC-PBGA package, 23 mm x 23 mm, 0.8 mm
pitch
NXP Semiconductors
Document Number LS1088A
Data Sheet: Technical Data
Rev. 0, 01/2018
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
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