2 LYNX DAY/NIGHT VISION CMOS SENSOR – CONFIDENTIAL
CONTENTS
1. Sensor overview .............................................................................................................................. 5
1.1. Key features............................................................................................................................. 5
1.2. Specifications........................................................................................................................... 5
2. Sensor architecture ......................................................................................................................... 7
2.1. Pixel array ................................................................................................................................ 7
2.1.1. Row noise reduction columns .......................................................................................... 7
2.2. Timing ...................................................................................................................................... 8
2.3. Data output .............................................................................................................................. 9
2.4. Temperature sensor .............................................................................................................. 10
3. Sensor connection ......................................................................................................................... 11
3.1. Pin configuration .................................................................................................................... 11
3.2. Electrical specifications ......................................................................................................... 14
3.3. Sensor start-up ...................................................................................................................... 15
3.4. Sensor reset .......................................................................................................................... 15
4. Sensor programming ..................................................................................................................... 16
4.1. SPI write ................................................................................................................................ 16
4.2. SPI read ................................................................................................................................. 16
4.3. Register overview .................................................................................................................. 17
4.4. High dynamic range ............................................................................................................... 19
5. Sensor output ................................................................................................................................ 22
5.1. Low-level pixel timing ............................................................................................................ 22
5.2. Control channel ..................................................................................................................... 22
5.3. Pixel remapping. .................................................................................................................... 23
5.1. Training data .......................................................................................................................... 23
6. Sensor testing ................................................................................................................................ 25
6.1. Test image ............................................................................................................................. 25
6.2. Test Photodiodes ................................................................................................................... 25
6.3. Internal signals ...................................................................................................................... 26
7. Sensor package ............................................................................................................................. 27
8. Sensor handling ............................................................................................................................. 29
8.1. General handling ................................................................................................................... 29
8.1.1. ESD ............................................................................................................................... 29
8.1.2. Glass cleaning ............................................................................................................... 29
8.1.3. sensor storing ................................................................................................................ 29
8.2. Soldering ................................................................................................................................ 29
8.2.1. Soldering recommendations .......................................................................................... 29
8.2.2. Manual soldering ........................................................................................................... 29
8.2.3. Reflow soldering ............................................................................................................ 29
8.2.4. Wave soldering .............................................................................................................. 30
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