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首页MT6763参考设计芯片资料(Design_Notice)
The MT6763 with integrated Bluetooth, FM, WLAN and gps modules, is a highly integrated baseband platform incorporating both Modem and application processing subsystems to enableLTE/LTE-A and C2K smart phone applications.
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loginid=molbasic01@ginreen.com,time=2017-05-17 19:34:11,ip=116.30.193.170,doctitle=MT6763_Design_Notice_V0.1.pptx,company=Ginreen_WCX
CONFIDENTIAL B
2017/04/26
MT6763 Design Notice
V0.1

loginid=molbasic01@ginreen.com,time=2017-05-17 19:34:11,ip=116.30.193.170,doctitle=MT6763_Design_Notice_V0.1.pptx,company=Ginreen_WCX
CONFIDENTIAL B
MT6763 Design Notice Versions
▪ MT6763 baseband design notice
Category Description Date Version Remark
BB BB design notice 2017/04/25 V0.1
BB SD & eMMC design note NA NA Common
BB Camera design notice NA NA Common
BB USB design notice NA NA Common
BB LCM design notice NA NA Common
BB SIM design notice NA NA Common
BB Capacitive type touch panel design notice NA NA Common
BB G/M/ALS & PS/pressure sensor design notice NA NA Common
BB ESD design notice NA NA Common
BB Memory design notice NA NA Common
BB MHL (DPI) design notice NA NA Common
BB eFuse design notice NA NA Common
1

loginid=molbasic01@ginreen.com,time=2017-05-17 19:34:11,ip=116.30.193.170,doctitle=MT6763_Design_Notice_V0.1.pptx,company=Ginreen_WCX
CONFIDENTIAL B
MT6763 Design Notice Version History
▪ MT6763 turnkey solution design notice
Find the turnkey solution design notices on DCC.
Category Description
MT6763
MT6763 design notice
PCB layout/PDN/MMD/SMT guide
SCH and PCB design checklist
PMIC
(MT6356/RT5081)
MT6356 PMIC design notice For MT6763
RT5081 Sub-PMIC design notice
MT6356 audio & speech design notice
MT6356 RTC design notice
Connectivity
(MT6625L/MT6630)
MT6625L design notice
MT6630 combo chip design notice
RF (MT6177)
MT6177 design notice
Common
Thermal design notice
LTE phone ANT guideline
NFC design notice
2

loginid=molbasic01@ginreen.com,time=2017-05-17 19:34:11,ip=116.30.193.170,doctitle=MT6763_Design_Notice_V0.1.pptx,company=Ginreen_WCX
CONFIDENTIAL B
Change List (1)
Version Date Description
V0.01 2017.02.17 1. Initial release
V0.02 2017.02.24
1. Update description in “Platform Chipset”
2. Update description in “High-Level Spec Comparisons”
V0.03 2017.02.28
1. Update description in “Platform Chipset”
2. Update description in “High-Level Spec Comparisons”
V0.04 2017.03.10
1. Update CSI mapping table
V0.05 2017.04.19
1. Update IC size and ball map
2. Update EINT_RAMDUMP description (Reuse SYSRST_B as debug key)
3. Update external R to 12K at trapping pin
V0.06 2017.04.25
1. Update MEMS Sensor Selection Notice
V0.1 2017.04.26
1. Upload to DCC
3

loginid=molbasic01@ginreen.com,time=2017-05-17 19:34:11,ip=116.30.193.170,doctitle=MT6763_Design_Notice_V0.1.pptx,company=Ginreen_WCX
CONFIDENTIAL B
Baseband Design Notice
4
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