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首页EMV Contactless ,非接L1 EMV标准 (2007年标准)
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© 1994-2007 EMVCo, LLC (“EMVCo”). All rights reserved. Any and all uses of the EMV Specifications (“Materials”)
shall be permitted only pursuant to the terms and conditions of the license agreement between the user and EMVCo found at
http://www.emvco.com/specifications.cfm.
Page 1
Draft Specification for Comment Period
First Edition – March 2007
EMV Contactless Communication Protocol Specification
This Specification enhances the PayPass - ISO/IEC 14443 Implementation
Specification - V1.1 with a new reference equipment, the robustness of the
contactless communication against EMD, the polling and collision detection
procedures.
Please submit any comments you may have via the 'Communication' facility on the EMVCo
website at www.emvco.com by 22nd June, 2007. Please remember that any comments received are
the property of EMVCo.
Applicability
• <Not Applicable>
Related Documents
This Draft Specification should be read in conjunction with:
• PayPass - ISO/IEC 14443 Implementation Specification - V1.1, March 2006
Description
The following changes have been made to this document since the publication of Version 1.1.
• The Operating Volume has been adapted.
• The RF power and signal interface requirements are defined in terms of a new version of the
EMV Reference Equipment. Measurements and setup values are adapted accordingly.
• The maximum Type B PCD modulation index has been reduced to 14%.
• The maximum power consumption of a PICC is measured at minimum field strength.
• The Type A PCD to PICC waveform timing parameters are changed to be compliant with the
most recent draft version of ISO/IEC 14443-2 (2007-01-26).
• PICC tolerance requirements have been added for rise and fall times of the PCD to PICC
modulation waveforms.
© 1994-2007 EMVCo, LLC (“EMVCo”). All rights reserved. Any and all uses of the EMV Specifications (“Materials”)
shall be permitted only pursuant to the terms and conditions of the license agreement between the user and EMVCo found at
http://www.emvco.com/specifications.cfm.
Page 2
• The maximum load modulation amplitude is set to 80 mV for both Type A and Type B.
• A new protocol layer (sequence layer) has been introduced to clarify the link between the
analogue and digital part of the specification.
• The robustness of the contactless communication against EMD has been enhanced by means of a
deaf time for the PCD, a quiet time for the PICC and an improvement of the PCD exception
processing.
• The maximum FWT (FWT
MAX
) has been reduced to 37 ms corresponding to FWI = 7. The PCD
must support FWI up to 14.
• An SFGT for Type B may be requested by the PICC by means of the Extended ATQB.
• The PICC may use a dynamic UID/PUPI.
• The polling and collision detection procedures have been simplified. The polling procedure
allows the polling for other technologies.
• The removal procedure has been simplified. The deactivation of the PICC (by means of the
S(DESELECT) block) has been replaced with a reset of the Operating Field.
• The maximum value for the PICC for t
RESET
and t
P
are set to 5 ms. The PCD must use a value for
t
RESET
and t
P
between 5.1 ms and 10 ms.
• When the PCD sends a chain of I-blocks, then all blocks (except the last block) must have the
same length equal to FSC.
• The PICC must no longer check the block number of a received I-block.
• Requirements related to the S(DESELECT) block has been removed from the specification.
EMV
Contactless Specifications for
Payment Systems
EMV Contactless Communication
Protocol Specification
Version 2.0 (Draft)
March 2007
EMV
Contactless Specifications for
Payment Systems
EMV Contactless Communication
Protocol Specification
Version 2.0 (Draft)
March 2007
©2007 EMVCo, LLC (“EMVCo”). All rights reserved. Any and all uses of the EMV Specifications
(“Materials”) shall be permitted only pursuant to the terms and conditions of the license agreement
between the user and EMVCo found at http://www.emvco.com/specifications.cfm.
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