SX1212
ADVANCED COMMUNICATIONS & SENSING
Rev 2 – June 18th, 2009
Page 2 of 77 www.semtech.com
Table of Contents
1. General Description ................................................................... 5
1.1. Simplified Block Diagram................................................... 5
1.2. Pin Diagram ....................................................................... 6
1.3. Pin Description................................................................... 7
2. Electrical Characteristics............................................................ 8
2.1. ESD Notice ........................................................................ 8
2.2. Absolute Maximum Ratings ............................................... 8
2.3. Operating Range ............................................................... 8
2.4. Chip Specification.............................................................. 8
2.4.1. Power Consumption .................................................. 8
2.4.2. Frequency Synthesis................................................. 9
2.4.3. Transmitter ................................................................ 9
2.4.4. Receiver .................................................................. 10
2.4.5. Digital Specification................................................. 11
3. Architecture Description........................................................... 12
3.1. Power Supply Strategy .................................................... 12
3.2. Frequency Synthesis Description .................................... 13
3.2.1. Reference Oscillator................................................ 13
3.2.2. CLKOUT Output ...................................................... 13
3.2.3. PLL Architecture...................................................... 14
3.2.4. PLL Tradeoffs.......................................................... 14
3.2.5. Voltage Controlled Oscillator................................... 15
3.2.6. PLL Loop Filter ........................................................ 16
3.2.7. PLL Lock Detection Indicator .................................. 16
3.2.8. Frequency Calculation ............................................ 16
3.3. Transmitter Description ................................................... 18
3.3.1. Architecture Description .......................................... 18
3.3.2. Bit Rate Setting ....................................................... 19
3.3.3. Alternative Settings ................................................. 19
3.3.4. Fdev Setting in FSK Mode ...................................... 19
3.3.5. Fdev Setting in OOK Mode ..................................... 19
3.3.6. Interpolation Filter ................................................... 20
3.3.7. Power Amplifier ....................................................... 20
3.3.8. Common Input and Output Front-End..................... 22
3.4. Receiver Description........................................................ 23
3.4.1. Architecture ............................................................. 23
3.4.2. LNA and First Mixer ................................................ 24
3.4.3. IF Gain and Second I/Q Mixer................................. 24
3.4.4. Channel Filters ........................................................ 24
3.4.5. Channel Filters Setting in FSK Mode ...................... 25
3.4.6. Channel Filters Setting in OOK Mode ..................... 26
3.4.7. RSSI ........................................................................ 26
3.4.8. Fdev Setting in Receive Mode ................................ 28
3.4.9. FSK Demodulator.................................................... 28
3.4.10. OOK Demodulator................................................. 28
3.4.11. Bit Synchronizer .................................................... 31
3.4.12. Alternative Settings ............................................... 32
3.4.13. Data Output ........................................................... 32
4. Operating Modes...................................................................... 33
4.1. Modes of Operation ......................................................... 33
4.2. Digital Pin Configuration vs. Chip Mode .......................... 33
5. Data Processing....................................................................... 34
5.1. Overview.......................................................................... 34
5.1.1. Block Diagram......................................................... 34
5.1.2. Data Operation Modes ............................................ 34
5.2. Control Block Description ................................................ 35
5.2.1. SPI Interface ........................................................... 35
5.2.2. FIFO ........................................................................ 38
5.2.3. Sync Word Recognition........................................... 39
5.2.4. Packet Handler........................................................ 40
5.2.5. Control......................................................................40
5.3. Continuous Mode .............................................................41
5.3.1. General Description .................................................41
5.3.2. Tx Processing ..........................................................41
5.3.3. Rx Processing ..........................................................42
5.3.4. Interrupt Signals Mapping ........................................42
5.3.5. uC Connections........................................................43
5.3.6. Continuous Mode Example ......................................43
5.4. Buffered Mode ..................................................................44
5.4.1. General Description .................................................44
5.4.2. Tx Processing ..........................................................44
5.4.3. Rx Processing ..........................................................45
5.4.4. Interrupt Signals Mapping ........................................46
5.4.5. uC Connections........................................................47
5.4.6. Buffered Mode Example...........................................47
5.5. Packet Mode.....................................................................49
5.5.1. General Description .................................................49
5.5.2. Packet Format..........................................................49
5.5.3. Tx Processing ..........................................................51
5.5.4. Rx Processing ..........................................................51
5.5.5. Packet Filtering ........................................................52
5.5.6. DC-Free Data Mechanisms......................................53
5.5.7. Interrupt Signal Mapping ..........................................54
5.5.8. uC Connections........................................................55
5.5.9. Packet Mode Example .............................................56
5.5.10. Additional Information ............................................56
6. Configuration and Status Registers ..........................................58
6.1. General Description..........................................................58
6.2. Main Configuration Register - MCParam..........................58
6.3. Interrupt Configuration Parameters - IRQParam ..............60
6.4. Receiver Configuration parameters - RXParam ...............62
6.5. Sync Word Parameters - SYNCParam.............................63
6.6. Transmitter Parameters - TXParam .................................64
6.7. Oscillator Parameters - OSCParam .................................64
6.8. Packet Handling Parameters – PKTParam ......................65
7. Application Information .............................................................66
7.1. Crystal Resonator Specification .......................................66
7.2. Software for Frequency Calculation .................................66
7.2.1. GUI...........................................................................66
7.2.2. .dll for Automatic Production Bench .........................66
7.3. Switching Times and Procedures .....................................66
7.3.1. Optimized Receive Cycle .........................................67
7.3.2. Optimized Transmit Cycle ........................................68
7.3.3. Transmitter Frequency Hop Optimized Cycle ..........69
7.3.4. Receiver Frequency Hop Optimized Cycle ..............70
7.3.5. RxÆTx and TxÆRx Jump Cycles............................71
7.4. Reset of the Chip..............................................................72
7.4.1. POR .........................................................................72
7.4.2. Manual Reset ...........................................................72
7.5. Reference Design.............................................................73
7.5.1. Application Schematic..............................................73
7.5.2. PCB Layout ..............................................................73
7.5.3. Bill Of Material..........................................................74
8. Packaging Information ..............................................................75
8.1. Package Outline Drawing .................................................75
8.2. PCB Land Pattern.............................................................75
8.3. Tape & Reel Specification ................................................76
9. Revision History ........................................................................77
10. Contact Information.................................................................77
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