QSC6270 USER GUIDE

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U.S.A.

QSC6240/QSC6270 Qualcomm Single

Chip

B July 2008 Pin assignment changes throughout (ES2):

 V17 was MPP4 (LCD_DRV_N); now MPP3 (KPD_DRV_N)

 W17 was MPP3 (KPD_DRV_N); now LCD_DRV_N

 AA19 was VDD_C_NCP; now VDD_MSMC

 AA20 was VDD_GP; now VDD_NCP

 AC10 was REF_ISET; now MPP4

 AC14 was VDD_CMN; now VDD_RF1

 AC16 was VDD_RF; now VDD_RF2

The GP1 and GP2 LDOs are now connected to an internal VPH_PWR node.

RF2 SMPS. RF2 SMPS; now it is dedicated to the RF2 SMPS.

Chapter 3: Changed recommended RF matching network topologies (some Rx

and some Tx networks).

Chapter 13: Removed overvoltage protection at the USB_VBUS input within

several figures and associated text; changed the bulk capacitor value at the

Chapter 17: Note input power distribution changes listed above; Now showing the

option to power RFRX and RFTX circuits using the SMPS output VREG_RF2

 Updated the title of Figure 1-1

 Updated the low band and high band values in Section 1.2.1

 Removed Section 9.2.6: SRP and HNP

 Removed old Section 11.1.2, Clock regimes

 Changed the 2.2 µF capacitor to 4.7 µF in Table 13-1, Figure 13-2, Figure 13-4,

Figure 13-5, Figure 13-8, Figure 13-11, and throughout the text in the chapter

 Changed 14.5 to 7 V in Section 13.4

 Updated the IMAXSEL settings range in Section 13.10

 Changed pin AB9 to AC1 in Section 14.3, including the text in Figure 14-1

 Added the RC oscillator text in Section 14.4

 Removed content from Section 14.4.1

 Changed the 2.2 µH value to 4.7 µH in Section 14.4.3 and made some minor

text edits to the section

 Removed the +, -, D, G, and S from Figure 14-5 and made text edits throughout

 Changed VBUS from cable to USB_VBUS from cable in Figure 14-7

 Replaced VREG_GP2 with VREG_GP1 in Table 15-1 and changed the TBD to

 Added text to Section 15.3.5, SMPS clock

 Added text to Section 15.6, Overtemperature protection

 Added the bolded comment about placing the capacitor close to the pin in

 Updated Figure 16-8, Example power sequences

 Updated steps throughout Section 16.3 and its subsections

C

(cont.)

 Updated pins/values in Figure 17-1, Figure 17-2, Figure 17-3, Figure 17-4,

Table 17-1, and Table 17-3

Section 3.1

Removed MLC support from EBI2 NAND flash in Section 5.2

Revised Figure 5-5, Typical EBI2 application example with OneNAND™ device

Updated Section 7.1.1, CAMIF and VFE features:

 Added software-enabled auto-focus and flash details

 Removed multiple-shot operating mode

Corrected the file format entry for .mp3 in Table 7-4, Qtv capabilities summary

Added the BTS4025™ document references to Section 8.10

 Removed pin A16 (GPIO_62, BOOT_FROM_ROM)

 Removed the DO designation from the V10 (PON_RESET_N) pin type

Changed bit 19 from EBI1_NOR_BOOT_EN to RESERVED in Table 10-5,

EF_CONFIG_MSB descriptions

in the Chapter 12 introduction, Section 12.1, Section 12.12, and Section 12.16

software-controlled charging option in Section 12.1 and Section 12.12

Revised input circuits bulk capacitor details in Section 12.3

E November 2009 Moved Revision history section (this section) to start on page 2

Added new terms and acronyms to Table 1-3

Updated Figure 2-1 (QSC RF configurations at a glance)

Updated Ta bl e 2- 1 (Receiver LNA assignments) and Ta bl e 2- 3 (Transmitter driver