目 录
2 硬件特性 ....................................................................................................................... 2-1
2.1 封装与管脚分布 ............................................................................................................................ 2-1
2.1.1 封装 ...................................................................................................................................... 2-1
2.1.2 管脚分布............................................................................................................................... 2-5
2.2 管脚信息描述 ................................................................................................................................ 2-6
2.3 焊接工艺建议 ................................................................................................................................ 2-6
2.3.1 无铅回流焊工艺参数要求 ..................................................................................................... 2-6
2.3.2 混合回流焊工艺参数要求 ..................................................................................................... 2-9
2.4 潮敏参数 ..................................................................................................................................... 2-10
2.4.1 产品防潮包装 ..................................................................................................................... 2-11
2.4.2 存放与使用 ......................................................................................................................... 2-12
2.4.3 重新烘烤............................................................................................................................. 2-12
2.5 电性能参数 .................................................................................................................................. 2-13
2.5.1 功耗参数............................................................................................................................. 2-13
2.5.2 温度和热阻参数 .................................................................................................................. 2-17
2.5.3 工作条件............................................................................................................................. 2-18
2.5.4 上下电顺序 ......................................................................................................................... 2-21
2.5.5 DC/AC 电气参数 ................................................................................................................. 2-21
2.5.6 MIPI/LVDS Rx 电气参数 .................................................................................................... 2-37
2.5.7 MIPI Tx 电气参数 ................................................................................................................ 2-40
2.5.8 AUDIO CODEC 电气参数 ................................................................................................... 2-42
2.5.9 PCIe 电气参数 ................................................................................................................... 2-43
2.6 接口时序 ..................................................................................................................................... 2-43
2.6.1 DDR 接口时序 ..................................................................................................................... 2-43