QSC6240/QSC6270 Qualcomm 移动设备规格与技术数据

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"QSC6270 设备规格文档" 该文档是关于QSC6270集成电路的详细规格说明书，由Qualcomm公司提供，适用于通信和移动设备行业。QSC6270是一款高性能的芯片，可能用于2G、3G或4G通信系统，特别是CDMA2000标准的网络。文档包含保密和专有信息，仅限Qualcomm及其子公司员工在获得特定授权后才能访问和使用。 QSC6270的关键特性可能包括： 1. **处理器架构**：可能基于ARM架构，ARM是微处理器行业的标准，具有高效能和低功耗的特点，这使得QSC6270适合于移动设备。 2. **无线技术**：支持CDMA2000，这是一种用于3G蜂窝网络的标准，提供高速数据传输能力，对于移动互联网服务至关重要。 3. **多频段和多模支持**：QSC6270可能设计成能够在多个频率和网络模式下工作，确保在全球范围内的兼容性和网络覆盖。 4. **QDSP（Qualcomm Digital Signal Processor）**：这是一种专有的数字信号处理单元，可能用于执行复杂的通信算法，提高数据处理速度和效率。 5. **集成功能**：QSC6270可能集成了各种功能，如调制解调器、射频(RF)组件、电源管理单元等，旨在减少硬件复杂性和成本。 6. **出口法规**：文档提示该技术受美国和国际出口法律约束，意味着在传输或出口到其他国家时必须遵守相关的法规，防止非法扩散。 7. **知识产权声明**：Qualcomm及其他商标所有者的商标在文档中被提及，强调了知识产权的重要性。 8. **联系信息**：文档提供了Qualcomm公司的地址，如果需要更多关于QSC6270的信息或技术支持，可以联系该公司。此技术数据可能涉及到复杂的硬件和软件设计，包括电路布局、接口规范、性能指标等，对于工程师来说，这些信息是理解和开发基于QSC6270平台的产品的关键。由于文档的限制性条款，实际的详细规格和操作指南可能需要通过官方渠道获取。

80-VF846-1 Rev. L 16 Qualcomm Confidential and Proprietary

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

QSC6240/QSC6270 (Enhanced and Nonenhanced) Device Specification Contents

Figure 3-40 Auxiliary PCM mode timing (128 kHz PCM clock) . . . . . . . . . . . . . . . . . . . . . . . 136

Figure 3-41 I

C timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Figure 3-42 Camera interface timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

Figure 3-43 JTAG interface timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

Figure 3-44 Multiplexer offset and gain errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

Figure 3-45 High-level power sequences timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

Figure 4-1 QSC62x0 device marking (top view – not to scale) . . . . . . . . . . . . . . . . . . . . . . . . 223

Figure 4-2 QSC62x0 device marking (top view – not to scale) . . . . . . . . . . . . . . . . . . . . . . . . 225

Figure 4-3 Device identification code - prior to August 2010 . . . . . . . . . . . . . . . . . . . . . . . . . 227

Figure 4-4 Device identification code - after August 2010 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228

Figure 5-1 424 CSP package outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230

Figure 5-2 Carrier tape drawing with part orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231

Figure 5-3 Tape handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232

Figure 6-1 Recommended 424 CSP land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235

Figure 6-2 Recommended 424 CSP stencil pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235

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QSC6240/QSC6270 (Enhanced and Nonenhanced) Device Specification Contents

Tables

Table 1-1 Primary QSC62x0 documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 1-2 Transmitter driver amplifier assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 1-3 Receiver LNA assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 1-4 Device variants – key features with differences highlighted . . . . . . . . . . . . . . . . . . . 46

Table 1-5 Terms and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table 1-6 Special marks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Table 2-1 I/O description parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table 2-2 QSC62x0 pin assignments – listed in alphanumeric order . . . . . . . . . . . . . . . . . . . . . 54

Table 2-3 Analog/RF – RF transceiver functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Table 2-4 Analog/RF – housekeeping ADC and audio codec . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Table 2-5 Baseband – EBI1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Table 2-6 Baseband – EBI2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Table 2-7 Baseband – camera interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Table 2-8 Baseband – connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Table 2-9 Baseband – embedded trace macrocell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

Table 2-10 Baseband – general-purpose inputs and outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . 74

Table 2-11 Baseband – internal functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Table 2-12 Baseband – interfaces with other functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Table 2-13 Power management – general housekeeping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Table 2-14 Power management – interface functions (IC-level and user-level) . . . . . . . . . . . . . 82

Table 2-15 Power management – input power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Table 2-16 Power management – output voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Table 2-17 Power management – multipurpose pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Table 2-18 DC input power supply voltages (raw) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Table 2-19 DC input power supply voltages (from on-chip regulator circuits) . . . . . . . . . . . . . 87

Table 2-20 Grounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Table 2-21 No internal connection, do not connect, or reserved . . . . . . . . . . . . . . . . . . . . . . . . . 89

Table 3-1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Table 3-2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Table 3-3 Recommended voltage regulator connection scheme . . . . . . . . . . . . . . . . . . . . . . . . . 92

Table 3-4 Device thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Table 3-5 Baseband digital I/O characteristics for VDD_PX = 1.65 to 1.95 V . . . . . . . . . . . . . 93

Table 3-6 Baseband digital I/O characteristics for VDD_PX = 2.5 to 2.7 V . . . . . . . . . . . . . . . 94

Table 3-7 EBI1 DDR SDRAM interface characteristics for VDD_P1 = 1.8 V . . . . . . . . . . . . . 95

Table 3-8 Power management digital I/O characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Table 3-9 Capacitive load derating factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Table 3-10 Parameter values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Table 3-11 DDR SDRAM timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Table 3-12 DDR SDRAM memory specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Table 3-13 Precharge cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Table 3-14 Burst memory controller timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

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80-VF846-1 Rev. L 18 Qualcomm Confidential and Proprietary

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QSC6240/QSC6270 (Enhanced and Nonenhanced) Device Specification Contents

Table 3-15 Asynchronous 16-bit memory read and write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Table 3-16 EBI1 asynchronous 16-bit access timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Table 3-17 EBI timing requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Table 3-18 EBI2 asynchronous A/D MUXed access timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Table 3-19 EBI2 asynchronous bus-sized access timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Table 3-20 EBI2 LCD interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Table 3-21 LCD write with LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Table 3-22 LCD read with LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Table 3-23 LCD write without LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Table 3-24 LCD read without LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

Table 3-25 LCD bus-sized write with LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

Table 3-26 LCD bus-sized read with LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Table 3-27 LCD bus-sized write without LCD enable signal . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Table 3-28 NAND timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Table 3-29 NAND timing – AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Table 3-30 EBI2 asynchronous 16-bit access timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Table 3-31 Burst memory controller timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

Table 3-32 EBI1_M_CLK timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Table 3-33 EBI2_M_CLK timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Table 3-34 SDCC1 signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Table 3-35 SDCC2 signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Table 3-36 SPI pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Table 3-37 SPI timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Table 3-38 Primary PCM mode timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Table 3-39 Auxiliary PCM mode timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Table 3-40 I

C pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Table 3-41 I

C timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

Table 3-42 Camera interface timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

Table 3-43 JTAG interface timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

Table 3-44 Programmable GPIO configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

Table 3-45 UMTS low-band receiver performance specifications . . . . . . . . . . . . . . . . . . . . . . 141

Table 3-46 Antenna switch performance requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Table 3-47 UMTS low-band duplexer performance requirements . . . . . . . . . . . . . . . . . . . . . 144

Table 3-48 UMTS low-band Tx output filter performance requirements . . . . . . . . . . . . . . . . 147

Table 3-49 UMTS low-band power amplifier performance requirements . . . . . . . . . . . . . . . 148

Table 3-50 Detailed jammer frequency offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

Table 3-51 UMTS high-band receiver performance specifications . . . . . . . . . . . . . . . . . . . . . 150

Table 3-52 UMTS high-band duplexer performance requirements . . . . . . . . . . . . . . . . . . . . . 151

Table 3-53 UMTS high-band Tx filter performance requirements . . . . . . . . . . . . . . . . . . . . . 155

Table 3-54 UMTS high-band power amplifier performance requirements . . . . . . . . . . . . . . . 156

Table 3-55 GSM low-band receiver performance specifications . . . . . . . . . . . . . . . . . . . . . . . 158

Table 3-56 GSM low-band filter performance requirements . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Table 3-57 GSM low-band polar power amplifier performance requirements . . . . . . . . . . . . 160

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80-VF846-1 Rev. L 19 Qualcomm Confidential and Proprietary

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QSC6240/QSC6270 (Enhanced and Nonenhanced) Device Specification Contents

Table 3-58 GSM linear power amplifier performance requirements . . . . . . . . . . . . . . . . . . . . 162

Table 3-59 GSM high-band receiver performance specifications . . . . . . . . . . . . . . . . . . . . . . 165

Table 3-60 GSM high-band filter performance requirements . . . . . . . . . . . . . . . . . . . . . . . . . 166

Table 3-61 GSM high-band polar power amplifier performance requirements . . . . . . . . . . . . 168

Table 3-62 Rx LO performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

Table 3-63 UMTS low-band transmit signal path performance specifications . . . . . . . . . . . . . 170

Table 3-64 UMTS high-band transmit signal path performance specifications . . . . . . . . . . . . 171

Table 3-65 GSM low-band transmit signal path performance specifications (polar PA) . . . . . 173

Table 3-66 GSM high-band transmit signal path performance specifications . . . . . . . . . . . . . 174

Table 3-67 GSM low-band transmit signal path performance specifications (linear PA) . . . . . 175

Table 3-68 GSM high-band transmit signal path performance specifications (linear PA) . . . . 176

Table 3-69 UMTS Tx RMS power detector performance specifications . . . . . . . . . . . . . . . . . 177

Table 3-70 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

Table 3-71 Transmit path performance requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

Table 3-72 EARO output – general requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

Table 3-73 HPH output configured single-ended (HPH_L or HPH_R), ground-referenced,

capless . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Table 3-74 HPH output configured single-ended (HPH_L or HPH_R), legacy capacitor

coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

Table 3-75 LINEO output configured single-ended (LINEO_L or LINEO_R) . . . . . . . . . . . . 183

Table 3-76 LINEO output configured differential (LINEO_L and LINEO_R) . . . . . . . . . . . . 185

Table 3-77 Class D gain options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

Table 3-78 Class D differential output (SPK_OUT_P and SPK_OUT_N) . . . . . . . . . . . . . . . . 186

Table 3-79 USB single-ended output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

Table 3-80 AUX PGA gain options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 3-81 AUX PGA requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Table 3-82 Housekeeping ADC performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 190

Table 3-83 Supply detection performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192

Table 3-84 Power source for OTG type-B device performance specifications . . . . . . . . . . . . . 192

Table 3-85 External battery P-channel MOSFET specifications . . . . . . . . . . . . . . . . . . . . . . . . 193

Table 3-86 External MOSFET driver specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193

Table 3-87 Voltage regulation performance specifications (VDD or VBAT) . . . . . . . . . . . . . . 194

Table 3-88 Current regulator/monitor performance specifications . . . . . . . . . . . . . . . . . . . . . 195

Table 3-89 Coin cell charging performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195

Table 3-90 Battery voltage alarm performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . 196

Table 3-91 UVLO performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196

Table 3-92 SMPL performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197

Table 3-93 VDD collapse protection performance specifications . . . . . . . . . . . . . . . . . . . . . . . 197

Table 3-94 Voltage regulator summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198

Table 3-95 Voltage reference performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

Table 3-96 Boost converter performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

Table 3-97 Buck regulator performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

Table 3-98 Linear regulator performance specifications – 300 mA rating . . . . . . . . . . . . . . . 203

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Table 3-99 Linear regulator performance specifications – 150 mA rating . . . . . . . . . . . . . . . 204

Table 3-100 Linear regulator performance specifications – 50 mA rating . . . . . . . . . . . . . . . 206

Table 3-101 NCP regulator performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207

Table 3-102 Analog multiplexer inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208

Table 3-103 AMUX performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209

Table 3-104 TCXO controllers, buffers, and XO circuits performance specifications . . . . . . . 211

Table 3-105 19.2 MHz VCTCXO module performance specifications . . . . . . . . . . . . . . . . . . 212

Table 3-106 19.2 MHz crystal performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

Table 3-107 RC oscillator performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213

Table 3-108 32.768 kHz oscillator performance specifications . . . . . . . . . . . . . . . . . . . . . . . . 214

Table 3-109 Current driver performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216

Table 3-110 Vibration motor driver performance specifications . . . . . . . . . . . . . . . . . . . . . . . . 216

Table 3-111 Speaker driver performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217

Table 3-112 HSED_BIAS performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

Table 3-113 Poweron circuit performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219

Table 3-114 Multipurpose pin performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221

Table 4-1 Device marking line descriptions for the QSC62x0 device . . . . . . . . . . . . . . . . . . . 223

Table 4-2 Device marking line descriptions for the QSC62x0 device . . . . . . . . . . . . . . . . . . . 225

Table 4-3 S and F code combinations for devices following new part numbering scheme . . . 228

Table 6-1 Qualcomm typical SMT reflow profile conditions (for reference only) . . . . . . . . . . 236

Table 7-1 QSC62x0 CS3 reliability evaluation report for the 424 CSP device from TSMC-F12

(Dig + RF)/Chartered (PMIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238

Table 7-2 QSC62x0 CS3 reliability evaluation report for 424 CSP device from

TSMC-F14 (Dig + RF)/Chartered (PMIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240

Table 7-3 QSC62x0 CS4 reliability evaluation report for 424 CSP device from UMC

(Dig + RF)/SMIC(PMIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

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