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首页ATA/ATAPI-7 V3:2003年发布的串行接口标准与物理连接规范
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"ATA/ATAPI-7, Volume 3 (PDF) 是2003年发布的第七版ATA/ATAPI标准,该标准主要关注于主机系统与存储设备之间的接口规范,旨在为系统制造商、系统集成商、软件供应商以及智能存储设备供应商提供一个通用的连接标准。适用范围包括所有包含存储设备的处理器机箱内的主机系统。
此标准由T13委员会(美国电子工业协会信息技术体系结构委员会)制定,作为一项工作草案,其目的是将串行传输协议和物理接口标准化。它定义了在主机和存储设备之间进行通信时使用的电缆、连接器、电气和逻辑信号特性,以及通过接口传输命令、数据和状态的协议。Volume 1主要关注于设备实现标准所需的寄存器交付命令,而Volume 2则侧重于并行接口的相关内容。
值得注意的是,尽管这是一个建议性美国国家标准,但它尚未完成,可能根据T10技术委员会在公开审查期间收到的反馈进行修改。用户在使用其中提供的信息时需自行承担风险。成员机构、技术委员会及其关联任务组可在标准化活动中复制此文档,但必须保留所有版权,并且禁止任何商业或盈利性的复制或再发布。
T13技术编辑John Masiewicz来自Western Digital,位于美国加州Lake Forest,他的联系方式供查阅。此外,标准引用了ISO/IEC的国际标准编号和ANSI INCITS的美国国家标准编号,以及印刷日期为四月。
ATA/ATAPI-7 V3是现代计算机硬件架构中的关键组成部分,它确保了不同厂商生产的设备能够无缝地与主机系统集成,从而推动了存储技术的发展和互操作性。"

T13/1532D Volume 3 Revision 4b
Page viii
J.1.13.1
Legacy DMA read from target for odd word count.................................................................................280
J.1.13.2 Legacy DMA write by host to target for odd word count........................................................................281
J.1.13.3 PIO data read from the device.................................................................................................................281
J.1.13.4 PIO data write to the device ....................................................................................................................281
J.1.13.5 First Party DMA read of host memory by device....................................................................................282
J.1.13.6 First Party DMA write of host memory by device ..................................................................................282
Tables
Page
Table 1 − PACKET delivered command sets.....................................................................................................2
Table 2 − 16-bit Transfer Byte order ................................................................................................................14
Table 3 − 8-bit Transfer Byte order ..................................................................................................................14
Table 4 - Device plug connector pin definition .................................................................................................35
Table 5 - Signal integrity requirements and test procedures ...........................................................................41
Table 6 - Housing and contact electrical parameters, test procedures, and requirements .............................46
Table 7 - Mechanical test procedures and requirements.................................................................................47
Table 8 - Environmental parameters, test procedures, and requirements.......................................................48
Table 9 - Additional requirement ......................................................................................................................48
Table 10 - Connector test sequences ..............................................................................................................49
Table 11 - Physical Layer Electrical Requirements..........................................................................................62
Table 12 - Voltage / Timing Margin Definition..................................................................................................69
Table 13 - Sampling differential noise budget..................................................................................................71
Table 14 - Desired peak amplitude reduction by SSC.....................................................................................74
Table 15 − Out of band signal times ................................................................................................................76
Table 16 - Interface power states.....................................................................................................................93
Table 17 - 5b/6b coding..................................................................................................................................106
Table 18 - 3b/4b coding..................................................................................................................................106
Table 19 - Valid data characters ....................................................................................................................108
Table 20 - Valid control characters ................................................................................................................112
Table 21 - Description of primitives................................................................................................................118
Table 22 - Primitive encoding.........................................................................................................................120
Table 23 - Valid CONT Transmission Sequences .........................................................................................121
Table 24 -Latency example............................................................................................................................124
Table 25 - SRST write from host to device transmission breaking through a device to host Data FIS .........125
Table 26 - Shadow Command Block and Shadow Control Block transmission example..............................128
Table 27 - Data from host to device transmission example ...........................................................................129
Table 28 - DMA data from host to device, device terminates transmission example ....................................130
Table 29 - SCR definition ...............................................................................................................................236
Table 30 - SCR Definition...............................................................................................................................236
Table 31 - CRC and scrambler calculation example - PIO Write Command.................................................261
Table 32 - Type field values ...........................................................................................................................262
Figures
Page
Figure 1 − ATA document relationships .............................................................................................................1
Figure 2 − State diagram convention ...............................................................................................................12
Figure 3 - Byte, word and DWORD relationships.............................................................................................15
Figure 4 - Standard ATA device connectivity...................................................................................................17
Figure 5 - The serial implementation of ATA connectivity................................................................................18
Figure 6 - Communication layers .....................................................................................................................19
Figure 7 - Serial implementation connector examples.....................................................................................24
Figure 8 - Device plug connector part 1 of 2....................................................................................................26
Figure 9 - Device Plug Connector part 2 of 2..................................................................................................27
Figure 10 - Non-Latching Signal Cable receptacle connector interface dimensions .......................................28
Figure 11 - Optional Latching Signal Cable Receptacle connector interface dimensions...............................29
Figure 12 - Host plug connector interface dimension ......................................................................................30

T13/1532D Volume 3 Revision 4b
Page ix
Figure 13 - Host receptacle connector interface dimensions........................................................................... 31
Figure 14 - Non-Latching Power receptacle connector interface dimensions ................................................. 33
Figure 15 - Optional Latching Power Cable Receptacle.................................................................................. 34
Figure 16 - Connector pair blind-mate misalignment tolerance....................................................................... 36
Figure 17 - Device-backplane mating configuration ........................................................................................ 36
Figure 18 - Device plug connector location on 3.5” device.............................................................................. 37
Figure 19 - Device plug connector location on 2.5” device.............................................................................. 38
Figure 20 - Recommended host plug spacing for Non-Latching Connectors.................................................. 39
Figure 21 - Recommended host plug connector clearance & Orientation for Optional Latching Connectors. 40
Figure 22 - Signals and grounds assigned in direct connect and cabled ........................................................ 50
Figure 23 - Low transition density pattern........................................................................................................ 52
Figure 24 - Half-rate / quarter-rate high transition density pattern................................................................... 53
Figure 25 - Low frequency spectral content pattern ........................................................................................ 53
Figure 26 - Simultaneous switching outputs patterns...................................................................................... 54
Figure 27- Composite patterns ........................................................................................................................ 54
Figure 28- Compliant test patterns................................................................................................................... 57
Figure 29 - Physical plant overall block diagram ............................................................................................. 59
Figure 30 - Signal rise and fall times................................................................................................................ 66
Figure 31 - Transmit test fixture ...................................................................................................................... 67
Figure 32 - Receive test fixture ........................................................................................................................ 67
Figure 33 - Voltage / timing margin base diagram........................................................................................... 69
Figure 34 - Jitter output/tolerance mask .......................................................................................................... 70
Figure 35 - Jitter measurement example ......................................................................................................... 72
Figure 36 - Triangular frequency modulation profile........................................................................................ 73
Figure 37 - Spectral fundamental frequency comparison................................................................................ 73
Figure 38 - Out of band signals........................................................................................................................ 75
Figure 39 − Host phy initialization state machine (States HP1-HP13) ............................................................ 78
Figure 40 − Device phy initialization state machine (States DP1-DP12)......................................................... 84
Figure 41 - COMRESET sequence.................................................................................................................. 89
Figure 42 - COMINIT sequence....................................................................................................................... 91
Figure 43 - Power-on Sequence...................................................................................................................... 94
Figure 44 - On to Partial/Slumber - host initiated............................................................................................. 95
Figure 45 - ON to Partial/Slumber - device initiated ........................................................................................ 97
Figure 46 - Loopback far-end retimed............................................................................................................. 99
Figure 47 - Loopback far-end analog........................................................................................................... 100
Figure 48 - Loopback - near-end analog........................................................................................................ 101
Figure 49 - Bit designations ........................................................................................................................... 103
Figure 50 - Nomenclature reference.............................................................................................................. 103
Figure 51 - Conversion examples.................................................................................................................. 104
Figure 52 - Coding examples......................................................................................................................... 107
Figure 53 - Bit ordering and significance ....................................................................................................... 113
Figure 54 - Single bit error with two character delay ..................................................................................... 115
Figure 55 - Single bit error with one character delay..................................................................................... 115
Figure 56 - Transmission structures .............................................................................................................. 116
Figure 57 - CONT usage example ................................................................................................................. 127
Figure 58 − Link idle state diagram (States L1, LS1-LS3)............................................................................. 133
Figure 59 − Link transmit state diagram (States LT1-LT9) ............................................................................ 136
Figure 60 − Link receive state diagram (States LR1-LR9)............................................................................. 142
Figure 61 − Link power mode state diagram (States LPM1-LPM8)............................................................... 147
Figure 62 - Register - Host to Device FIS layout ........................................................................................... 152
Figure 63 - Register - Device to Host FIS layout ........................................................................................... 154
Figure 64 - Set Device Bit - Device to Host FIS layout.................................................................................. 156
Figure 65 - DMA Activate - Device to Host FIS layout................................................................................... 158
Figure 66 - First Party DMA Setup - Device to Host FIS layout..................................................................... 159
Figure 67 - BIST Activate - Bidirectional........................................................................................................ 161
Figure 68 - PIO Setup - Device to Host FIS layout ........................................................................................ 163
Figure 69 - Data - Host to Device or Device to Host FIS layout .................................................................... 165
Figure 70 − Host transport idle state diagram (States HTI1-HTI2) ................................................................ 167

T13/1532D Volume 3 Revision 4b
Page x
Figure 71 − Host transport transmit command FIS diagram (States HTCM1-HTCM2) .................................170
Figure 72 − Host transport transmit control FIS diagram (States HTCR1-HTCR2).......................................172
Figure 73 − Host transport transmit First Party DMA setup - device to host or host to device FIS (States
HTDMASTUP0-HTDMASTUP1).............................................................................................................173
Figure 74 − Host transport transmit BIST activate FIS (States HTXBIST0-HTXBIST1)................................175
Figure 75 - Host transport decompose register FIS diagram (States HTR1- HTR2).....................................176
Figure 76 − Host transport decompose Set Device Bits FIS state diagram (States HTDB0-HTDB1)...........177
Figure 77 − Host transport decompose DMA activate FIS diagram (States HTDA1-HTDA5).......................178
Figure 78 − Host transport decompose PIO setup FIS state diagram (States HTPS1-HTPS6)....................181
Figure 79 − Host transport decompose First Party DMA Setup FIS state diagram (State HTDS1) ..............184
Figure 80 − Host transport decompose BIST activate FIS state diagram (State HTRBIST0-HTRBIST1).....185
Figure 81 − Device transport idle state diagram (States DTI0-DTI1).............................................................186
Figure 82 − Device transport send register - Device to host state diagram (DTR0-DTR1) ...........................188
Figure 83 − Device transport send set device bits FIS state diagram (DTDB0-DTDB1) ...............................189
Figure 84 − Device transport transmit PIO setup - device to host FIS state diagram (States DTPIOSTUP0-
DTPIOSTUP1) ........................................................................................................................................190
Figure 85 − Device transport transmit DMA activate FIS state diagram (States DTDMAACT0-DTDMAACT1)
................................................................................................................................................................191
Figure 86 − Device transport transmit First Party DMA setup - device to host state diagram (States
DTDMASTUP0-DTDMASTUP1).............................................................................................................192
Figure 87 − Device transport transmit data - device to host FIS diagram (State DTDATAI0-DTDATAI2).....193
Figure 88 − Device transport transmit BIST activate FIS diagram (States DTXBIST0-DTXBIST1) ..............195
Figure 89 − Device transport decompose register - host to device state diagram (State DTCMD0).............196
Figure 90 − Device transport decompose data (host to device) FIS state diagram (States DTDATAO0-
DTDATAO2)............................................................................................................................................197
Figure 91 − Device transport decompose First Party DMA Setup FIS - host to device or device to host state
diagram (State DTDMASTUP0)..............................................................................................................199
Figure 92 - Device transport decompose BIST activate FIS (States (DTRBIST0-DTRBIST1)......................200
Figure 93 - Power on and COMRESET protocol (States DHR0-DHR3)........................................................202
Figure 94 - Device idle protocol (States DI0-DI7) ..........................................................................................204
Figure 95 - Software reset protocol (States DSR0-DSR3).............................................................................208
Figure 96 - EXECUTE DEVICE DIAGNOSTIC command protocol (States DEDD0-DEDD2).......................210
Figure 97 - DEVICE RESET command protocol (States DDR0-DDR1) ........................................................211
Figure 98 - Non-data command protocol (States DND0-DND1)....................................................................212
Figure 99 - PIO data-in command protocol (States DPIOI0-DPIOI3) ............................................................213
Figure 100 - PIO data-out command protocol (States DPIOO0-DPIOO3) ....................................................215
Figure 101 - DMA data-in command protocol (States DDMAI0-DDMAI1).....................................................217
Figure 102 - DMA data-out command protocol (States DDMAO0-DDMAO3)...............................................219
Figure 103 - PACKET command protocol (States DP0-DP16)......................................................................221
Figure 104 - READ DMA QUEUED command protocol (States DDMAQI0-DDMAQI4)................................226
Figure 105 - WRITE DMA QUEUED command protocol (DDMAOQ0-DDMAQO5)......................................228
Figure 106 − Host adapter state diagram (States HA0-HA2).........................................................................231
Figure 107 - Error handling architecture ........................................................................................................241
Figure 108 - Cable construction example ......................................................................................................263
Figure 109 - Jitter as a function of frequency.................................................................................................265
Figure 110 - Sampling bit error rate formulas ................................................................................................266
Figure 111 - Transmitter examples ................................................................................................................267
Figure 112 - OOB signal detector ..................................................................................................................269
Figure 113 - Squelch detector........................................................................................................................270

T13/1532D Volume 3 Revision 4b
Page xi
Foreword
(This foreword is not part of this standard.)
Requests for interpretation, suggestions for improvement and addenda, or defect reports are welcome.
They should be sent to the INCITS Secretariat, ITI, 1250 Eye Street, NW, Suite 200, Washington, DC
20005-3922.
This standard was processed and approved for submittal to ANSI by InterNational Committee for
Information Technology Standards (INCITS). Committee approval of this standard does not necessarily
imply that all committee members voted for approval. At the time it approved this standard, INCITS had the
following members:
Karen Higginbottom, Chair
David Michael, Vice-chair
Monica Vago, Secretary
Technical Committee T13 on ATA Interfaces, that reviewed this standard, had the following members and
additional participants:
Dan Colgrove, Chairman
Jim Hatfield, Vice-Chairman
Mark Overby, Secretary
Andre Hedrick
Arie Krantz
Ben Chang
Bob Davis
Conrad Maxwell
Craig Carlson
Curtis Stevens
Dan Colegrove
Darrin Bulik
Davis, Bob
Glenn Lott
Greg Elkins
Hale Landis
Hiroshi Suzuki
Jim Hatfield
Joe Breher
Joe Chen
John Masiewicz
John Schadegg
Justin Heindel
Kanting Tsai
Karen Zelenko
Kenneth Hirata
Knut Grimsrud
Lance Flake
Larrie Carr
Larry Barras
Marc Noblitt
Mark Evans
Mark Hartney
Mark Jackson
Mark Menz
Mark Overby
Matt Rooke
Michael Eschmann
Mukesh Kataria
Nathan Obr
Paul Tran
Pete McLean
Phil Gardner
Raymond Liu
Robert Elliott
Robert Strong
Ron Roberts
Ronald Rueckert
Ryosuke Shimizu
Shoji Fuchigami
Stefan Thurnhofer
Stephen Cumpson
Stephen Finch
Steve Livacaari
Steven Fairchild
Strong, Robert
Sumit Puri
Tasuku Kasebayashi
Tim Bradshaw
Tim Thompson
Tom Barrett
Tony Goodfellow
Tony Priborsky

T13/1532D Volume 3 Revision 4b
Page xii
Introduction
This standard encompasses the following:
Volume 1
Clause 1 describes the scope.
Clause 2 provides normative references for the entire standard.
Clause 3 provides definitions, abbreviations, and conventions used within the entire
standard.
Clause 4 describes the general operating requirements of the command layer.
Clause 5 describes the I/O registers.
Clause 6 contains descriptions of the commands.
Clauses 7 through 12 point to the material in Volume 2.
Clauses 13 through 19 point to material in Volume 3.
Volume 2
Clause 1 describes the scope.
Clause 2 provides normative references for the entire standard.
Clause 3 provides definitions, abbreviations, and conventions used within the entire
standard.
Clauses 4, 5, and 6 point to the material in Volume 1.
Clause 7 contains the electrical and mechanical characteristics.
Clause 8 contains the signal descriptions.
Clause 9 describes the general operating requirements of the physical, data link, and
transport layers.
Clause 10 contains describes register addressing.
Clause 11 contains the transport protocols.
Clause 12 contains the interface timing diagrams.
Clauses 13 through 19 point to material in Volume 3.
Volume 3
Clause 1 describes the scope.
Clause 2 provides normative references for the entire standard.
Clause 3 provides definitions, abbreviations, and conventions used within the entire
standard.
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