"TI-TUSB551.pdf产品目录及样本资料"
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The TI-TUSB551.pdf is a product datasheet provided by Texas Instruments for the TUSB551 USB 3.0 to DisplayPort alternate mode converter. This device is designed to allow USB 3.0 devices to connect to DisplayPort monitors or projectors with resolutions up to 4K. The datasheet includes detailed technical specifications, features, and application information for the TUSB551.
The TUSB551.pdf datasheet provides information on the various features of the TUSB551, including its USB 3.0 SuperSpeed operation, DisplayPort video output, HDCP content protection support, and integrated flash memory for device configuration. The datasheet also includes detailed electrical specifications, pinout diagrams, and layout guidelines for designing with the TUSB551.
In addition to technical specifications, the datasheet also provides application information and examples for using the TUSB551 in various USB to DisplayPort conversion applications. This includes information on configuring the TUSB551 using the provided flash memory, connecting USB devices to DisplayPort monitors, and implementing HDCP content protection in the system.
Overall, the TI-TUSB551.pdf datasheet is a comprehensive resource for engineers and system designers looking to integrate USB 3.0 to DisplayPort conversion capabilities into their products. With detailed technical specifications, features, and application information, the TUSB551 datasheet provides all the necessary information for designing with this versatile converter.
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
7.5 Power Supply Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Link in U0 with SuperSpeed data
71.65
transmission; OS = Low; DE = Low
I
CC-ACTIVE
Average active current mA
Link in U0 with SuperSpeed data
transmission; OS = Floating; DE = 82.35
Low
Link has some activity, not in U1;
I
CC-IDLE
Average current in idle state 35 mA
OS = Low
I
CC-U2U3
Average current in U2/U3 Link in U2 or U3 12.20 mA
No SuperSpeed device is connected
I
CC-NC
Average current with no connection 4.3 mA
to TXP/TXN
7.6 DC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
3-State CMOS Inputs (EQ, DE)
V
IH
High-level input voltage V
CC
* 0.8 V
V
IM
Mid-level input voltage V
CC
/ 2 V
V
IL
Low-level input voltage V
CC
* 0.2 V
V
F
Floating voltage V
IN
= High impedance V
CC
/ 2 V
R
PU
Internal pull-up resistance 105 kΩ
R
PD
Internal pull-down resistance 105 kΩ
I
IH
High-level input current V
IN
= 1.98V 26 µA
I
IL
Low-level input current V
IN
= GND –26 µA
2-State CMOS Inputs (OS)
V
IL
Low-level input voltage V
CC
* 0.8 V
V
IM
Mid-level input voltage V
CC
/2 V
V
F
Floating voltage V
IN
= High Impedance V
CC
/2 V
R
PD
Internal pull-down resistance 105 Ω
I
IM
Mid-level input current 26 µA
I
IL
Low-level input current V
IN
= GND -26 µA
7.7 AC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Differential Receiver (RXP, RXN)
V
CM-RX
Common-mode voltage bias in the
0 V
receiver (DC)
Present after a SuperSpeed device
Z
RX-DIFF
Differential input impedance (DC) 72 91 120 Ω
is detected on TXP/TXN
Common-mode input impedance Present after a SuperSpeed device
Z
RX-CM
18 24 30 Ω
(DC) is detected on TXP/TXN
Present when no SuperSpeed
Z
RX-HIGH-
Common-mode input impedance device is detected on TXP/TXN.
25 150 kΩ
IMP-DC-POS
with termination disabled (DC) Measured over the range of 0-
500mV with respect to GND.
V
RX-LFPS-
Low Frequency Periodic Signaling Below the minimum is squelched.
100 300 mVpp
DET-DIFF-PP
(LFPS) detect threshold
C
RX
RX input capacitance to GND At 2.5GHz 400 fF
Copyright © 2014, Texas Instruments Incorporated 5
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