开放计算项目：数据中心安全控制模块规范

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"open compute, DC-SCM, IO聚合, lattice, IO aggregation" 在IT行业中，Open Compute项目是一个由Facebook发起的开源硬件倡议，旨在推动数据中心基础设施的创新和效率提升。该项目鼓励分享和实施高效、可扩展的数据中心设计，以降低运营成本并提高能源效率。"DC-SCM"（Datacenter Secure Control Module）是Open Compute项目中的一个重要组成部分，它涉及到数据 center 的安全控制模块，主要关注如何在大规模数据中心环境中实现更安全、可控的硬件管理。 DC-SCM规格文档是由微软、谷歌等公司的一些高级硬件工程师和服务器架构师共同编写的。该文档的版本历史显示，它经历了多次修订和完善，以确保与业界反馈和标准保持同步。例如，从0.8版到1.0版，文档进行了多项改进，包括功能的调整、图示的更新以及术语的澄清等。 "IO聚合"（IO Aggregation）是DC-SCM中的一个关键概念，它涉及如何集中管理数据中心内的输入/输出接口，以优化信号传输、减少布线复杂性并提高系统性能。通过IO聚合，可以实现更高效的数据传输和管理，同时降低了硬件的复杂性和维护成本。 "Lattice"在此可能指的是集成电路布局，即如何在硬件层面优化元件的排列，以实现更好的信号路径、更低的功耗和更高的运算速度。在数据中心规模的应用中，这种布局优化对于提高系统的整体效率至关重要。标签中的"gpio"（General-Purpose Input/Output）是指一种通用的数字接口，允许微控制器或其他数字逻辑电路控制设备或被设备控制。在DC-SCM中，GPIO可能用于实现硬件控制模块与各种外部设备间的通信，如传感器、开关或驱动器。 Open Compute项目通过DC-SCM规范推动了数据中心控制层面的创新，其中IO聚合和Lattice技术的应用提升了硬件性能和能效。同时，GPIO作为灵活的接口，为硬件交互提供了便利。这些技术和标准的开放共享，对促进整个行业的进步和标准化起到了积极作用。

Open Compute Project • DC-SCM Specification

http://opencompute.org 5

1 Overview

This specification provides details for the design features needed to create a Datacenter-ready Secure

Control Module (DC-SCM) with a standardized Datacenter-ready Secure Control Interface (DC-SCI). It

moves common server management, security, and control features from a typical processor

motherboard architecture onto a smaller common form factor module. This module contains all the FW

states previously housed on a typical processor motherboard. This provides benefits to both the user

and developer.

From a Data Center perspective, this enables a common management and security to be deployed

across a higher percentage of platforms. It also enables deployment of management and security

upgrades on platforms within a generation without redesign of more complex components.

From a Development perspective, this enables a solution provider to remove customer specific solutions

from the more complex components (such as motherboards). This enables greater leverage of higher

complexity components across platforms.

For the purposes of this specification, to clarify terminology, we introduce the following module

definitions:

• HPM – Host Processor Module. This refers to any processing module to be managed by a SCM.

In simplest terms, this is similar to today’s motherboard with BMC and Security circuitry

removed. However, this is not limited to standard processor architecture and can apply to any

architecture utilizing management and security features.

• HPM FPGA – Host Processor Module FPGA. This refers to a programmable device on the HPM.

Main functions include system power/reset control as well as serializing/de-serializing several

IOs between the HPM and BMC.

• DC-SCM – The Datacenter-ready Secure Control Module. The DC-SCM is designed to interface to

an HPM to enable a common management and security infrastructure across platforms within a

data center.

• DC-SCI – The Datacenter-ready Secure Control Interface refers to the connector interface

between the DC-SCM and the HPM.

A typical DC-SCM design enables the design and deployment of Host Processing Module (HPM) complex

to become a simpler exercise with increased efficiency for time to market deployment. With a

standardized DC-SCI pinout and definition, it can be used as a vehicle to drive common boot,

monitoring, control, and remote debug for diverse platforms.

This specification considers three form factors for DC-SCM.

• Horizontal Form Factor – This form factor is intended for use in servers where the DC-SCM is

installed in a coplanar fashion, at the front of the server with direct interface to the front server

6 March 11

, 2021

bezel, or at the rear of the server. When installed at the front, standard front panel interfaces

are contained on the DC-SCM and do not require cables.

• Vertical Form Factor – This form factor is intended for use in 2RU or taller servers in which the

DC-SCM is installed vertically at the front panel (similar to a PCIe Card). Standard front panel

interfaces are contained on the DC-SCM and do not require cables.

• Internal Form Factor – This form factor is intended for use in servers in which the DC-SCM is

embedded internally to the server without direct interface to a front server bezel. In this

application, external interfaces such as fan control and front panel require cabled interconnects.

The DC-SCI is intended to support all form factors of DC-SCM. However, many of the block diagrams and

descriptions contained in this specification are based on the Horizontal Form Factor and Vertical Form

Factor solutions and may not demonstrate the cabling requirements of the Internal Form Factor. Later

specifications may better address this.

1.1 DC-SCM Architecture

For the purposes of this specification, the DC-SCM architecture is assumed to consist of the following

primary elements:

• BMC – The Baseboard Management Controller is a specialized service processor that monitors

the physical state of server.

• BMC Flash – One or more (typically two) flash devices used to contain the BMC firmware image.

• BIOS Flash – One or more (typically two) flash devices used to contain the BIOS firmware image.

• DC-SCM CPLD – A programmable logic device that contains the Serial GPIO logic and any

required additional application specific logic.

• RoT Security Processor – An optional security processor responsible for attesting the BMC, BIOS

and/or other firmware images on the system.

• TPM – Trusted Platform Module – A dedicated microcontroller designed to secure hardware

through integrated cryptographic keys.

An example block diagram demonstrating the typical architectural building blocks of a DC-SCM is shown

in Figure 1.

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