• SIMPLE algorithm for pressure-velocity coupling
•
Solver under-relaxation
• Live monitoring of solution data
Results
• Visualization of geometry, mesh, and solution data
• Access to solution data through plane sections that are positioned and oriented based on the engine
geometry
• Plots for characteristics of the in-cylinder flow, such as swirl, x-tumble, and y-tumble
Electronics Cooling
The Electronics Cooling Toolset provides a dedicated interface within Simcenter STAR-CCM+ for thermal
management simulation of electronics devices.
Geometry
• Geometry generation that is based on simple shape templates
• Import of IDF (Intermediate Data Format) files
• Import of CAD models from other CAD packages
• Transfer of CAD data from the Simcenter STAR-CCM+ CAD modeler
Physics
• Time: Steady-state calculations
• Solution domains: multi-domain (fluid and solid)
• Heat transfer modes: conduction, convection (forced and buoyancy driven), and radiation (wavelength
independent Surface-to-Surface (S2S) radiative heat transfer)
• Flow regime: laminar or turbulent (Realizable K-Epsilon Two-Layer All Y+)
• Equation of state: constant density or ideal gas
Conditions
• Environment: ambient boundary conditions
• Thermal specification: specification of material or specification of layers (PCB)
• Compact thermal models: resistor networks for chips
• Heat dissipation: volumetric heat sources
Mesh
• Volume Mesh: Trimmed cell mesher generates predominantly hexahedral cells
• Prism Layers: prismatic cells on walls for boundary flow accuracy
• Cell size: automatic calculation of target and minimum cell size that is based on overall model size
• Mesh Refinement: integrated features for mesh refinement to detect and capture complex geometries
• Local mesh controls: cell size customization on surfaces and within volumetric zones
Solver
• Segregated solver for flow and energy
• Solver under-relaxation
Simcenter STAR-CCM+ v13.06 | Product Overview
Siemens PLM Software 16