手机产品跌落分析与优化设计—基于ANSYS仿真技术的研究

Abstract: With the widespread use of electronic products such as smartphones, structural damage often occurs during transportation and use, with most of the damage caused by falls and impacts. The resistance to compression, drop, and impact of electronic products such as smartphones is a key design factor that designers must consider. In the past, these performance factors were mainly analyzed through physical compression and drop experiments. However, these experiments have drawbacks such as short duration, difficulty in control, and high experimental costs. More importantly, physical experiments can only be conducted after the product is manufactured, which limits their usefulness in guiding the design process. Physical drop testing methods are increasingly unable to meet the requirements of rapid product development, while computer simulations can effectively address these issues. This research project utilizes Pro/E and ANSYS tools to simulate the compression and drop of smartphones. Deformation and stress maps of different parts of the smartphone under compression and different drop scenarios are obtained, providing valuable insights for design improvements and packaging measures for transportation. The use of finite element analysis, smartphone modeling, drop simulation, and ANSYS software in this study contributes to a better understanding of the impact of drops on smartphones and offers guidance for design optimization and packaging strategies. Keywords: Finite Element Analysis; Smartphone Modeling; Drop Simulation; ANSYS.