![](https://csdnimg.cn/release/download_crawler_static/88052645/bg14.jpg)
System board
installed
Heat sink
installed
Important information
System board
with large lift
handle or system
board with small
lift handle
Small size heat
sink
For server models installed with Intel Xeon 6144, 6146, 6154, 6240C, 6240Y,
6242R, 6244, 6246, 6246R, 6248R, 6252N, 6254, 6258R, 8168, 8171M,
8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M processors, the
following parts are not supported:
• Front backplane and front hot-swap SAS/SATA/NVMe drives
• Rear hot-swap drive assembly
• RAID super capacitor module on the bottom of the air baffle
• NVMe PCIe flash adapter
• GPU
System board
with small lift
handle
Large size heat
sink
• For server models installed with large size heat sink, the air baffle and the
RAID super capacitor module on the bottom of the air baffle are not
supported.
• For server models installed with Intel Xeon 6144, 6146, 6244, 6246,
6252N, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M
processors, ensure that the following configuration requirements are met:
– The backplane for ten 2.5-inch NVMe drives is not installed.
– No system fan is failed.
– Rear hot-swap drive assembly is not installed.
– NVMe PCIe flash adapter is not installed.
– GPU is not installed.
• For server models installed with the backplane for ten 2.5-inch SAS/
SATA/NVMe drives, Intel Xeon 6154, 6240C, 6240Y, 6242R, 6246R,
6248R, 6254, and 6258R, processor is supported with the condition that
the following configuration requirements are met:
– No system fan is failed.
– Only four SAS/SATA/NVMe drives are installed in drive bays 6–9.
– Rear hot-swap drive assembly is not installed.
– NVMe PCIe flash adapter is not installed.
– GPU is not installed.
Figure 6. Front view of server models installed with Intel Xeon 6154, 6254
and 6240Y processor
Particulate contamination
Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or temperature might pose a risk to the
device that is described in this document.
Risks that are posed by the presence of excessive particulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
specification sets forth limits for particulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives and gaseous
contaminant transfer. In the absence of specific limits that are set forth in this document, you must
implement practices that maintain particulate and gas levels that are consistent with the protection of human
health and safety. If Lenovo determines that the levels of particulates or gases in your environment have
caused damage to the device, Lenovo may condition provision of repair or replacement of devices or parts
on implementation of appropriate remedial measures to mitigate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.
12
ThinkSystem SR630 Maintenance Manual