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首页SAE EIA4900:超越规格:半导体设备在非标准温度下的使用指南
SAE EIA4900:超越规格:半导体设备在非标准温度下的使用指南
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SAE EIA4900:2001 是一份由美国汽车工程师学会(SAE)发布的专业标准,针对在制造商推荐的温度范围之外使用半导体器件的情况提供指导。这份55页的完整英文版文档旨在推动技术与工程科学的进步,为设备设计者和制造商处理此类非典型应用提供规范。它强调,报告的使用是自愿的,使用者应对报告的适用性和由此产生的任何专利侵权问题负全责。 标准规定了在极端温度条件下(超出设备正常工作范围)如何确保半导体器件的可靠性和性能,包括但不限于温度稳定性、热管理策略以及可能需要进行的额外测试。它涵盖了对材料特性、设计考虑、封装技术以及操作条件的详细评估,以帮助工程师评估设备在非标准环境中的行为和预期寿命。 SAE每五年会对这份技术报告进行一次审查,可能会对其进行修订、确认、稳定或取消,以适应新的科技发展。用户被鼓励提供书面意见和建议,以便持续改进标准的适用性。 版权方面,所有内容受SAE国际保护,未经书面许可,禁止任何形式的复制、存储、检索或传输,无论是电子的、机械的、影印还是录音等。对于想要获取文档的读者,可以通过拨打美国国内或加拿大的电话、国际长途或者发送电子邮件至客户服务部门,亦可通过SAE的官方网站进行在线订购。 SAE EIA4900:2001 是一个重要的参考资源,对于那些在严苛温度条件下使用半导体器件,如航空航天、汽车电子、数据中心等领域的设计师和制造商来说,提供了关键的工程实践指南,确保设备能在超出常规应用范围的环境下安全、有效运行。
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EIA-4900
1
Introduction
Traditionally, industries that produce electronic equipment for rugged applications have
relied on the military specification system for semiconductor device standards; and upon
manufacturers of military-specified devices as device sources. This assured the availability
of semiconductor devices specified to operate over the temperature ranges required for
electronic equipment in rugged applications. Many device manufacturers have exited the
military market in recent years, resulting in decreased availability of devices specified to
operate over wide temperature ranges. Following are some typical temperature ranges at
which devices are marketed:
Military:
-55
°
C to +125
°
C
Automotive:
-40
°
C to +125
°
C
Industrial:
-40°C to +85°C
Commercial:
0
°
C to +70
°
C
If there are no reasonable or practical alternatives, then a potential response is for equipment
manufacturers to use devices in temperature ranges that are wider than those specified by the
device manufacturer. If properly documented and controlled, this practice may be used by
electronic equipment manufacturers to meet the design goals of their equipment.
This document prescribes practices and procedures to select semiconductor devices; to assess
their capability to operate; and to assure their intended quality in the wider temperature
ranges. It also prescribes the documentation of such usage. The intent of this document is to
describe processes for thermal uprating only.
1. Scope
This document prescribes processes for using semiconductor devices in wider temperature
ranges than those specified by the device manufacturer. It applies to any designer or
manufacturer of equipment intended to operate under conditions that require semiconductor
devices to function in temperature ranges beyond those for which the devices are marketed.
This document is intended for applications in which only the performance of the device is an
issue. Even though the device is used at wider temperatures, the wider temperatures will be
limited to those that do not compromise the system performance or application-specific
reliability of the device in the application. Specifically, this document is not intended for
applications that require the device to function at an operating or environmental stress level
that significantly increases the risk of catastrophic device failure, loss of equipment function,
or unstable operation of the device.
The use of devices outside the parameters specified by the device manufacturer is
discouraged; however, such usage may occur if other options prove to be impossible,
unreasonable, or impractical.
Note: Alternate means of thermal uprating may have been performed prior to the
implementation of this document by the equipment manufacturer. Rationale for decisions
made may have been valid considering the application, semiconductor market conditions,
experience with the particular component manufacturer, etc. at the times these decisions
were made. Field performance using these methods also may validate their use, however,
EIA-4900
2
their continued use must take into account the risk of changes to the subject devices such
as feature size reductions, material changes, etc.
2. References
2.1 Normative References
Not applicable
.
2.2 Informative References
EIA Standard EIA-4899, Standard for Preparing an Electronic Components Management
Plan
IEC 60134 Rating Systems for Electronic Tubes and Valves and Analogous
Semiconductor Devices (1st Edition, 1961)
3. Terms and Definitions
Note: The terms
uprating
and
thermal uprating
are being used increasingly in avionics
industry discussions and meetings, and clear definitions are included in this clause. They
were coined as shorthand references to a special case of methods commonly used in
selecting components for circuit design. This document describes the methods and
processes for implementing this special case. All of the elements of these processes
employ existing, commonly used engineering practices. No new or unique engineering
knowledge is required to follow these processes: only a rigorous application of the overall
approach.
The following terms and definitions are used herein and/or should be used when using
devices outside the manufacturers' specified temperature ranges:
3.1 absolute maximum ratings:
are limiting values of operating and environmental
conditions applicable to any semiconductor device of a specific type as defined by its
published data, which should not be exceeded under the worst possible conditions. These
values are chosen by the device manufacturer to provide acceptable serviceability of the
device, taking no responsibility for equipment variations, and the effects of changes in
operating conditions due to variations in the characteristics of the device under consideration
and all other electronic devices in the equipment. (From IEC 134, 1st Edition 1961).
3.2 ambient temperature:
is the temperature of the environment in which a
semiconductor device is operating.
3.3 case temperature:
is the temperature of the surface of a semiconductor device
package during operation.
3.4 Circuit Element Functional Mode Analysis:
A documented analysis that
determines minimums, ranges and maximums of all functional characteristics of the assembly
with respect to the related functional parameters of devices being uprated.
3.5 device capability assessment:
is the process of demonstrating that the device design
is capable of providing the specified functionality, over the wider temperature range, for the
required length of time. It assumes that the device has been qualified to operate within its
specified temperature range, and includes additional testing or analysis to evaluate expected
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