"TI-MSP430FE427.pdf 数据手册及产品样本"

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通过阅读TI-MSP430FE427.pdf，我们可以了解到该产品是一款高性能微控制器，属于Texas Instruments（TI）公司的MSP430系列。该系列是一种低功耗、高性能的16位超低功耗MCU，适用于各种应用，例如智能电网、消费电子产品以及医疗器械等。 TI-MSP430FE427.pdf提供了该产品的详细技术规格和功能介绍。首先，该微控制器采用了16位的RISC体系结构，在低频操作下具有出色的性能和低功耗。它内置了16KB的闪存和256字节的RAM，可以存储大量的程序代码和数据。此外，该微控制器还支持多种外设接口，如UART、SPI和I2C等，方便与其他设备进行通信。 TI-MSP430FE427.pdf还详细介绍了该产品的功耗特性。该微控制器通过优化电源管理技术，实现了低功耗运行。在最低功耗模式下，仅需几个微安的电流就可以维持系统运行，大大延长了电池寿命。这使得TI-MSP430FE427在无线传感器网络、移动设备等对电池寿命要求高的应用场景中具有很大的优势。此外，TI-MSP430FE427.pdf还介绍了该产品的可靠性和安全性。该微控制器采用了机械、热和电气等多种保护机制，确保了系统在各种恶劣环境下的可靠性。同时，它还支持硬件加密和运行时编译，保护了应用程序的安全性，防止被非法攻击和篡改。 TI-MSP430FE427.pdf提供了该产品的开发工具和支持资源。TI公司提供了一整套的软件开发工具包，包括IDE、编译器和调试器等，方便开发人员进行软件开发和调试。此外，TI还提供了丰富的技术资料和应用案例，帮助开发者快速上手和解决问题。总体而言，TI-MSP430FE427是一款高性能、低功耗、可靠安全的16位微控制器。该产品适用于各种应用，可以满足物联网、智能家居、工业自动化等多个领域的需求。TI公司提供了全面的技术支持和资源，帮助开发者快速开发应用，提高产品竞争力。

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Frequency

1.8 V 3.6 V

2.7 V 3 V

4.15 MHz

8.4 MHz

V − Supply Voltage − V

f − Maximum Processor Frequency − MHz

System

Supply voltage range with

ESP430 or SD16 enabled and during

programming of the flash memory

Supply voltage range

during program execution

6 MHz

MSP430FE427, MSP430FE425, MSP430FE423

www.ti.com

SLAS396D –JULY 2003–REVISED NOVEMBER 2016

Submit Documentation Feedback

Product Folder Links: MSP430FE427 MSP430FE425 MSP430FE423

Figure 5-1. Frequency vs Supply Voltage

(1) All inputs are tied to 0 V or V

. Outputs do not source or sink any current. The current consumption in LPM2, LPM3, and LPM4 are

measured with active Basic Timer1 and LCD (ACLK selected). The current consumption of the ESP430CE1 and the SVS module are

specified in their respective sections. LPMx currents measured with WDT+ disabled. The currents are characterized with a KDS

Daishinku DT−38 (6 pF) crystal.

(2) Current consumption for brownout is included.

5.4 Supply Current Into AV

and DV

Excluding External Current

(1)

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER T

MIN TYP MAX UNIT

(AM)

Active mode (AM)

(MCLK)

= f

(SMCLK)

= f

(DCO)

= 1 MHz,

(ACLK)

= 32768 Hz, XTS_FLL = 0,

program executes in flash

–40°C to 85°C 3 V 400 500 µA

(LPM0)

Low-power mode 0 or 1 (LPM0 or LPM1)

(2)

(MCLK)

= f

(SMCLK)

= f

(DCO)

= 1 MHz,

(ACLK)

= 32768 Hz, XTS_FLL = 0,

FN_8 = FN_4 = FN_3 = FN_2 = 0

–40°C to 85°C 3 V 130 150 µA

(LPM2)

Low-power mode 2 (LPM2)

(2)

–40°C to 85°C 3 V 10 22 µA

(LPM3)

Low-power mode 3 (LPM3)

(2)

–40°C

3 V

1.5 2.0

µA

25°C 1.6 2.1

60°C 1.7 2.2

85°C 2.0 3.5

(LPM4)

Low-power mode 4 (LPM4)

(2)

–40°C

3 V

0.1 0.5

µA25°C 0.1 0.5

85°C 0.8 2.5

Current consumption of active mode versus system frequency:

(AM)

= I

(AM)

[1 MHz] × f

(System)

[MHz]

Current consumption of active mode versus supply voltage:

(AM)

= I

(AM)

[3 V] + 170 µA/V × (V

– 3 V)

MSP430FE427, MSP430FE425, MSP430FE423

SLAS396D –JULY 2003–REVISED NOVEMBER 2016

www.ti.com

Submit Documentation Feedback

Product Folder Links: MSP430FE427 MSP430FE425 MSP430FE423

(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

5.5 Thermal Resistance Characteristics, PM Package (LQFP64)

PARAMETER VALUE UNIT

Rθ

Junction-to-ambient thermal resistance, still air

(1)

55.7 °C/W

Rθ

JC(TOP)

Junction-to-case (top) thermal resistance

(2)

16.7 °C/W

Rθ

Junction-to-board thermal resistance

(3)

27.1 °C/W

Junction-to-board thermal characterization parameter 26.8 °C/W

Junction-to-top thermal characterization parameter 0.8 °C/W

5.6 Schmitt-Trigger Inputs − Ports (P1 and P2), RST/NMI, JTAG (TCK, TMS,

TDI/TCLK,TDO/TDI)

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER V

MIN MAX UNIT

IT+

Positive-going input threshold voltage 3 V 1.5 1.98 V

IT-

Negative-going input threshold voltage 3 V 0.9 1.3 V

hys

Input voltage hysteresis (V

IT+

- V

IT-

) 3 V 0.45 1 V

(1) The external signal sets the interrupt flag every time the minimum t

(int)

parameters are met. It may be set even with trigger signals

shorter than t

(int)

. Both the cycle and timing specifications must be met to ensure the flag is set. t

(int)

is measured in MCLK cycles.

5.7 Inputs P1.x, P2.x, TAx

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS V

MIN MAX UNIT

(int)

External interrupt timing

Port P1, P2: P1.x to P2.x, external trigger signal

for the interrupt flag

(1)

3 V

1.5 cycle

50 ns

(cap)

Timer_A capture timing TAx 3 V 50 ns

(TAext)

Timer_A clock frequency externally

applied to pin

TAxCLK, INCLK t

(H)

= t

(L)

3 V 10 MHz

(TAint)

Timer_A clock frequency SMCLK or ACLK signal selected 3 V 10 MHz

(1) The leakage current is measured with V

or V

applied to the corresponding pins, unless otherwise noted.

(2) The port pin must be selected as input.

5.8 Leakage Current − Ports (P1 and P2)

(1)

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS V

MIN MAX UNIT

lkg(P1.x)

Leakage current, Port P1.x Port 1: V

(P1.x)

(2)

3 V ±50 nA

lkg(P2.x)

Leakage current, Port P2.x Port 2: V

(P2.x)

(2)

3 V ±50 nA

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