Surface-illuminated photon-trapping high-speed
Ge-on-Si photodiodes with improved efficiency
up to 1700 nm
HILAL CANSIZOGLU,
1,†
CESAR BARTOLO-PEREZ,
1,†
YANG GAO,
1,
*EKATERINA PONIZOVSKAYA DEVINE,
1,2
SOROUSH GHANDIPARSI,
1
KAZIM G. POLAT,
1
HASINA H. MAMTAZ,
1
TOSHISHIGE YAMADA,
2,3
ALY F. E LREFAIE,
1,2
SHIH-YUAN WANG,
2
AND M. SAIF ISLAM
1,4
1
Electrical and Computer Engineering, University of California—Davis, Davis, California 95618, USA
2
W&WSens Devices, Inc., 4546 El Camino, Suite 215, Los Altos, California 94022, USA
3
Electrical Engineering, Baskin School of Engineering, University of California, Santa Cruz, California 95064, USA
4
e-mail: sislam@ucdavis.edu
*Corresponding author: yangao@ucdavis.edu
Received 20 March 2018; revised 26 April 2018; accepted 9 May 2018; posted 9 May 2018 (Doc. ID 326327); published 21 June 2018
In this paper, high-speed surface-illuminated Ge-on-Si pin photodiodes with improved efficiency are demon-
strated. With photon-trapping microhole features, the external quantum efficiency (EQE) of the Ge-on-Si
pin diode is >80% at 1300 nm and 73% at 1550 nm with an intrinsic Ge layer of only 2 μm thickness, showing
much improvement compared to one without microholes. More than threefol d EQE improvement is also ob-
served at longer wavelengths beyond 1550 nm. These results make the microhole -enabled Ge-on-Si photodiodes
promising to cover both the existing C and L bands, as well as a new data transmission window (1620–1700 nm),
which can be used to enhance the capacity of conventional standard single-mode fiber cables. These photodiodes
have potential for many application s, such as inter-/intra-datacenters, passive optical networks, metro and long-
haul dense wavelength division multiplexing systems, eye-safe lidar systems, and quantum communications.
The CMOS and BiCMOS monolithic integration compatibility of this work is also attractive for Ge CMOS,
near-infrared sensing, and communication integration.
© 2018 Chinese Laser Press
OCIS codes: (230.5170) Photodiodes; (320.7080) Ultrafast devices.
https://doi.org/10.1364/PRJ.6.000734
1. INTRODUCTION
Timely development of cost-effective and power-efficient opti-
cal interconnects is necessary to meet the high demand of data
transfer in the era of the Internet of Things (IoT) that is ex-
pected to connect billions of sensors with different functional-
ities [1,2]. Datacenters are envisioned to scale up to meet the
high demand of connectivity. Intra- and inter-datacenter com-
munications require optical links for reach gap (500 m–2km),
long-reach (∼10 km), and extended reach communications (up
to 40 km), which need optical transceivers operating at wave-
lengths of 1300 nm (IEEE 802.3bm and IEEE 802.3bs). At
the same time, passive optical networks (PONs), which provide
low-cost solutions for the demand in high data rate access to
users, require optical transceivers operating at a wavelength of
1550 nm [3]. The data rate can be increased in such systems
by utilizing dense wavelength division multiplexing (DWDM).
However, the demand for data traffic is increasing beyond the
current capacity of single-mode fiber operating at the C band
(1530–1560 nm) and the L band (1560–1620 nm) for
DWDM in long-haul communication links. One of the prom-
ising solutions to overcome the capacity crunch is to extend
existing single-mode fiber bandwidth beyond the L band.
Achievements for fiber amplifiers [4,5] that can operate in
the new band of 1620 –1700 nm pave the way to realize data
transmission beyond the L band. The new development of hol-
low-core photonic-bandgap fibers [6,7] has also provided a new
option to extend fib er bandwidth up to 2000 nm with the use
of these new optical amplifiers.
In addition, applications such as quantum communications
[8], eye-safe lidar systems [9], and photonic biosensors [10],
require detectors operated at the near-infrared, particularly at
1310 or 1550 nm, taking advantage of the low-loss windows
of optical fibers and low scattering of light at those wavelengths
in the atmosphere and tissue, respectively.
Commercially available optical receivers often contain pho-
todiodes (PDs) based on III–V materials such as InGaAs/InP
734
Vol. 6, No. 7 / July 2018 / Photonics Research
Research Article
2327-9125/18/070734-09 Journal © 2018 Chinese Laser Press