LPC43xx/LPC43Sxx ARMCortex-M4/M0 多核微控制器用户手册

LPC43xx

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"LPC43xx/LPC43Sxx用户手册是针对ARMCortex-M4/M0多核微控制器的详细使用指南，涵盖了LPC43系列的各种型号。手册包含了丰富的关键词，如SPIFI、SCTimer/PWM、USB和以太网等。文档还提到了修订历史，最近的更新在2018年8月22日，增加了设备唯一ID的相关内容。" LPC43xx/LPC43Sxx系列微控制器是NXP半导体公司推出的一款基于ARMCortex-M4和M0内核的高性能芯片。这款微控制器的特点在于其多核架构，结合了处理能力强大的Cortex-M4内核和高效能的Cortex-M0内核，适用于各种复杂的嵌入式应用。 1. **ARMCortex-M4内核**：Cortex-M4是ARM公司设计的32位微控制器内核，具有浮点单元（FPU），支持单精度和双精度浮点运算，适合处理数学密集型任务。它还具备硬件除法器和高级中断控制器，增强了实时性能。 2. **ARMCortex-M0内核**：作为低功耗内核，Cortex-M0用于处理低级别任务和电源管理，确保系统高效运行的同时节省能源。 3. **SPIFI（SPI Flash Interface）**：这是一种高速SPI接口，用于连接外部闪存，提供快速的数据读取速度，扩展存储容量。 4. **SCTimer/PWM（State Configurable Timer/Pulse Width Modulation）**：这是一个灵活的定时器模块，可以配置为多种工作模式，包括PWM输出，广泛应用于电机控制和其他定时相关任务。 5. **USB（Universal Serial Bus）**：集成的USB接口使得LPC43xx/LPC43Sxx能够方便地与各种USB设备通信，支持USB主机和设备模式。 6. **以太网**：内置的以太网MAC接口允许微控制器直接连接到局域网，实现高速网络通信。 7. **ISP（In-System Programming）**：用户手册提到更新了ISP命令，增加了读取设备唯一ID的功能。这表明该微控制器支持在系统编程，可以在不从电路板上移除的情况下进行固件更新和调试。 8. **设备唯一ID**：每个LPC43xx/LPC43Sxx设备都有一个唯一的ID，这对于设备认证、序列化和防止克隆非常有用。 9. **用户手册的修订历史**：2.4版本的更新除了添加设备唯一ID的信息外，还对ISP命令进行了修改，强调了读取设备唯一ID的命令，显示了手册的持续改进和对新功能的支持。 LPC43xx/LPC43Sxx系列微控制器集成了多种高级功能，适用于需要高性能计算和网络连接的嵌入式系统。用户手册详细阐述了这些特性和使用方法，是开发者理解和应用这些芯片的重要参考资料。

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User manual Rev. 2.4 — 22 August 2018 16 of 1444

NXP Semiconductors

UM10503

Chapter 1: Introductory information

– One High-speed USB 2.0 Host/Device/OTG interface with DMA support and

on-chip high-speed PHY.

– One High-speed USB 2.0 Host/Device interface with DMA support, on-chip

full-speed PHY and ULPI interface to external high-speed PHY.

– USB interface electrical test software included in ROM USB stack.

– One 550 UART with DMA support and full modem interface.

– Three 550 USARTs with DMA and synchronous mode support and a smart card

interface conforming to ISO7816 specification. One USART with IrDA interface.

– Two C_CAN 2.0B controllers with one channel each. Use of C_CAN controller

excludes operation of all other peripherals connected to the same bus bridge.

– Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA

support.

– One SPI controller.

– One Fast-mode Plus I

C-bus interface with monitor mode and with open-drain I/O

pins conforming to the full I

C-bus specification. Supports data rates of up to

1 Mbit/s.

– One standard I

C-bus interface with monitor mode and with standard I/O pins.

– Two I

S interfaces, each with DMA support and with one input and one output.

• Digital peripherals

– External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,

and SDRAM devices.

– LCD controller with DMA support and a programmable display resolution of up to

1024H  768V. Supports monochrome and color STN panels and TFT color

panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel

mapping.

– Secure Digital Input Output (SD/MMC) card interface.

– Eight-channel General-Purpose DMA (GPDMA) controller can access all

memories on the AHB and all DMA-capable AHB slaves.

– Up to 164 General-Purpose Input/Output (GPIO) pins with configurable

pull-up/pull-down resistors.

– GPIO registers are located on the AHB for fast access. GPIO ports have DMA

support.

– Up to eight GPIO pins can be selected from all GPIO pins as edge and level

sensitive interrupt sources.

– Two GPIO group interrupt modules enable an interrupt based on a programmable

pattern of input states of a group of GPIO pins.

– Four general-purpose timer/counters with capture and match capabilities.

– One motor control Pulse Width Modulator (PWM) for three-phase motor control.

– One Quadrature Encoder Interface (QEI).

– Repetitive Interrupt timer (RI timer).

– Windowed watchdog timer (WWDT).

– Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes

of battery powered backup registers.

User manual Rev. 2.4 — 22 August 2018 17 of 1444

NXP Semiconductors

UM10503

Chapter 1: Introductory information

– (Parts with on-chip flash only): Event recorder with three inputs to record event

identification and event time; can be battery powered.

– Alarm timer; can be battery powered.

– Unique ID for each device.

• Analog peripherals

– One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.

– Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.

Up to eight input channels per ADC.

– One 6-channel, 12-bit high-speed ADC (ADCHS) with DMA support and a data

conversion rate of 80 MSamples/s (LPC4370 only).

• Security (LPC43Sxx only)

– AES decryption programmable through an on-chip API.

– Two 128-bit secure OTP memories for AES key storage and customer use.

– Random number generator (RNG) accessible through AES API.

• Clock generation unit

– Crystal oscillator with an operating range of 1 MHz to 25 MHz.

– 12 MHz Internal RC (IRC) oscillator trimmed to 1.5 % (flashless parts) or 3 %

(flash-based parts) accuracy over full temperature range and voltage.

– Ultra-low power Real-Time Clock (RTC) crystal oscillator.

– Three PLLs allow CPU operation up to the maximum CPU rate without the need for

a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the

third PLL can be used as audio PLL.

– Clock output.

• Power

– Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip DC-to-DC converter for the

core supply and the RTC power domain.

– RTC power domain can be powered separately by a 3 V battery supply.

– Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep

power-down.

– Processor wake-up from Sleep mode via wake-up interrupts from various

peripherals.

– Wake-up from Deep-sleep, Power-down, and Deep power-down modes via

external interrupts and interrupts generated by battery powered blocks in the RTC

power domain.

– Brownout detect with four separate thresholds for interrupt and forced reset.

– Power-On Reset (POR).

– Available as LBGA256, TFBGA180, and TFBGA100 packages and as LQFP208

and LQFP144 packages.

User manual Rev. 2.4 — 22 August 2018 18 of 1444

NXP Semiconductors

UM10503

Chapter 1: Introductory information

1.3 Ordering information (flashless parts)

Table 1. Ordering information

Type number Package

Name Description Version

LPC4370FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4370FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4350FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4350FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3

LPC4330FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4330FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3

LPC4330FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4330FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4320FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4320FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4310FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4310FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC43S70FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body17  17  1 mm SOT740-2

LPC43S70FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC43S50FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC43S50FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3

LPC43S30FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC43S30FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC43S30FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC43S20FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC43S20FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3

Table 2. Ordering options

Type number Total

SRAM

Cores LCD Ethernet USB0

(Host,

Device,

OTG)

USB1

(Host,

Device)/

ULPI

interface

10-bit

ADC

channels

12-bit

ADC

channels

(ADCHS)

GPIO

LPC4370FET256 282 kB M4/M0/M0 yes yes yes yes/yes 8 (ADC0)/

8 (ADC1)

6 164

LPC4370FET100 282 kB M4/M0/M0 no yes yes no n/a 3 49

LPC4350FET256 264 kB M4/M0 yes yes yes yes/yes 8 n/a 164

LPC4350FET180 264 kB M4/M0 yes yes yes yes/yes 8 n/a 118

LPC4330FET256 264 kB M4/M0 no yes yes yes/yes 8 n/a 164

LPC4330FET180 264 kB M4/M0 no yes yes yes/yes 8 n/a 118

LPC4330FET100 264 kB M4/M0 no yes yes yes/no 4 n/a 49

LPC4330FBD144 264 kB M4/M0 no yes yes yes/no 8 n/a 83

LPC4320FET100 200 kB M4/M0 no no yes no 4 n/a 49

LPC4320FBD144 200 kB M4/M0 no no yes no 8 n/a 83

User manual Rev. 2.4 — 22 August 2018 19 of 1444

NXP Semiconductors

UM10503

Chapter 1: Introductory information

1.4 Ordering information (parts with on-chip flash)

LPC4310FET100 168 kB M4/M0 no no no no 4 n/a 49

LPC4310FBD144 168 kB M4/M0 no no no no 8 n/a 83

LPC43S70FET256 282 kB M4/M0/M0 yes yes yes yes/yes 8 (ADC0)/

8 (ADC1)

6 164

LPC43S70FET100 282 kB M4/M0/M0 no yes yes no n/a 3 49

LPC43S50FET256 264 kB M4/M0 yes yes yes yes/yes 8 n/a 164

LPC43S50FET180 264 kB M4/M0 yes yes yes yes/yes 8 n/a 118

LPC43S30FET256 264 kB M4/M0 no yes yes yes/yes 8 n/a 164

LPC43S30FET100 264 kB M4/M0 no yes yes yes/no 4 n/a 49

LPC43S30FBD144 264 kB M4/M0 no yes yes yes/no 8 n/a 83

LPC43S20FBD144 200 kB M4/M0 no no yes no 8 n/a 83

LPC43S20FET180 200 kB <tbd> no no yes no 8 <tbd> 118

Table 2. Ordering options

Type number Total

SRAM

Cores LCD Ethernet USB0

(Host,

Device,

OTG)

USB1

(Host,

Device)/

ULPI

interface

10-bit

ADC

channels

12-bit

ADC

channels

(ADCHS)

GPIO

Table 3. Ordering information

Type number Package

Name Description Version

LPC4367JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4367JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC4367JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4357FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4357JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4357JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC4353FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4353JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4353JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC4337FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4337JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4337JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4337JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4333FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4333JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4333JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4333JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4327JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4327JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9 

0.7 mm SOT926-1

LPC4325JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

User manual Rev. 2.4 — 22 August 2018 20 of 1444

NXP Semiconductors

UM10503

Chapter 1: Introductory information

LPC4325JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4323JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4323JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4322JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4322JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4317JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4317JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4315JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4315JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4313JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4313JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4312JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4312JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC43S67JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC43S67JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC43S67JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC43S57JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC43S57JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC43S37JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 

20  1.4 mm SOT486-1

LPC43S37JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

Table 3. Ordering information …continued

Type number Package

Name Description Version

Table 4. Ordering options

Type number

Flash total

Flash bank A

Flash bank B

Total SRAM

LCD

Ethernet

USB0 (Host, Device, OTG)

USB1 (Host, Device)/

ULPI interface

PWM

QEI

ADC channels

Temperature range

[1]

GPIO

LPC4367JET256 1 MB 512 kB 512 kB 154 kB yes yes yes yes/yes yes yes 8 J 164

LPC4367JBD208 1 MB 512 kB 512 kB 154 kB yes yes yes yes/yes yes yes 8 J 142

LPC4367JET100 1 MB 512 kB 512 kB 154 kB yes yes yes yes/yes yes yes 8 J 49

LPC4357FET256 1 MB 512 kB 512 kB 136 kB yes yes yes yes/yes yes yes 8 F 164

LPC4357JET256 1 MB 512 kB 512 kB 136 kB yes yes yes yes/yes yes yes 8 J 164

LPC4357JBD208 1 MB 512 kB 512 kB 136 kB yes yes yes yes/yes yes yes 8 J 142

LPC4353FET256 512 kB 256 kB 256 kB 136 kB yes yes yes yes/yes yes yes 8 F 164

LPC4353JET256 512 kB 256 kB 256 kB 136 kB yes yes yes yes/yes yes yes 8 J 164

LPC4353JBD208 512 kB 256 kB 256 kB 136 kB yes yes yes yes/yes yes yes 8 J 142

LPC4337FET256 1 MB 512 kB 512 kB 136 kB no yes yes yes/yes yes yes 8 F 164

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