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MSP430FR5969-SP
ZHCSH89A –DECEMBER 2017–REVISED MARCH 2018
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Specifications Copyright © 2017–2018, Texas Instruments Incorporated
(1) For other module currents not listed here, see the module specific parameter sections.
4.9 Typical Characteristics, Current Consumption per Module
(1)
MODULE TEST CONDITIONS REFERENCE CLOCK MIN TYP MAX UNIT
Timer_A Module input clock 3 μA/MHz
Timer_B Module input clock 5 μA/MHz
eUSCI_A UART mode Module input clock 5.5 μA/MHz
eUSCI_A SPI mode Module input clock 3.5 μA/MHz
eUSCI_B SPI mode Module input clock 3.5 μA/MHz
eUSCI_B I
2
C mode, 100 kbaud Module input clock 3.5 μA/MHz
RTC_B 32 kHz 100 nA
MPY Only from start to end of operation MCLK 25 μA/MHz
AES Only from start to end of operation MCLK 21 μA/MHz
CRC Only from start to end of operation MCLK 2.5 μA/MHz
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
4.10 Thermal Resistance Characteristics
THERMAL METRIC PACKAGE VALUE UNIT
θ
JA
Junction-to-ambient thermal resistance
(1)
QFN-48 (RGZ)
30.6 °C/W
θ
JC(TOP)
Junction-to-case (top) thermal resistance
(2)
17.2 °C/W
θ
JB
Junction-to-board thermal resistance
(3)
7.2 °C/W
Ψ
JB
Junction-to-board thermal characterization parameter 7.2 °C/W
Ψ
JT
Junction-to-top thermal characterization parameter 0.2 °C/W
θ
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
(4)
1.2 °C/W
θ
JA
Junction-to-ambient thermal resistance, still air
(1)
QFP-48 (PHP)
26.9 °C/W
θ
JC(TOP)
\ Junction-to-case (top) thermal resistance
(2)
16.4 °C/W
θ
JB
Junction-to-board thermal resistance
(3)
7.6 °C/W
Ψ
JB
Junction-to-board thermal characterization parameter 7.6 °C/W
Ψ
JT
Junction-to-top thermal characterization parameter 0.2 °C/W
θ
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
(4)
1.5 °C/W
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