SD卡物理层规范5.00版解读

接口协议

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"SD规格说明书第一部分" SD卡协议是电子设备中广泛使用的存储卡标准，由SD卡协会（SDCardAssociation，简称SDA）制定并维护。"SD Specifications Part1" 是该标准的物理层简化规范，版本5.00，发布于2016年8月10日。这个文档详细定义了SD卡与主机系统之间的接口协议，确保不同制造商的产品之间具有互操作性。 SD卡的物理层规范涵盖了以下几个关键知识点： 1. **接口规格**：SD卡的物理尺寸、引脚布局以及电气特性。SD卡有标准尺寸和迷你尺寸两种，它们的引脚定义和电源需求在规范中均有明确规定，包括数据传输线（通常为4线或1线模式）、命令/控制线、电源线等。 2. **信号电平**：SD卡支持不同的电压标准，如3.3V和1.8V，以适应不同设备的需求。此外，它还采用了SPI（Serial Peripheral Interface）和四线模式的MMC（MultiMediaCard）接口，以实现高速数据传输。 3. **数据传输**：SD卡使用串行接口进行数据传输，支持多种速度等级，例如基础速度、全速、高速和超高速。随着版本的升级，如从1.10到5.00，数据传输速率不断提升，5.00版本引入了UHS-Ⅱ（Ultra High Speed - 2），提供了更高的数据吞吐量。 4. **错误检测和纠正**：为了保证数据的完整性和可靠性，SD卡协议包含错误检测和纠正机制，如CRC（Cyclic Redundancy Check）和ECC（Error Correction Code）。这些机制能检测并修复在传输过程中可能出现的错误。 5. **命令和响应**：SD卡与主机之间的通信基于一系列预定义的命令，如CMD0（初始化）、CMD8（查询电压范围）、CMD27（读单块）、CMD55（应用命令）等。每个命令都有相应的响应格式，确保正确执行。 6. **安全特性**：SD卡支持版权保护技术，如Content Protection for Recordable Media (CPRM) 和Copy Protection for SD (CPSD)，以防止未经授权的复制和使用。 7. **扩展功能**：随着版本的更新，SD卡不断添加新的功能，如SDIO（Secure Digital Input/Output）模式，允许SD卡除了存储功能外，还能作为其他I/O设备使用，如Wi-Fi模块或GPS接收器。 8. **兼容性**：SD卡规范的一个重要特点是向后兼容，即新版本的SD卡可以在旧版本的读卡器上使用，尽管可能无法充分利用新版本的全部功能。 9. **知识产权**：值得注意的是，SD卡协议的部分内容可能涉及到SD-3C, LLC的知识产权，因此采用该规范的成员需要获得相应的许可。 "SD Specifications Part1" 是理解SD卡如何与系统交互的基础，对于设计和开发涉及SD卡的硬件和软件至关重要。从1.10版本到5.00版本的更新，反映了SD卡技术的进步和对更高性能、更多功能的需求。

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Physical Layer Specification Version 5.00

Confidential

Table 4-42: Card Status .................................................................................................................................. 87

Table 4-43: Card Status Field/Command - Cross Reference ........................................................................ 88

Table 4-44: SD Status ................................................................................................................................... 90

Table 4-45: Speed Class Code Field ............................................................................................................. 90

Table 4-46: Performance Move Field ............................................................................................................. 90

Table 4-47: AU_SIZE Field ............................................................................................................................. 91

Table 4-48: Maximum AU size ........................................................................................................................ 91

Table 4-49: Erase Size Field .......................................................................................................................... 91

Table 4-50: Erase Timeout Field .................................................................................................................... 92

Table 4-51: Erase Offset Field ........................................................................................................................ 92

Table 4-52: UHS_SPEED_GRADE Field ....................................................................................................... 92

Table 4-53: UHS_AU_SIZE Field ................................................................................................................... 93

Table 4-54: VIDEO_SPEED_CLASS Field .................................................................................................... 93

Table 4-55: VSC_AU_SIZE Field ................................................................................................................... 94

Table 4-56: Valid AU Size and SU Size .......................................................................................................... 95

Table 4-57: SUS_ADDR Field ........................................................................................................................ 95

Table 4-58: Timing Diagram Symbols ............................................................................................................ 97

Table 4-59: Timing Values (Except SDR50, DDR50 and SDR104) ............................................................... 97

Table 4-60: Measurement Condition of Speed Class (SDSC and SDHC) .................................................. 103

Table 4-61: Performance Requirements for Each Class (SDSC and SDHC) ............................................. 104

Table 4-62 : Measurement Conditions of Speed Class (SDXC) .................................................................. 107

Table 4-63 : Performance Requirements for Each Class (SDXC) ............................................................... 108

Table 4-64 : Speed Grade Measurement Conditions for UHS-I and UHS-II ............................................... 112

Table 4-65 : Video Speed Class Violating Conditions .................................................................................. 114

Table 4-66 : Busy Time for CMD20 Operations ........................................................................................... 120

Table 4-67 : SD Interface Mode Requirements for Video Speed Classes ................................................... 121

Table 4-68 : Video Speed Class Measurement Conditions ......................................................................... 129

Table 4-69 : Clock Condition for Video Speed Class ................................................................................... 129

Table 4-70 : Power Limit per Interface for Video Speed Class .................................................................... 129

Table 5-1: OCR Register Definition .............................................................................................................. 135

Table 5-2: The CID Fields ............................................................................................................................. 136

Table 5-3: CSD Register Structure ............................................................................................................... 137

Table 5-4: The CSD Register Fields (CSD Version 1.0) .............................................................................. 138

Table 5-5: TAAC Access Time Definition ...................................................................................................... 139

Table 5-6: Maximum Data Transfer Rate Definition ..................................................................................... 139

Table 5-7: Supported Card Command Classes ........................................................................................... 140

Table 5-8: Data Block Length ....................................................................................................................... 140

Table 5-9: DSR Implementation Code Table ................................................................................................ 141

Table 5-10: V

min Current Consumption .................................................................................................. 141

Table 5-11: V

max Current Consumption .................................................................................................. 141

Table 5-12: Multiply Factor for the Device Size ........................................................................................... 142

Table 5-13: R2W_FACTOR .......................................................................................................................... 143

Table 5-14: Data Block Length ..................................................................................................................... 143

Table 5-15: File Formats ............................................................................................................................... 144

Table 5-16: The CSD Register Fields (CSD Version 2.0) ............................................................................ 145

Table 5-17: The SCR Fields ......................................................................................................................... 148

Table 5-18: SCR Register Structure Version ................................................................................................ 148

Table 5-19: Physical Layer Specification Version ........................................................................................ 149

Table 5-20: CPRM Security Version ............................................................................................................. 151

Table 5-21: SD Memory Card Supported Bus Widths ................................................................................. 151

Table 5-22 : Extended Security .................................................................................................................... 151

Table 5-23 : Command Support Bits ............................................................................................................ 152

Table 5-24 : Field Definition of Extension Register Set Address ................................................................. 165

Physical Layer Specification Version 5.00

Confidential

1. General Description

SD Memory Card is a memory card that is specifically designed to meet the security, capacity,

performance, and environment requirements inherent in newly emerging audio and video consumer

electronic devices. The SD Memory Card will include a content protection mechanism that complies

with the security of the SDMI standard and will be faster and capable of higher Memory capacity. The

SD Memory Card security system uses mutual authentication and a "new cipher algorithm" to protect

against illegal usage of the card content. A Non-secure access to the user's own content is also

available.

SD memory cards may also support a second security system based on commonly used standards,

such as ISO-7816, which can be used to interface the SD memory card into public networks and other

systems supporting mobile e-commerce and digital signature applications.

In addition to the SD Memory Card, there is the SD I/O (SDIO) Card. The SDIO Card specification is

defined in a separate specification named: "SDIO Card Specification" that can be obtained from the SD

Association. The SDIO Specification defines an SD card that may contain interfaces between various

I/O units and an SD Host. The SDIO card may contain memory storage capability as well as its I/O

functionality. The Memory portion of SDIO card shall be fully compatible to the given Physical Layer

Specification. The SDIO card is based on and compatible with the SD Memory card. This compatibility

includes mechanical, electrical, power, signalling, and software. The intent of the SD I/O card is to

provide high-speed data I/O with low power consumption for mobile electronic devices. A primary goal

is that an I/O card inserted into a non-SDIO aware host will cause no physical damage or disruption of

that device or its software. In this case, the I/O card should simply be ignored. Once inserted into an

SDIO aware host, the detection of the card will be via the normal means described in the given Physical

Layer Specification with some extensions that are described in the SDIO Specification.

The SD Memory Card communication is based on an advanced 9-pin interface (Clock, Command,

4xData and 3xPower lines) designed to operate in at maximum operating frequency of 208 MHz and

low voltage range. The communication protocol is defined as a part of this specification.

The SD Specifications are divided into several documents. The SD Specifications documentation

structure is given in Figure 1-1.

Figure 1-1: SD Specifications Documentation Structure

• Audio Specification:

This specification, along with other application specifications, describes the specification of a specific

application (in this case - Audio Application) and the requirements to implement it.

• File System Specification:

The specification describes the specification of the file format structure of the data saved in the SD

Memory Card (in User Area and Protected Area).

Application Specifications

Part 4 Audio

Part 8 Video

Other Applications

Part 3 Security

Part 2 File System

Part 1 Physical Layer

UHS-II Addendum

Mechanical Addenda

eSD Addendum (Embedded)

Part A1

Advanced

Security SD

Extension

Part E1 SDIO

Physical Layer Specification Version 5.00

Confidential

• Security Specification:

The specification describes the content protection mechanism and the application-specific commands

that support it.

• Physical Layer Specification (this document):

The specification describes the physical interface and the command protocol used by the SD Memory

Card. The purpose of the Physical Layer specification is to define the SD Memory Card, its

environment, and handling.

The document is divided into several portions. Chapter 3 gives a general overview of the system

concepts. The common SD Memory Card characteristics are described in Chapter 4. As this description

defines an overall set of card properties, we recommend using the product documentation in parallel.

The card registers are described in Chapter 5.

Chapter 6 defines the electrical parameters of the SD Memory Card's hardware interface.

Mechanical Specification described in Chapter 8 in Version 2.00 is moved to the Standard Size

Mechanical Addendum.

There are three mechanical addenda depend on form factors.

(1) Standard Size Mechanical Addendum

(2) miniSD Mechanical Addendum

(3) microSD Mechanical Addendum

UHS-II Interface Specification is defined by the UHS-II Addendum.

Un-removable memory device for embedded application is defined by the eSD Addendum.

As used in this document, "shall" or "will" denote a mandatory provision of the standard. "Should"

denotes a provision that is recommended but is not mandatory. "May" denotes a feature, which may or

may not be present–at the option of the implementer–and whose presence does not preclude

compliance.

• Mc-EX Interface Specification: (This section was added in version 1.10)

Part A1 of the SD memory card specification (Refer to Figure 1-1) serves as an extension to the SD

card Physical Layer Specification and provides all of the definitions required to transfer the Mobile

Commerce Extension (Mc-EX) command packets from the Mc-EX host to the Mc-EX enabled SD

memory card, and vice versa.

• SDIO Specification

SDIO card and embedded SDIO are specified based on the Physical Layer Specification and

modifications and extensions are described in the Part E1 SDIO Specification.

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