AEC-Q100-Rev-J标准：汽车电子集成电路应力测试资格

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"AEC-Q100-Rev-J-2023 Base-Document.pdf" 本文档详细阐述了AEC-Q100标准的修订版J，该标准是针对汽车应用中的集成电路（IC）的基于失效机理的压力测试资格认证。AEC-Q100由汽车电子委员会（Automotive Electronics Council, AEC）的组件技术委员会制定，旨在确保在严苛的汽车环境条件下使用的集成电路的可靠性和质量。 **1. 范围** 文档的目的是规定集成电路在汽车应用中的资格认证要求。范围包括对参考文档的引用，如汽车、军事和工业领域相关的标准，以及一系列定义，这些定义明确了AEC-Q100资格、AEC认证、应用批准、部件工作温度等级、能力度量Cpk以及Flip-Chip Ball Grid Array (FC-BGA)封装配置等关键术语。 **1.1 目的** AEC-Q100的主要目标是通过压力测试确保在汽车环境中集成电路的可靠性，以达到零缺陷的目标。 **1.2 参考文档** - **汽车**: 提供与汽车行业相关的标准和规定。 - **军事**: 可能引用军事标准来确保更高级别的耐用性和可靠性，因为汽车环境有时可能接近或等同于军事应用的极端条件。 - **工业**: 工业级标准可能被用作汽车电子设备的最低性能基线，尤其是在温度范围和耐久性方面。 **1.3 定义** - **AEC-Q100资格**: 指集成电路通过了一系列特定的应力测试，证明其符合AEC-Q100标准的要求。 - **AEC认证**: 零件制造商通过AEC-Q100认证表明其产品满足标准，并可以应用于汽车环境。 - **批准用于某一应用**: 指部件经过验证，适合在特定的汽车应用中使用。 - **部件工作温度等级**：定义了集成电路在其整个生命周期内能够安全运行的温度范围。 - **Cpk**：是统计过程能力的一个指标，衡量生产过程中的一致性和过程能力，Cpk越高，表明过程越稳定，缺陷率更低。 - **FC-BGA封装配置**：这是一种封装形式，其中芯片直接倒置在基板上，通过焊球阵列与外部电路连接，适用于高性能和小型化的需求。 **2. 一般要求** - **2.1 目标** - **零缺陷**：这是AEC-Q100追求的最高标准，要求集成电路在设计、制造和使用过程中不出现故障。 - **2.2 要求的优先级** 文档规定了在满足各项要求时的优先顺序，确保关键安全和性能要求得到首要考虑。 - **2.3 客户特定的寿命要求（任务剖面）** 客户可以根据其具体应用的工况设定特殊的寿命要求，即“任务剖面”，以确保IC能满足特定的环境和工作条件。 - **2.4 使用通用数据满足资格和再认证要求** 允许使用通用的性能数据来验证新设计或现有设计的符合性，前提是这些数据可以代表实际的使用环境。 AEC-Q100-Rev-J是汽车电子行业的重要标准，它为集成电路的设计、生产和测试设定了严格的标准，以确保在汽车应用中的长期可靠性和安全性。通过这个标准，制造商能够提供满足严苛环境条件的产品，同时，客户可以根据自己的需求定制特定的性能标准。

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Component Technical Committee

Automotive Electronics Council

a process change. This table is a superset of tests that the supplier and user should use as a baseline

for discussion of tests that are required for the qualification in question. It is the supplier's

responsibility to present a rationale for why any of the listed tests need not be performed.

2.4.2 Time Limit for Acceptance of Generic Data

There are no time limits for the acceptability of generic data. Use the diagram below for appropriate

sources of reliability data that can be used. This data must come from the specific part or a part in the

same qualification family, as defined in Appendix 1. Potential sources of data could include any

customer specific data (withhold customer name), process change qualification, and periodic reliability

monitor data (see Figure 2).

Figure 2: Generic Data Time Line

2.5 Test Samples

2.5.1 Lot Requirements

Test samples shall consist of a representative device from the qualification family. Where multiple lot

testing is required due to a lack of generic data, test samples as indicated in Table 2 must be composed

of approximately equal numbers from non-consecutive wafer lots, assembled in non-consecutive

assembly lots. That is, they must be separated in the fab or assembly process line by at least one non-

qualification lot. Any deviation from the above requires technical explanation from the supplier.

History Present

Periodic Reliability

Monitor Tests

Qualification data + Process

change qualification data +

Reliability monitor data =

acceptable generic data

Process Change

Qualification

Customer #2

Specific

Qualification

Process Change

Qualification

Customer #1

Specific

Qualification

Internal Device

Characterization

Supplier Internal

Qualification

Supplier Start

of Production

Note:

Some process changes (e.g., die shrink) will affect the use of

generic data such that data obtained before these types of

changes will not be acceptable for use as generic data.

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Component Technical Committee

Automotive Electronics Council

2.5.2 Production Requirements

All qualification devices shall be produced on tooling and processes at the manufacturing site that will

be used to support part deliveries at production volumes. Other electrical test sites may be used for

electrical measurements after their electrical quality is validated.

2.5.3 Reusability of Test Samples

Devices that have been used for nondestructive qualification tests may be used to populate other

qualification tests. Devices that have been used for destructive qualification tests may not be used any

further except for engineering analysis.

2.5.4 Sample Size Requirements

Sample sizes used for qualification testing and/or generic data submission must be consistent with the

specified minimum sample sizes and acceptance criteria in Table 2.

If the supplier elects to use generic data for qualification, the specific test conditions and results must

be recorded and available to the user (preferably in the format shown in Appendix 4). Existing

applicable generic data should first be used to satisfy these requirements and those of Section 2.4 for

each test requirement in Table 2. Device specific qualification testing should be performed if the generic

data does not satisfy these requirements.

2.5.5 Pre- and Post-stress Test Requirements

Test temperatures both pre- and post-stress (room, hot and/or cold) are specified in the "Additional

Requirements" column of Table 2 for each test.

2.6 Definition of Test Failure After Stressing

Test failures are defined as those devices not meeting the individual device specification, criteria

specific to the test, or the supplier's data sheet, in the order of significance as defined in Section 2.2.

Any device that shows external physical damage attributable to the environmental test is also

considered a failed device. If the cause of failure is due to mishandling during stressing or testing such

as EOS or ESD, or some other cause unrelated to the component reliability, the failure shall be

discounted but reported as part of the data submission.

3. QUALIFICATION AND REQUALIFICATION

3.1 Qualification of a New Device

The stress test requirement flow for qualification of a new device is shown in Figure 3 with the

corresponding test conditions defined in Table 2. For each qualification, the supplier must have data

available for all of these tests, whether it is stress test results on the device to be qualified or acceptable

generic data. A review shall also be made of other devices in the same generic family to ensure that

there are no common failure mechanisms in that family. Detailed justification for the use of generic

data shall be communicated and explicitly reported by the supplier.

For each device qualification, the supplier must have available the following:

• Certificate of Design, Construction and Qualification (see Appendix 2)

• Stress Test Qualification data (see Table 2 & Appendix 4)

• Data indicating the level of fault grading of the test software used for qualification (when applicable

to the device type) per Q100-007 that will be made available to the user upon request

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Component Technical Committee

Automotive Electronics Council

3.2 Requalification of a Changed Device

Requalification of a device is required when the supplier makes a change to the product and/or process

that impacts (or could potentially impact) the form, fit, function, quality and/or reliability of the device

(see Table 3 for guidelines).

3.2.1 Process Change Notification

The supplier will meet the user requirements for product/process changes.

3.2.2 Changes Requiring Requalification

As a minimum, any change to the product, as defined in Appendix 1, requires performing the applicable

tests listed in Table 2, using Table 3 to determine the requalification test plan. Table 3 should be used

as a guide for determining which tests are applicable to the qualification of a particular part change or

whether equivalent generic data can be submitted for that test(s).

3.3 Criteria for Passing Qualification and Requalification

All failures shall be analyzed for root cause. Only when corrective and preventative actions are in

place, have been proven effective for valid failures, and the 8D methodology (Eight Discipline,

see JESD671) has been completed, the part may then be considered AEC Q100 qualified. The

supplier is responsible for proving the effectiveness of its 8D.

3.4 User Approval

User approval will be per IATF 16949, applicable customer specific requirements, or AIAG PPAP

requirements and is outside the scope of this document.

3.5 Qualification of a Pb-Free Device

Added requirements needed to address the special quality and reliability issues that arise when Lead

(Pb)-Free processing is utilized is specified in AEC-Q005 Pb-Free Requirements. Materials used in

Pb-Free processing include the termination plating and the board attach (solder). These new materials

usually require higher board attach temperatures to yield acceptable solder joint quality and reliability.

These higher temperatures may adversely affect the moisture sensitivity level of plastic packaged

semiconductors. As a result, new, more robust mold compounds may be required. If an encapsulation

material change is required to provide adequate robustness for Pb-Free processing of the device, the

supplier should refer to the process change qualification requirements in this specification.

Preconditioning should be performed at the Pb-free reflow classification temperatures described in

IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface

Mount Devices before environmental stress tests.

3.6 Qualification of a Device Using Copper (Cu) Wire Interconnects

Devices using Copper (Cu) wire shall have supporting data according AEC-Q006.

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Component Technical Committee

Automotive Electronics Council

4. QUALIFICATION TESTS

4.1 General Tests

Test flows are shown in Figure 3 and test details are given in Table 2. Not all tests apply to all devices.

For example, certain tests apply only to ceramic packaged devices, others apply only to devices with

NVM, and so on. The applicable tests for the particular device type are indicated in the “Note” column

of Table 2. The “Additional Requirements” column of Table 2 also serves to highlight test requirements

that supersede those described in the referenced test method. Any unique qualification tests or

conditions requested by the user and not specified in this document shall be negotiated between the

supplier and user requesting the test.

4.2 Device Specific Tests

The following tests must be performed. Generic data is not allowed for these tests. Device specific

data, if it already exists, is acceptable.

1. Electrostatic Discharge (ESD) - All product.

2. Latch-up (LU) - All product.

3. Electrical Distribution - All product. The supplier must demonstrate, over the operating temperature

grade, voltage, and frequency, that the device is capable of meeting the parametric limits of the

device specification. This data must be taken from at least three lots, or one matrixed (or skewed)

process lot, and must represent enough samples to be statistically valid, see Q100-009. It is

strongly recommended that the final test limits be established using AEC-Q001 Guidelines For Part

Average Testing.

4.3 Wearout Reliability Tests

Typically a product qualification according to this document is not sufficient to release a new technology

for manufacturing of automotive products. It is highly recommended to perform a technology

qualification using knowledge based methodologies as prerequisite to the product qualification.

Testing for the failure mechanisms listed below must be available to the user whenever a new

technology or material relevant to the appropriate wearout failure mechanism is to be qualified. The

data, test method, calculations, and internal criteria need not be demonstrated or performed on the

qualification of every new device, but should be available to the user upon request.

• Electromigration

• Time-Dependent Dielectric Breakdown (or Gate Oxide Integrity Test) - for all MOS technologies

• Hot Carrier Injection - for all MOS technologies below 1 micron

• Bias Temperature Instability - for all CMOS below 1 micron for NBTI and PBTI as appropriate

• Stress Migration

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