STM32L151x6/8/B系列超低功耗ARM Cortex-M3微控制器数据手册

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本资源是一份关于STM32L151x6/8/B和STM32L152x6/8/B系列的全面生产数据手册，发布日期为2016年4月，文档编号DocID17659Rev12。这些是基于ARM Cortex-M3架构的超低功耗32位微控制器，适用于对功耗敏感的应用场景。主要特点包括： 1. **超低功耗平台**：支持1.65V至3.6V的宽范围供电，确保在极端工作温度(-40°C到85°C或105°C)下运行。它提供多种低功耗模式，如0.3μA的待机模式（唤醒3个引脚）、0.9μA的带RTC待机模式、0.57μA的停机模式（唤醒16条线路）以及1.2μA的带RTC停机模式。在低功耗运行模式下消耗仅为9μA，而在满载运行状态下则能达到214μA/MHz的性能。 2. **处理器核心**：采用ARM Cortex-M3内核，最高工作频率可达32MHz，具有1.25 DMIPS/MHz（Dhrystone 2.1基准测试）的性能。此外，内置内存保护单元，增强了系统安全性和可靠性。 3. **电源管理和复位**：设计有超安全的低功耗BOR（棕色out复位）功能，可设置5个可选阈值。POR/PDR（上电/掉电复位）也极为节能。内置可编程电压检测器(PVD)用于电源监控。 4. **时钟源**：支持1到24MHz的外部晶体振荡器，以及32kHz用于RTC的精确校准振荡器。还有工厂预调整的高速内部16MHz RC振荡器，精度为±1%。另外，还提供低功耗内部65kHz到4.2MHz多速振荡器，以及用于CPU和USB的PLL。 5. **接口**：设备集成了LCD、USB、ADC和DAC等多种接口，满足不同应用的需求，同时支持极低的I/O漏电流和快速唤醒时间（小于8μs）。这份数据手册详细介绍了STM32L151x6/8/B和STM32L152x6/8/B系列产品的特性，对于开发低功耗嵌入式系统或需要高性能与节能兼顾应用的工程师来说，是重要的参考资源。通过了解这些特性，开发者可以优化设计，确保在有限的电源和温度条件下实现高效能和长时间的电池寿命。

Functional overview STM32L151x6/8/B STM32L152x6/8/B

16/133 DocID17659 Rev 12

= 2.0 to 2.4 V

Conversion time

up to 500 Ksps

Functional

(2)

Range 1,

Range 2 or

Range 3

Full speed operation

= 2.4 to 3.6 V

Conversion time

up to 1 Msps

Functional

(2)

Range 1,

Range 2 or

Range 3

Full speed operation

1. The CPU frequency changes from initial to final must respect "F

CPU

initial < 4*F

CPU

final" to limit V

CORE

drop due to current consumption peak when frequency increases. It must also respect 5 µs delay between

two changes. For example to switch from 4.2 MHz to 32 MHz, you can switch from 4.2 MHz to 16 MHz,

wait 5 µs, then switch from 16 MHz to 32 MHz.

2. Should be USB compliant from I/O voltage standpoint, the minimum V

is 3.0 V.

Table 4. CPU frequency range depending on dynamic voltage scaling

CPU frequency range Dynamic voltage scaling range

16 MHz to 32 MHz (1ws)

32 kHz to 16 MHz (0ws)

Range 1

8 MHz to 16 MHz (1ws)

32 kHz to 8 MHz (0ws)

Range 2

2.1 MHz to 4.2 MHz (1ws)

32 kHz to 2.1 MHz (0ws)

Range 3

Table 3. Functionalities depending on the operating power supply range (continued)

Operating power

supply range

Functionalities depending on the operating power supply range

DAC and ADC

operation

USB

Dynamic voltage

scaling range

I/O operation

Functional overview STM32L151x6/8/B STM32L152x6/8/B

18/133 DocID17659 Rev 12

3.2 ARM

Cortex

-M3 core with MPU

The ARM

Cortex

-M3 processor is the industry leading processor for embedded systems.

It has been developed to provide a low-cost platform that meets the needs of MCU

implementation, with a reduced pin count and low-power consumption, while delivering

outstanding computational performance and an advanced system response to interrupts.

The ARM

Cortex

-M3 32-bit RISC processor features exceptional code-efficiency,

delivering the high-performance expected from an ARM core in the memory size usually

associated with 8- and 16-bit devices.

The memory protection unit (MPU) improves system reliability by defining the memory

attributes (such as read/write access permissions) for different memory regions. It provides

up to eight different regions and an optional predefined background region.

Owing to its embedded ARM core, the STM32L151x6/8/B and STM32L152x6/8/B devices

are compatible with all ARM tools and software.

DAC Y Y Y Y Y - - -

Temperature

sensor

YYYYY---

Comparators Y Y Y Y Y Y - -

16-bit and 32-bit

Timers

YYYY----

IWDG Y Y Y Y Y Y Y Y

WWDG Y Y Y Y - - - -

Touch sensing Y - - - - - - -

Systick Timer Y Y Y Y - - - -

GPIOs Y Y Y Y Y Y - 3 Pins

Wakeup time to

Run mode

0 µs 0.36 µs 3 µs 32 µs < 8 µs 50 µs

Consumption

=1.8V to 3.6V

(Typ)

Do w n to

214 µA/MHz

(from Flash)

D o w n t o

50 µA/MHz

(from Flash)

Down to

9 µA

Down to

4.4 µA

0.5 µA (No

RTC) V

=1.8V

0.3 µA (No RTC)

=1.8V

1.4 µA (with

RTC) V

=1.8V

1 µA (with RTC)

=1.8V

0.5 µA (No

RTC) V

=3.0V

0.3 µA (No RTC)

=3.0V

1.6 µA (with

RTC) V

=3.0V

1.3 µA (with

RTC) V

=3.0V

1. The startup on communication line wakes the CPU which was made possible by an EXTI, this induces a delay before

entering run mode.

Table 5. Working mode-dependent functionalities (from Run/active down to standby) (continued)

Ips Run/Active Sleep

Low-

power

Run

Low-

power

Sleep

Stop Standby

Wakeup

capability

Wakeup

capability

DocID17659 Rev 12 19/133

STM32L151x6/8/B STM32L152x6/8/B Functional overview

Nested vectored interrupt controller (NVIC)

The ultra-low-power STM32L151x6/8/B and STM32L152x6/8/B devices embed a nested

vectored interrupt controller able to handle up to 45 maskable interrupt channels (not

including the 16 interrupt lines of Cortex

-M3) and 16 priority levels.

• Closely coupled NVIC gives low-latency interrupt processing

• Interrupt entry vector table address passed directly to the core

• Closely coupled NVIC core interface

• Allows early processing of interrupts

• Processing of late arriving, higher-priority interrupts

• Support for tail-chaining

• Processor state automatically saved

• Interrupt entry restored on interrupt exit with no instruction overhead

This hardware block provides flexible interrupt management features with minimal interrupt

latency.

3.3 Reset and supply management

3.3.1 Power supply schemes

• V

= 1.65 to 3.6 V: external power supply for I/Os and the internal regulator.

Provided externally through V

pins.

• V

SSA

, V

DDA

= 1.65 to 3.6 V: external analog power supplies for ADC, reset blocks, RCs

and PLL (minimum voltage to be applied to V

DDA

is 1.8 V when the ADC is used).

DDA

and V

SSA

must be connected to V

and V

, respectively.

3.3.2 Power supply supervisor

The device has an integrated ZEROPOWER power-on reset (POR)/power-down reset

(PDR) that can be coupled with a brownout reset (BOR) circuitry.

The device exists in two versions:

• The version with BOR activated at power-on operates between 1.8 V and 3.6 V.

• The other version without BOR operates between 1.65 V and 3.6 V.

After the V

threshold is reached (1.65 V or 1.8 V depending on the BOR which is active or

not at power-on), the option byte loading process starts, either to confirm or modify default

thresholds, or to disable the BOR permanently: in this case, the V

min value becomes

1.65 V (whatever the version, BOR active or not, at power-on).

When BOR is active at power-on, it ensures proper operation starting from 1.8 V whatever

the power ramp-up phase before it reaches 1.8 V. When BOR is not active at power-up, the

power ramp-up should guarantee that 1.65

V is reached on V

at least 1 ms after it exits

the POR area.

Functional overview STM32L151x6/8/B STM32L152x6/8/B

20/133 DocID17659 Rev 12

Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To

reduce the power consumption in Stop mode, it is possible to automatically switch off the

internal reference voltage (V

REFINT

) in Stop mode. The device remains in reset mode when

is below a specified threshold, V

POR/PDR

or V

BOR

, without the need for any external

reset circuit.

Note: The start-up time at power-on is typically 3.3 ms when BOR is active at power-up, the start-

up time at power-on can be decreased down to 1

ms typically for devices with BOR inactive

at power-up.

The device features an embedded programmable voltage detector (PVD) that monitors the

DDA

power supply and compares it to the V

PVD

threshold. This PVD offers 7 different

levels between 1.85

V and 3.05 V, chosen by software, with a step around 200 mV. An

interrupt can be generated when V

DDA

drops below the V

PVD

threshold and/or when

DDA

is higher than the V

PVD

threshold. The interrupt service routine can then generate

a warning message and/or put the MCU into a safe state. The PVD is enabled by software.

3.3.3 Voltage regulator

The regulator has three operation modes: main (MR), low power (LPR) and power down.

• MR is used in Run mode (nominal regulation)

• LPR is used in the Low-power run, Low-power sleep and Stop modes

• Power down is used in Standby mode. The regulator output is high impedance, the

kernel circuitry is powered down, inducing zero consumption but the contents of the

registers and RAM are lost are lost except for the standby circuitry (wakeup logic,

IWDG, RTC, LSI, LSE crystal 32K osc, RCC_CSR).

3.3.4 Boot modes

At startup, boot pins are used to select one of three boot options:

• Boot from Flash memory

• Boot from System Memory

• Boot from embedded RAM

The boot loader is located in System Memory. It is used to reprogram the Flash memory by

using USART1 or USART2. See STM32™ microcontroller system memory boot mode

AN2606 for details.

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