SD物理层协议规范3.01版

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SD Specifications Part 1 Physical Layer Specification Version 3.01, released on February 18, 2010, is a confidential document created by the SD Group, which consists of Panasonic Corporation, SanDisk Corporation, and Toshiba Corporation, in collaboration with the Technical Committee SD Card Association. The document includes the Revision History, indicating that the base version (Draft only) was released on March 22, 2000, followed by the initial release version 1.01 on April 15, 2001, and version 1.10 on October 15, 2004. Supplementary Notes Version 1.01e (March 21, 2004) specifies CMD6 (Switch Function command) and CMD34-37, 50. The Physical Layer Specification Version 3.01 provides a comprehensive and detailed overview of the specifications for the physical layer of SD cards. It covers the technical specifications, guidelines, and standards for the physical characteristics, electrical properties, and interface requirements of SD cards. This includes information about the design and functionality of the card's connectors, pins, power supply, and data transfer rates. This document is designed to guide manufacturers, developers, and engineers in the design, production, and testing of SD cards to ensure compatibility, reliability, and optimal performance. It serves as an essential reference for anyone involved in the production or use of SD cards, ensuring that they meet the required standards and operate effectively within the established parameters. In summary, the SD Specifications Part 1 Physical Layer Specification Version 3.01 is a crucial and detailed resource for understanding and implementing the physical layer specifications for SD cards. It plays a vital role in maintaining the quality, performance, and interoperability of SD cards in various electronic devices and systems.

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Physical Layer Specification Version 3.01

Confidential xv

Table 6-18 : Output Timing of Variable Data Window ................................................................................ 162

Table 6-19 : Clock Signal Timing ............................................................................................................... 164

Table 6-20 : Bus Timings – Parameters Values (DDR50 mode) ................................................................ 166

Table 7-1: Command Format..................................................................................................................... 176

Table 7-2: Command Classes in SPI Mode ............................................................................................... 177

Table 7-3: Commands and Arguments ...................................................................................................... 181

Table 7-4: Application Specific Commands used/reserved by SD Memory Card - SPI Mode.................... 182

Table 7-5: Card Operation for CMD8 in SPI Mode .................................................................................... 183

Table 7-6: SPI Mode Status Bits ................................................................................................................ 189

Table 7-7: Timing Values ........................................................................................................................... 194

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Physical Layer Specification Version 3.01

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1. General Description

SD Memory Card is a memory card that is specifically designed to meet the security, capacity,

performance, and environment requirements inherent in newly emerging audio and video consumer

electronic devices. The SD Memory Card will include a content protection mechanism that complies

with the security of the SDMI standard and will be faster and capable of higher Memory capacity. The

SD Memory Card security system uses mutual authentication and a "new cipher algorithm" to protect

against illegal usage of the card content. A Non-secure access to the user's own content is also

available.

SD memory cards may also support a second security system based on commonly used standards,

such as ISO-7816, which can be used to interface the SD memory card into public networks and other

systems supporting mobile e-commerce and digital signature applications.

In addition to the SD Memory Card, there is the SD I/O (SDIO) Card. The SDIO Card specification is

defined in a separate specification named: "SDIO Card Specification" that can be obtained from the SD

Association. The SDIO Specification defines an SD card that may contain interfaces between various

I/O units and an SD Host. The SDIO card may contain memory storage capability as well as its I/O

functionality. The Memory portion of SDIO card shall be fully compatible to the given Physcial Layer

Specification. The SDIO card is based on and compatible with the SD Memory card. This compatibility

includes mechanical, electrical, power, signalling, and software. The intent of the SD I/O card is to

provide high-speed data I/O with low power consumption for mobile electronic devices. A primary goal is

that an I/O card inserted into a non-SDIO aware host will cause no physical damage or disruption of

that device or its software. In this case, the I/O card should simply be ignored. Once inserted into an

SDIO aware host, the detection of the card will be via the normal means described in the given Physical

Layer Specification with some extensions that are described in the SDIO Specification.

The SD Memory Card communication is based on an advanced 9-pin interface (Clock, Command,

4xData and 3xPower lines) designed to operate in at maximum operating frequency of 50 MHz and low

voltage range. The communication protocol is defined as a part of this specification.

The SD Specifications are divided into several documents. The SD Specifications documentation

structure is given in Figure 1-1.

Figure 1-1: SD Specifications Documentation Structure

• Audio Specification:

This specification, along with other application specifications, describes the specification of a specific

application (in this case - Audio Application) and the requirements to implement it.

• File System Specification:

The specification describes the specification of the file format structure of the data saved in the SD

Memory Card (in User Area and Protected Area).

Application Specifications

Part 3 Security

Part 1 Physical Layer

Mechanical Addenda

eSD Addendum (Embedded)

Part 2 File System

Part A1

Advanced

Security SD

Extension

Part E1 SDIO

Part 4 Audio Part 8 Video

Other Applications

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Physical Layer Specification Version 3.01

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• Security Specification:

The specification describes the content protection mechanism and the application-specific commands

that support it.

• Physical Layer Specification (this document):

The specification describes the physical interface and the command protocol used by the SD Memory

Card.

The purpose of the Physical Layer specification is to define the SD Memory Card, its environment, and

handling.

The document is divided into several portions. Chapter 3 gives a general overview of the system

concepts. The common SD Memory Card characteristics are described in Chapter 0. As this description

defines an overall set of card properties, we recommend using the product documentation in parallel.

The card registers are described in Chapter 5.

Chapter 6 defines the electrical parameters of the SD Memory Card's hardware interface.

Mechanical Specification described in Chapter 8 in Version 2.00 is moved to the Standard Size

Mechanical Addendum.

There are three mechanical addenda depend on form factors.

(1) Standard Size Mechanical Addendum

(2) miniSD Mechanical Addendum

(3) microSD Mechanical Addendum

Un-removable memory device for embedded application is defined by the eSD Addendum.

As used in this document, "shall" or "will" denote a mandatory provision of the standard. "Should"

denotes a provision that is recommended but is not mandatory. "May" denotes a feature, which may or

may not be present–at the option of the implementer–and whose presence does not preclude

compliance.

• Mc-EX Interface Specification: (This section was added in version 1.10)

Part A1 of the SD memory card specification (refer to Figure 1-1) serves as an extension to the SD card

Physical Layer Specification and provides all of the definitions required to transfer the Mobile

Commerce Extension (Mc-EX) command packets from the Mc-EX host to the Mc-EX enabled SD

memory card, and vice versa.

• SDIO Specification

SDIO card and embedded SDIO are specified based on the Physical Layer Specification and

modifications and extensions are described in the Part E1 SDIO Specification.

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