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首页Freescale MPC8315 嵌入式处理器高级手册
"MPC8315EPowerQUICC™IIPro是Freescale Semiconductor公司的一款嵌入式处理器,适用于高性能的嵌入式系统设计。该处理器家族包括MPC8315E、MPC8315、MPC8314E和MPC8314等型号,具有667MHz的主频,体现了其在嵌入式领域的强大性能。此处理器基于Power Architecture技术,与IBM的PowerPC核心授权有关,同时遵循多个IEEE标准,如802系列(用于无线和有线通信)和1149.1(测试访问端口和边界扫描)。文档包含了关于通用串行总线接口(USB)的章节,这部分内容参考了Intel Corporation的EHCI(Enhanced Host Controller Interface)规范,但不提供任何担保。"
这篇资料详细介绍了Freescale的MPC8315E系列处理器,它属于PowerQUICC II Pro系列,是一个集成的主机处理器,专为高性能的嵌入式应用设计。该处理器家族包括不同型号,满足不同需求,而MPC8315E作为其中的一员,以其667MHz的主频展现出较高的处理能力。
PowerQUICC II Pro系列基于Power Architecture,这是一种由IBM开发并授权的技术,它是一种精简指令集计算机(RISC)架构,以其高效能和低功耗而著称。PowerPC是Power Architecture的一个具体实现,通常用于服务器、工作站和嵌入式系统。
文档中提到的IEEE标准,例如802系列,包括802.1、802.2、802.3等,这些标准分别涉及网络层、数据链路层和物理层的协议,是局域网(LAN)和无线局域网(WLAN)通信的基础。1149.1标准,也称为JTAG(Joint Test Action Group)标准,是用于芯片测试和调试的重要接口。
此外,文档还涵盖了USB接口的部分,尤其是EHCI规范,这是USB 2.0高速主机控制器接口的标准,由Intel开发。这一部分可能包含关于如何在MPC8315E处理器上实现高速USB连接的详细信息,以及与设备通信的编程指南。
对于开发者来说,这份资料是深入理解MPC8315E处理器特性和如何利用其进行系统设计的关键资源,无论是进行硬件集成还是编写驱动程序,都能从中获得必要的信息和技术指导。
MPC8315E PowerQUICC™ II Pro Integrated Host Processor Family Reference Manual, Rev. 1
xvi Freescale Semiconductor
Contents
Paragraph
Number Title
Page
Number
9.5.1 DDR SDRAM Interface Operation............................................................................ 9-33
9.5.1.1 Supported DDR SDRAM Organizations............................................................... 9-34
9.5.2 DDR SDRAM Address Multiplexing........................................................................ 9-35
9.5.3 JEDEC Standard DDR SDRAM Interface Commands ............................................. 9-38
9.5.4 DDR SDRAM Interface Timing................................................................................ 9-40
9.5.4.1 Clock Distribution ................................................................................................. 9-43
9.5.5 DDR SDRAM Mode-Set Command Timing............................................................. 9-43
9.5.6 DDR SDRAM Registered DIMM Mode................................................................... 9-44
9.5.7 DDR SDRAM Write Timing Adjustments................................................................ 9-45
9.5.8 DDR SDRAM Refresh .............................................................................................. 9-46
9.5.8.1 DDR SDRAM Refresh Timing.............................................................................. 9-47
9.5.8.2 DDR SDRAM Refresh and Power-Saving Modes................................................ 9-47
9.5.8.2.1 Self-Refresh in Sleep Mode............................................................................... 9-49
9.5.9 DDR Data Beat Ordering........................................................................................... 9-50
9.5.10 Page Mode and Logical Bank Retention ................................................................... 9-50
9.6 Initialization/Application Information........................................................................... 9-51
9.6.1 Programming Differences Between Memory Types.................................................. 9-52
9.6.2 DDR SDRAM Initialization Sequence...................................................................... 9-55
9.6.3 Using Forced Self-Refresh Mode to Implement a Battery-Backed
RAM System ......................................................................................................... 9-55
9.6.3.1 Hardware Based Self-Refresh................................................................................ 9-55
9.6.3.2 Software Based Self-Refresh................................................................................. 9-55
9.6.3.3 Bypassing Re-initialization During Battery-Backed Operation ............................ 9-55
Chapter 10
Enhanced Local Bus Controller
10.1 Introduction....................................................................................................................10-2
10.1.1 Overview.................................................................................................................... 10-2
10.1.2 Features......................................................................................................................10-3
10.1.3 Modes of Operation ................................................................................................... 10-4
10.1.3.1 eLBC Bus Clock and Clock Ratios ....................................................................... 10-4
10.1.3.2 Source ID Debug Mode ......................................................................................... 10-4
10.2 External Signal Descriptions ......................................................................................... 10-5
10.3 Memory Map/Register Definition ................................................................................. 10-9
10.3.1 Register Descriptions............................................................................................... 10-10
10.3.1.1 Base Registers (BR0–BR3) ................................................................................. 10-10
10.3.1.2 Option Registers (OR0–OR3).............................................................................. 10-12
10.3.1.2.1 Address Mask .................................................................................................. 10-13
10.3.1.2.2 Option Registers (ORn)—GPCM Mode .........................................................10-14
10.3.1.2.3 Option Registers (ORn)—FCM Mode ............................................................ 10-16
MPC8315E PowerQUICC™ II Pro Integrated Host Processor Family Reference Manual, Rev. 1
Freescale Semiconductor xvii
Contents
Paragraph
Number Title
Page
Number
10.3.1.2.4 Option Registers (ORn)—UPM Mode ............................................................ 10-19
10.3.1.3 UPM Memory Address Register (MAR)............................................................. 10-20
10.3.1.4 UPM Mode Registers (MxMR) ........................................................................... 10-21
10.3.1.5 Memory Refresh Timer Prescaler Register (MRTPR) ........................................ 10-23
10.3.1.6 UPM/FCM Data Register (MDR) ....................................................................... 10-24
10.3.1.7 Special Operation Initiation Register (LSOR).....................................................10-25
10.3.1.8 UPM Refresh Timer (LURT)............................................................................... 10-25
10.3.1.9 Transfer Error Status Register (LTESR).............................................................. 10-26
10.3.1.10 Transfer Error Check Disable Register (LTEDR)................................................ 10-27
10.3.1.11 Transfer Error Interrupt Enable Register (LTEIR) .............................................. 10-29
10.3.1.12 Transfer Error Attributes Register (LTEATR).....................................................10-30
10.3.1.13 Transfer Error Address Register (LTEAR).......................................................... 10-31
10.3.1.14 Local Bus Configuration Register (LBCR)......................................................... 10-31
10.3.1.15 Clock Ratio Register (LCRR).............................................................................. 10-32
10.3.1.16 Flash Mode Register (FMR)................................................................................ 10-34
10.3.1.17 Flash Instruction Register (FIR) .......................................................................... 10-35
10.3.1.18 Flash Command Register (FCR) ......................................................................... 10-36
10.3.1.19 Flash Block Address Register (FBAR)................................................................ 10-37
10.3.1.20 Flash Page Address Register (FPAR).................................................................. 10-37
10.3.1.21 Flash Byte Count Register (FBCR)..................................................................... 10-39
10.4 Functional Description................................................................................................. 10-39
10.4.1 Basic Architecture.................................................................................................... 10-40
10.4.1.1 Address and Address Space Checking ................................................................ 10-41
10.4.1.2 External Address Latch Enable Signal (LALE) .................................................. 10-41
10.4.1.3 Data Transfer Acknowledge (TA) ....................................................................... 10-42
10.4.1.4 Data Buffer Control (LBCTL)............................................................................. 10-43
10.4.1.5 Atomic Operation ................................................................................................ 10-43
10.4.1.6 Bus Monitor......................................................................................................... 10-44
10.4.1.7 PLL Bypass Mode ............................................................................................... 10-44
10.4.2 General-Purpose Chip-Select Machine (GPCM)..................................................... 10-45
10.4.2.1 GPCM Read Signal Timing................................................................................. 10-46
10.4.2.2 GPCM Write Signal Timing................................................................................ 10-48
10.4.2.3 Chip-Select Assertion Timing ............................................................................. 10-50
10.4.2.3.1 Programmable Wait State Configuration......................................................... 10-51
10.4.2.3.2 Chip-Select and Write Enable Negation Timing .............................................10-51
10.4.2.3.3 Relaxed Timing ............................................................................................... 10-52
10.4.2.3.4 Output Enable (LOE) Timing.......................................................................... 10-54
10.4.2.3.5 Extended Hold Time on Read Accesses.......................................................... 10-54
10.4.2.4 External Access Termination (LGTA) ................................................................. 10-55
10.4.2.5 GPCM Boot Chip-Select Operation .................................................................... 10-56
10.4.3 Flash Control Machine (FCM) ................................................................................ 10-57
MPC8315E PowerQUICC™ II Pro Integrated Host Processor Family Reference Manual, Rev. 1
xviii Freescale Semiconductor
Contents
Paragraph
Number Title
Page
Number
10.4.3.1 FCM Buffer RAM ............................................................................................... 10-58
10.4.3.1.1 Buffer Layout and Page Mapping for Small-Page NAND Flash Devices ...... 10-59
10.4.3.1.2 Buffer Layout and Page Mapping for Large-Page NAND Flash Devices ...... 10-60
10.4.3.1.3 Error Correcting Codes and the Spare Region ................................................ 10-61
10.4.3.2 Programming FCM.............................................................................................. 10-62
10.4.3.2.1 FCM Command Instructions ........................................................................... 10-63
10.4.3.2.2 FCM No-Operation Instruction ....................................................................... 10-63
10.4.3.2.3 FCM Address Instructions............................................................................... 10-64
10.4.3.2.4 FCM Data Read Instructions ........................................................................... 10-64
10.4.3.2.5 FCM Data Write Instructions .......................................................................... 10-65
10.4.3.3 FCM Signal Timing............................................................................................. 10-65
10.4.3.3.1 FCM Chip-Select Timing ................................................................................ 10-65
10.4.3.3.2 FCM Command, Address, and Write Data Timing......................................... 10-65
10.4.3.3.3 FCM Ready/Busy Timing................................................................................ 10-67
10.4.3.3.4 FCM Read Data Timing .................................................................................. 10-68
10.4.3.3.5 FCM Extended Read Hold Timing.................................................................. 10-69
10.4.3.4 FCM Boot Chip-Select Operation ....................................................................... 10-69
10.4.3.4.1 FCM Bank 0 Reset Initialization..................................................................... 10-70
10.4.3.4.2 Boot Block Loading into the FCM Buffer RAM............................................. 10-70
10.4.4 User-Programmable Machines (UPMs)................................................................... 10-72
10.4.4.1 UPM Requests ..................................................................................................... 10-73
10.4.4.1.1 Memory Access Requests................................................................................ 10-74
10.4.4.1.2 UPM Refresh Timer Requests ......................................................................... 10-74
10.4.4.1.3 Software Requests—RUN Command ............................................................. 10-75
10.4.4.1.4 Exception Requests.......................................................................................... 10-75
10.4.4.2 Programming the UPMs ...................................................................................... 10-75
10.4.4.2.1 UPM Programming Example (Two Sequential Writes to the RAM Array).... 10-76
10.4.4.2.2 UPM Programming Example
(Two Sequential Reads from the RAM Array)............................................ 10-76
10.4.4.3 UPM Signal Timing............................................................................................. 10-77
10.4.4.4 RAM Array.......................................................................................................... 10-78
10.4.4.4.1 RAM Words..................................................................................................... 10-78
10.4.4.4.2 Chip-Select Signal Timing (CSTn) ................................................................. 10-82
10.4.4.4.3 Byte Select Signal Timing (BSTn).................................................................. 10-82
10.4.4.4.4 General-Purpose Signals (GnTn, GOn)........................................................... 10-83
10.4.4.4.5 Loop Control (LOOP) ..................................................................................... 10-83
10.4.4.4.6 Repeat Execution of Current RAM Word (REDO).........................................10-84
10.4.4.4.7 Address Multiplexing (AMX) ......................................................................... 10-84
10.4.4.4.8 Data Valid and Data Sample Control (UTA) ................................................... 10-85
10.4.4.4.9 LGPL[0:5] Signal Negation (LAST)............................................................... 10-86
10.4.4.4.10 Wait Mechanism (WAEN)............................................................................... 10-86
MPC8315E PowerQUICC™ II Pro Integrated Host Processor Family Reference Manual, Rev. 1
Freescale Semiconductor xix
Contents
Paragraph
Number Title
Page
Number
10.4.4.5 Synchronous Sampling of LUPWAIT for Early Transfer Acknowledge ............ 10-87
10.4.4.6 Extended Hold Time on Read Accesses.............................................................. 10-87
10.5 Initialization/Application Information......................................................................... 10-88
10.5.1 Interfacing to Peripherals in Different Address Modes ........................................... 10-88
10.5.1.1 Multiplexed Address/Data Bus for 26-Bit Addressing........................................ 10-88
10.5.1.2 Peripheral Hierarchy on the Local Bus for High Bus Speeds ............................. 10-88
10.5.1.3 GPCM Timings.................................................................................................... 10-89
10.5.2 Bus Turnaround ....................................................................................................... 10-90
10.5.2.1 Address Phase after Previous Read ..................................................................... 10-90
10.5.2.2 Read Data Phase after Address Phase ................................................................. 10-90
10.5.2.3 Read-Modify-Write Cycle for Parity Protected Memory Banks......................... 10-91
10.5.2.4 UPM Cycles with Additional Address Phases.....................................................10-91
10.5.3 Interface to Different Port-Size Devices.................................................................. 10-91
10.5.4 Command Sequence Examples for NAND Flash E
2
PROM ...................................10-92
10.5.4.1 NAND Flash Soft Reset Command Sequence Example ..................................... 10-93
10.5.4.2 NAND Flash Read Status Command Sequence Example................................... 10-93
10.5.4.3 NAND Flash Read Identification Command Sequence Example....................... 10-93
10.5.4.4 NAND Flash Page Read Command Sequence Example..................................... 10-94
10.5.4.5 NAND Flash Block Erase Command Sequence Example .................................. 10-95
10.5.4.6 NAND Flash Program Command Sequence Example........................................ 10-95
10.5.5 Interfacing to Fast-Page Mode DRAM Using UPM ............................................... 10-96
10.5.6 Interfacing to ZBT SRAM Using UPM................................................................. 10-101
10.5.7 Interfacing to DSP Host Ports................................................................................ 10-103
Chapter 11
Sequencer
11.1 Overview........................................................................................................................ 11-1
11.1.1 Features...................................................................................................................... 11-2
11.2 External Signal Description........................................................................................... 11-2
11.3 Memory Map/Register Definition ................................................................................. 11-2
11.4 Register Descriptions..................................................................................................... 11-3
11.4.1 PCI Outbound Translation Address Registers (POTARn)......................................... 11-3
11.4.2 PCI Outbound Base Address Registers (POBARn) .................................................. 11-3
11.4.3 PCI Outbound Comparison Mask Registers (POCMRn) .......................................... 11-4
11.4.4 Power Management Control Register (PMCR)......................................................... 11-5
11.4.5 Discard Timer Control Register (DTCR) .................................................................. 11-6
11.5 Functional Description................................................................................................... 11-6
11.5.1 Transaction Forwarding............................................................................................. 11-6
11.5.1.1 Transactions from the Coherency System Bus (CSB) Port................................... 11-7
11.5.1.2 Transactions from the PCI Port ............................................................................. 11-7
MPC8315E PowerQUICC™ II Pro Integrated Host Processor Family Reference Manual, Rev. 1
xx Freescale Semiconductor
Contents
Paragraph
Number Title
Page
Number
11.5.1.3 Transactions from the DMA Port .......................................................................... 11-7
11.5.2 PCI Outbound Address Translation........................................................................... 11-7
11.5.3 Transaction Ordering ................................................................................................. 11-8
Chapter 12
DMA/Messaging Unit
12.1 Features..........................................................................................................................12-1
12.2 External Signal Description........................................................................................... 12-2
12.2.1 Detailed Signal Descriptions ..................................................................................... 12-2
12.3 Memory Map/Register Definition ................................................................................. 12-3
12.4 Register Descriptions..................................................................................................... 12-4
12.4.1 Outbound Message Interrupt Status Register (OMISR)............................................ 12-4
12.4.2 Outbound Message Interrupt Mask Register (OMIMR)............................................ 12-6
12.4.3 Inbound Message Registers ....................................................................................... 12-7
12.4.4 Outbound Message Registers (OMR0–OMR1)......................................................... 12-7
12.4.5 Doorbell Registers ..................................................................................................... 12-8
12.4.5.1 Outbound Doorbell Register (ODR)...................................................................... 12-8
12.4.5.2 Inbound Doorbell Register (IDR).......................................................................... 12-9
12.4.6 Inbound Message Interrupt Status Register (IMISR) ................................................ 12-9
12.4.7 Inbound Message Interrupt Mask Register (IMIMR).............................................. 12-11
12.4.8 DMA Registers ........................................................................................................ 12-11
12.4.8.1 DMA Mode Register (DMAMRn)...................................................................... 12-12
12.4.8.2 DMA Status Register (DMASRn)....................................................................... 12-14
12.4.8.3 DMA Current Descriptor Address Register (DMACDARn) ..............................12-15
12.4.8.4 DMA Source Address Register (DMASARn)..................................................... 12-16
12.4.8.5 DMA Destination Address Register (DMADARn)............................................. 12-16
12.4.8.6 DMA Byte Count Register (DMABCRn) ........................................................... 12-17
12.4.8.7 DMA Next Descriptor Address Register (DMANDARn)................................... 12-17
12.4.8.8 DMA General Status Register (DMAGSR)......................................................... 12-18
12.5 Functional Description................................................................................................. 12-18
12.5.1 Message Unit ........................................................................................................... 12-18
12.5.1.1 Messaging Registers (IMR0–IMR1) ................................................................... 12-19
12.5.1.2 Doorbell Registers (IDR and ODR) .................................................................... 12-19
12.5.2 DMA Controller....................................................................................................... 12-19
12.5.3 DMA Operation ....................................................................................................... 12-20
12.5.3.1 External Control................................................................................................... 12-21
12.5.3.2 DMA Coherency.................................................................................................. 12-22
12.5.3.3 Halt and Error Conditions.................................................................................... 12-22
12.5.4 DMA Segment Descriptors...................................................................................... 12-22
12.5.4.1 Descriptor in Big-Endian Mode........................................................................... 12-23
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