MPU-6881: InvenSense 6轴传感器规格与应用

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"MPU-6881是InvenSense公司的一款六轴传感器，包括三轴陀螺仪和三轴加速度计。该设备的规格书主要针对软件开发者，详细阐述了寄存器配置说明，涵盖了产品的功能、电气特性、应用信息等关键内容。" MPU-6881是一款由InvenSense Inc.生产的高性能微电子机械系统（MEMS）传感器，主要用于提供六自由度的运动数据，包括三个维度的角速度（由陀螺仪测量）和三个维度的加速度（由加速度计测量）。这款传感器在各种领域有着广泛的应用，例如智能手机、无人机、游戏控制、运动追踪设备等。文档的修订历史显示，此版本为Revision 1.0，发布日期为2014年5月22日，共有38页的内容，涵盖了从基本信息到详细技术参数的全方位介绍。产品概述部分详细介绍了MPU-6881的功能和适用范围。其中，陀螺仪功能特性包括对角速度的精确测量，而加速度计功能特性则涉及对物体加速、减速及重力加速度的感应。此外，还有额外的特性，可能包括低功耗模式、数字信号处理能力以及多种工作模式等。电气特性部分列出了MPU-6881的性能指标，分为陀螺仪和加速度计两大部分。这些指标包括但不限于测量范围、精度、噪声密度、非线性度、偏置稳定性等。同时，还有电气规格，如电源电压、电流消耗以及接口时序特性，包括I²C和SPI的通信协议详细时间特性。应用信息部分提供了实际操作中的指导，包括引脚布局、信号描述、典型应用电路图、外部组件的物料清单（Bill of Materials）、模块化设计图以及工作原理概述。这些信息对于硬件工程师在集成MPU-6881到他们的系统中至关重要，帮助他们理解如何正确连接和配置传感器，以实现最佳性能。总结来说，MPU-6881规格书是软件开发者和硬件设计者的重要参考资料，它详尽地描述了MPU-6881传感器的各项特性和使用方法，有助于开发人员有效地利用该传感器进行创新产品设计。

MPU-6881 Product Specification

Document Number: PS-MPU-6881A-00

Revision: 1.0

Release Date: 05/22/2014

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1.2 Purpose and Scope

This document is a preliminary product specification, providing a description, specifications, and design

related information on the MPU-6881™ MotionTracking device. The device is housed in a small 3x3x0.9mm

24-pin QFN package.

Specifications are subject to change without notice. Final specifications will be updated based upon

characterization of production silicon. For references to register map and descriptions of individual registers,

please refer to the MPU-6881 Register Map and Register Descriptions document.

1.3 Product Overview

The MPU-6881 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis

accelerometer in a small 3x3x0.9mm (24-pin QFN) package. It also features a 4096-byte FIFO that can lower

the traffic on the serial bus interface, and reduce power consumption by allowing the system processor to

burst read sensor data and then go into a low-power mode. With its dedicated I

C sensor bus, the MPU-6881

directly accepts inputs from external I

C devices. MPU-6881, with its 6-axis integration, enables

manufacturers to eliminate the costly and complex selection, qualification, and system level integration of

discrete devices, guaranteeing optimal motion performance for consumers. MPU-6881 is also designed to

interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I

C port.

The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec. The

accelerometer has a user-programmable accelerometer full-sc

ale range of ±2g, ±4g, ±8g, and ±16g. Factory-

calibrated initial sensitivity of both sensors reduces production-line calibration requirements.

Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock

with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The

device features I

C and SPI serial interfaces, a VDD operating range of 1.71 to 3.45V, and a separate digital

IO supply, VDDIO from 1.71V to 3.45V.

Communication with all registers of the device is performed using either I

C at 400kHz or SPI at 1MHz. For

applications requiring faster communications, the sensor and interrupt registers may be read using SPI at

20MHz.

By leveraging its patented and volume-proven CMOS-MEMS Fabrication platform, which integrates MEMS

wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package

size down to a footprint and thickness of 3x3x0.9mm (24-pin QFN), to provide a very small yet high

performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.

1.4 Applications

 TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)

 MotionCommand™ technology (for Gesture Short-cuts)

 Motion-enabled game and application framework

 Location based services, points of interest, and dead reckoning

 Handset and portable gaming

 Motion-based game controllers

 3D remote controls for Internet connected DTVs and set top boxes, 3D mice

 Wearable sensors for health, fitness and sports

MPU-6881 Product Specification

Document Number: PS-MPU-6881A-00

Revision: 1.0

Release Date: 05/22/2014

8 of 38

2 Features

2.1 Gyroscope Features

The triple-axis MEMS gyroscope in the MPU-6881 includes a wide range of features:

 Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-

scale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs

 Digitally-programmable low-pass filter

 Gyroscope operating current: 3.2mA

 Factory calibrated sensitivity scale factor

 Self-test

2.2 Accelerometer Features

The triple-axis MEMS accelerometer in MPU-6881 includes a wide range of features:

 Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g,

±8g and ±16g and integrated 16-bit ADCs

 Accelerometer normal operating current: 450µA

 Low power accelerometer mode current: 7.27µA at 0.98Hz,

18.65µA at 31.25Hz

 User-programmable interrupts

 Wake-on-motion interrupt for low power operation of applications processor

 Self-test

2.3 Additional Features

The MPU-6881 includes the following additional features:

 Auxiliary master I

C bus for reading data from external sensors (e.g. magnetometer)

 3.4mA operating current when all 6 motion sensing axes are active

 VDD supply voltage range of 1.8 – 3.3V ± 5%

 VDDIO reference voltage of 1.8 – 3.3V ± 5% for auxiliary I

C devices

 Smallest and thinnest QFN package for portable devices: 3x3x0.9mm (24-pin QFN)

 Minimal cross-axis sensitivity between the accelerometer and gyroscope axes

 4096 byte FIFO buffer enables the applications processor to read the data in bursts

 Digital-output temperature sensor

 User-programmable digital filters for gyroscope, accelerometer, and temp sensor

 10,000 g shock tolerant

 400kHz Fast Mode I

C for communicating with all registers

 1MHz SPI serial interface for communicating with all registers

 20MHz SPI serial interface for reading sensor and interrupt registers

 MEMS structure hermetically sealed and bonded at wafer level

 RoHS and Green compliant

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