微控制器
JMT1801ED
14
版权所有© 2016 江苏宏云技术有限公司
18.9.47 EXINT 上升沿中断使能寄存器(EXINTPE) [0xC4]........................................... 349
18.9.48 EXINT 下降沿中断使能寄存器(EXINTNE) [0xC5]...........................................350
18.9.49 EXINT 中断使能寄存器(EXINTEN) [0xC6].......................................................351
18.9.50 EXINT 中断控制寄存器(EXINTCON) [0xB5]....................................................352
18.9.51 EXINT 中断管脚选择寄存器 0(EXINTSEL0) [0xB1]........................................353
18.9.52 EXINT 中断管脚选择寄存器 1(EXINTSEL1) [0xB2]........................................354
18.9.53 EXINT 中断管脚选择寄存器 2(EXINTSEL2) [0xB3]........................................354
18.9.54 EXINT 中断管脚选择寄存器 3(EXINTSEL3) [0xB4]........................................355
18.9.55 PA 数据寄存器(P0) [0x80].................................................................................... 355
18.9.56 PB 数据寄存器(P1) [0x90]....................................................................................356
18.9.57 PC 数据寄存器(P2) [0xA0]...................................................................................356
18.9.58 PD 数据寄存器(P3) [0xB0]...................................................................................356
18.9.59 PE 数据寄存器(P4) [0xC8]................................................................................... 356
19 电气特性
...................................................................................................................................
357
19.1
极限参数
...............................................................................................................................
357
19.2
工作条件
...............................................................................................................................
357
19.2.1 芯片供电.................................................................................................................357
19.2.2 功耗特性.................................................................................................................357
19.2.3 I/O 特性.................................................................................................................. 358
19.2.4 REGC 引脚特性.....................................................................................................359
19.2.5 NRST 引脚特性..................................................................................................... 359
19.2.6 上电/掉电条件....................................................................................................... 359
19.2.7 时钟特性.................................................................................................................360
19.2.8 通信接口.................................................................................................................360
19.2.9 FLASH 特性...........................................................................................................363
19.2.10 ADC 特性............................................................................................................... 364
19.2.11 PGA 特性................................................................................................................364
19.2.12 CMP 特性............................................................................................................... 365
19.2.13 电气敏感性.............................................................................................................365
20
封装特性
...................................................................................................................................
367
20.1 LQFP48L
.................................................................................................................................
367
20.2 QFN40L
..................................................................................................................................
368
20.3 QFN32L
..................................................................................................................................
368