NXP i.MX8M Mini 应用处理器数据手册

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"IMX8MM工业级数据手册.pdf" 本文档是NXP Semiconductors发布的i.MX8M Mini应用处理器的数据手册，版本号为Rev.1，发布日期为2020年7月。手册包含了订购信息、封装规格以及处理器的详细技术特性。在订购信息部分，列出了不同型号的处理器，例如MIMX8MM6CVTKZAA到MIMX8MM1CVTKZAA，这些型号可能代表不同的内存配置或功能选项。处理器采用的是FCBGA封装，尺寸为14x14mm，引脚间距为0.5mm。NXP保留了根据产品设计改进需求修改生产细节规格的权利。 i.MX8M Mini是NXP推出的最新一代应用处理器，专为提供顶级视频和音频体验而设计，同时优化了低功耗性能。该处理器家族的核心配置包括四核 Arm Cortex-A53核心，最高可运行在1.6GHz频率，以实现高性能处理任务。此外，它还配备了一个用于低功耗处理的Cortex-M4核心，频率高达400MHz。在内存支持方面，i.MX8M Mini支持32位/16位LPDDR4、DDR4和DDR3L内存，这提供了灵活的内存选择以满足不同应用场景的需求。音频接口是该处理器的一大亮点，支持I2S、AC97、TDM和S/PDIF等多种标准，适合多媒体应用和音频设备。除了上述特性，i.MX8M Mini还配备了广泛的连接接口，可能包括USB、以太网、串行通信、GPIO（通用输入/输出）和其他外设接口，这些接口使其能够连接各种外围设备和模块，如传感器、显示屏、存储设备等，广泛适用于工业级应用、嵌入式系统、物联网(IoT)设备、智能家居、车载信息娱乐系统等领域。总体而言，i.MX8M Mini是一款集成了高性能CPU、低功耗设计、强大音频功能和多种接口的多功能处理器，适用于需要高效能和低功耗平衡的工业和消费电子产品。其详细的技术规格和丰富的接口选项为设计人员提供了强大的平台，以构建创新且高效的解决方案。

Electrical characteristics

i.MX 8M Mini Applications Processor Datasheet for Industrial Products, Rev. 1, 07/2020

NXP Semiconductors 15

GPIO supply voltage NVCC_JTAG,

NVCCGPIO1,

NVCC_ENET,

NVCC_SD1,

NVCC_SD2,

NVCC_NAND,

NVCC_SA1,

NVCC_SAI2,

NVCC_SAI3,

NVCC_SAI5,

NVCC_ECSPI,

NVCC_I2C,

NVCC_UART,

NVCC_CLK

-0.3 3.8 V —

GPIO pre-driver supply voltage PVCC0_1P8,

PVCC1_1P8,

PVCC2_1P8

-0.3 2.15 V —

Isolated core supply voltage VDD_ANA_0P8 -0.3 1.15 V —

Analog core supply voltage VDD_ANA0_1P8 -0.3 2.15 V —

VDD_ANA1_1P8 -0.3 2.15 V —

Arm PLL supply voltage VDD_ARM_PLL_0P8 -0.3 0.95 V —

VDD_ARM_PLL_1P8 -0.3 2.15 V —

MIPI PHY supply voltage

VDD_MIPI_0P9 -0.3 1.05 V —

VDD_MIPI_1P2 -0.3 1.45 V —

VDD_MIPI_1P8 -0.3 2.15 V —

PCIe PHY supply voltage VDD_PCIE_0P8 -0.3 0.95 V —

VDD_PCIE_1P8 -0.3 2.15 V —

USB PHY supply voltage

VDD_USB_0P8 -0.3 0.95 V —

VDD_USB_1P8 -0.3 2.15 V —

VDD_USB_3P3 -0.3 3.95 V —

USB_VBUS input detected USB1_VBUS,

USB2_VBUS

-0.3 3.95 V —

XTAL supply voltage VDD_24M_XTAL_1P8 -0.3 2.15 V —

Storage temperature range T

STORAGE

-40 150

C—

Table 7. Absolute maximum ratings (continued)

Parameter description Symbol Min Max Unit Notes

i.MX 8M Mini Applications Processor Datasheet for Industrial Products, Rev. 1, 07/2020

16 NXP Semiconductors

Electrical characteristics

3.1.2 Thermal resistance

3.1.2.1 FCBGA package thermal resistance

Table 9 displays the 14 x 14 mm FCBGA package thermal resistance data.

Table 8. Electrostatic discharge and latch up ratings

Parameter description Rating Reference Comment

Electrostatic Discharge

(ESD)

Human Body Model (HBM) ±1000 V JS-001-2017 —

Charged Device Model (CDM) ±250 V JS-002-2018 —

Latch UP (LU) Immunity level:

• Class I@ 25

C ambient

temperature

• Class II @ 105

C ambient

temperature

JESD78E

—

Table 9. Thermal resistance data

Rating Test conditions Symbol Value Unit Notes

Junction to Ambient

Natural Convection

Single layer board (1s) R

JA

C/W

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JESD51-2 with the single layer board horizontal.

Junction to Ambient

Natural Convection

Four layer board (2s2p) R

JA

22.9

C/W

2, 3

Per JEDEC JESD51-6 with the board horizontal.

Junction to Ambient (@200 ft/min) Single layer board (1s) R

JMA

C/W

Junction to Ambient (@200 ft/min) Four layer board (2s2p) R

JMA

18.5

C/W

Junction to Board — R

JB

7.8

C/W

Thermal resistance between the die and printed circuit board per JEDEC JESD51-8. Board temperature is measured on the

top surface of the board near the package.

Junction to Case — R

JC

C/W

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Junction to Package Top Natural Convection 

0.2

C/W

Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

i.MX 8M Mini Applications Processor Datasheet for Industrial Products, Rev. 1, 07/2020

18 NXP Semiconductors

Electrical characteristics

PVCC0_1P8,

PVCC1_1P8,

PVCC2_1P8

1.650 1.800 1.950 V Power supply for GPIO pre-driver

VSS — — — V Ground for all core logic and I/O

NVCC_DRAM 1.283 1.35 1.425 V DDR3L

1.14 1.2 1.26 V DDR4

1.06 1.1 1.17 V LPDDR4

DRAM_VREF 0.49 x

NVCC_DRAM

0.5 x

NVCC_DRAM

0.51 x

NVCC_DRAM

V Internal output, no connection is needed.

VDD_DRAM_PLL_0P8 0.805 0.850 1.000 V 0.8 V logic power supply for DSM. It

should be connected to the separate logic

power.

VDD_ANA0_1P8

VDD_ANA1_1P8

1.71 1.8 1.89 V Analog 1.8 V core power

VDD_ANA_0P8 0.780 0.820 0.900 V Isolated 0.8 V core power

VDD_ARM_PLL_0P8 0.780 0.820 0.900 V Arm PLL 0.8 V power

VDD_ARM_PLL_1P8 1.71 1.8 1.89 V Arm PLL 1.8 V power

VDD_24M_XTAL_1P8 1.71 1.8 1.89 V XTAL 1.8 V power

VDD_DRAM_PLL_1P8 1.71 1.8 1.89 V Analog 1.8 V core power

VDD_MIPI_0P9 0.855 0.9 1.000 V 0.9 V power for PLL and internal logic

VDD_MIPI_1P2 1.14 1.2 1.26 V 1.2 V power for analog

VDD_MIPI_1P8 1.71 1.8 1.89 V 1.8 V power for PLL and analog

VDD_PCI_0P8

5,6

0.805 0.850 0.900 V Digital supply for PCIe PHY

VDD_PCI_1P8

1.71 1.8 1.89 V 1.8 V supply for PCIe PHY

VDD_USB_0P8 0.780 0.820 0.900 V Digital power supply from PHY’s I/O

power pads

VDD_USB_1P8 1.71 1.80 1.89 V 1.8 V analog power supply

VDD_USB_3P3 3.069 3.30 3.6 V 3.3 V analog power supply

USB1_VBUS

USB2_VBUS

0.800 1.40 3.60 V USB_VBUS input detect signal

Temperature Sensor

Accuracy

— ±3 ±5 °C Sensing temperature range 10°C to

105°C

-40 — +105

CSee Table 2 for complete list of junction

temperature capabilities.

The BD71847MWV PMIC does not support 0.950 V for VDD_GPU, VDD_VPU, and VDD_DRAM. For this PMIC, 0.975 V

typical is acceptable and supported.

Applying the maximum voltage results in maximum power consumption and heat generation. A voltage set point = (Vmin + the

supply tolerance) is recommended. This results in an optimized power/speed ratio.

Table 10. Operating ranges

(continued)

Symbol Min Typ Max

Unit Comment

Electrical characteristics

i.MX 8M Mini Applications Processor Datasheet for Industrial Products, Rev. 1, 07/2020

NXP Semiconductors 19

3.1.4 External clock sources

Each i.MX 8M Mini processor has two external input system clocks: a low frequency (RTC_XTALI) and

a high frequency (XTALI).

The RTC_XTALI is used for low-frequency functions. It supplies the clock for wake-up circuit,

power-down real time clock operation, and slow system and watch-dog counters. The clock input can only

be connected to an external oscillator. RTC_XTALO should be directly connected to VDD_SNVS_0P8.

The system clock input XTALI is used to generate the main system clock. It supplies the PLLs and other

peripherals. The system clock input can be connected to either an external oscillator or a crystal using

internal oscillator amplifier.

Table 11 shows the interface frequency requirements.

Table 12 shows the external input clock for OSC32K.

Overdrive maximum voltage includes all the nominal frequencies.

Booting VDD_SOC at 0.800 V ±5% is acceptable (Vmin = 0.760 V). Software is expected to program the VDD_SOC voltage

to the typical value in this table prior to first DRAM memory access.

Ensure the VDD_PCI_1P8 does not have more than 40 mVpp AC power supply noise superimposed on the high power supply

voltage for the PHY core (1.8 V nominal DC value). Simultaneously, the VDD_PCI_0P8 should have no more than 20 mVpp

AC power supply noise superimposed on the low power supply voltage for th PHY core (0.9 V nominal DC value for the

overdrive).

It can be min 0.78 V when supplied but not operating PCIe.

“EN” of TMU Enable Register (TMU_TER) is required to be always enabled for the part to operate correctly.

Table 11. External input clock frequency

Parameter Description Symbol Min Typ Max Unit

RTC_XTALI Oscillator

The required frequency stability of this clock source is application dependent.

ckil

— 32.768

Recommended nominal frequency 32.768 kHz.

—kHz

XTALI Oscillator

1,3

External oscillator or a fundamental frequency crystal appropriately coupled to the internal oscillator amplifier.

The typical values shown in Table 11 are required for use with NXP software to ensure precise time

keeping and USB operation. For RTC_XTALI operation, an external oscillator is necessary. RTC_XTALO

should be directly connected to VDD_SNVS_0P8 when using an external 32.768 kHz oscillator.

NOTE

There is no internal RC oscillator.

xtal

24 MHz

Table 12. External input clock for OSC32K

Symbol Min Typ Max Unit

Frequency f — 32.768 — kHz

RTC_XTALI VIH 0.7 x NVCC_SNVS_1P8 — NVCC_SNVS_1P8 V

VIL 0 — 0.3 x NVCC_SNVS_1P8 V

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