"UG-5664ASYEF05 OLED规格书及产品详情介绍"

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The OLED specification book SAS1-0E029-A UG-5664ASYEF051 is a product specification document provided by WiseChip Semiconductor Inc. The Part ID of the display module is UG-5664ASYEF05. The document contains detailed information about the OLED display module, including technical specifications, features, and requirements for its usage. The document specifies the Part Name as OEL Display Module with the Customer Part ID being the WiseChip Part ID UG-5664ASYEF05. The Doc No. is SAS1-0E029-A. The document is approved by WiseChip Semiconductor Inc. and includes contact information for the company located at 8, Kebei RD 2, Science Park, Chu-Nan, Taiwan 350, R.O.C. It is important to note that customers should contact WiseChip Semiconductor Inc. before assigning their product based on the module specification provided in the document. The information contained in the specification book is preliminary and subject to change. Customers are advised to verify the accuracy and relevance of the information before proceeding with the production and implementation of their product. Overall, the OLED specification book SAS1-0E029-A UG-5664ASYEF051 is a comprehensive guide for customers looking to utilize the OLED display module in their products. It provides essential details and guidelines for the proper integration and utilization of the module in various applications. Customers are encouraged to follow the specifications and recommendations outlined in the document to ensure the optimal performance and functionality of their products.

Doc. No: SAS1-0E029-A

http://www.wisechip.com.tw

1.4 Mechanical Drawing

The drawing contained herein is the exclusive property of WiseChip. It is not allowed to copy, reproduce and or disclose in any formats without permission of WiseChip.

WiseChip Semiconductor Inc.

Dora Yang

±0.30

Unless Otherwise Specified

Unit

Tolerance

Angle

Dimension

General Roughness

Title

Date

Drawn

Drawing Number

1 of 1

Sheet

Material

Panel / E.E.E.

1:1

Scale

Size

27.8±0.3 (Panel Size)

25.8±0.3 (Cap Size)

2±0.1

Rev.

Soda Lime / Polyimide

Customer Approval

Signature

±1

20±0.3

10.62

9.5

0.28

0.3

Detail "A"

Scale (10:1)

0.3

0.28

"A"

UG-5664ASYEF05 Folding Type OEL Display Module

Pixel Number: 256 x 64, Monochrome, COF Package

Active Area 3.12"

256

64 Pixels

P0.30x256-0.02=76.78 (A/A)

P0.30x64-0.02=19.18 (A/A)

78.78 (V/A)

87±0.3 (Polarizer)

88±0.3 (Cap Size)

21.18 (V/A)

23.3±0.3 (Polarizer)

1±0.5

0.5±0.5

(4.61)

(5.61)

(2)

(3)

P.M.

88±0.3 (Panel Size)

510

Notes:

1. Color: Yellow

2. Driver IC: SSD1322

3. Die Size: 12374um x 1526um

4. TCP Number: SSD1322U

5. Interface:

8-bit 68XX/80XX Parallel, 3-/4-wire SPI

6. General Tolerance: ±0.30

7. The total thickness (2.10 Max) is without polarizer protective film & remove tape.

The actual assembled total thickness with above materials should be 2.35 Max.

P0.50x(30-1)=14.5±0.05 (W0.30±0.03)

1 30

2-R0.5±0.05

60±0.2

40±0.1

(14)

15.5±0.2

4.66

(20.9)

(11.9)

(29.3)

(2.6)

0.80 Max

0.3±0.3

4±0.5 (Stiffener)

Glue

Remove Tape

t=0.15mm Max

Polarizer

t=0.2mm

Contact Side

(1.5)

Symbol

Ting-Kuo Hu Gary Lin

DMG5664CNCF29

(47.8)

Tiffany Hsu

20130118

Common A0

( Row 64 )

Common A63

( Row 1 )

Common B0

( Row 64 )

Common B63

( Row 1 )

Segment 112

( Column 1 )

Segment 367

( Column 256 )

Segment 239

( Column 128 )

Segment 240

( Column 129 )

VCC

N.C. (GND)

E/RD#

VLSS

VDD

VCI

N.C.

IREF

VDDIO

VSL

BS0

RES#

DC#

CS#

R/W#

BS1

VSS

VLSS

N.C. (GND)

VCC

VCOMH

N.C. (GND)

VCOMH

VSS

VCC

VLSS

BS0

E/RD#

R/W#

CS#

RES#

DC#

BS1

VDDIO

N.C.

IREF

VLSS

VCI

VDD

VSL

N.C. (GND)

VCC

Item Date Remark

A 20130118 Original Drawing

20130118 20130118 20130118

Doc. No: SAS1-0E029-A

http://www.wisechip.com.tw

1.5 Pin Definition

Pin Number

Symbol I/O

Function

26 VCI P

This is a voltage supply pin. It must be connected to external source & always

equal to or higher than V

& V

DDIO

25 VDD P

This is a voltage supply pin. It can be supplied externally

(within the range of

2.4~2.6V) or regulated internally from V

A capacitor should be connected

between this pin & V

under all circumstances.

24 VDDIO P

This pin is a power supply pin of I/O buffer. It should be connected to V

external source. All I/O signal should have V

reference to V

DDIO

. When I/O

signal pins (BS0~BS1

, D0~D7, control signals…) pull high, they should be

connected to V

DDIO

2 VSS P

This is a ground pin. It also acts as a reference for the logic pins. It must be

connected to external ground.

3, 29 VCC P

These are the most positive voltage supply pin of the chip. They

must be

connected to external source.

5, 28 VLSS P

These are the analog ground pins. They should be connected to V

externally.

22 IREF I

This pin is segment current reference pin. A resist

or should be connected

between this pin and V

. Set the current at 10µA maximum.

4 VCOMH P

This pin is the input pin for the voltage output high level for COM signals. A

tantalum capacitor should be connected between this pin and V

27 VSL P

This is segment voltage reference pin.

When external V

is not used, this pin should be left open.

When external V

is used, this pin should connect with resistor and diode to

ground.

21 FR O

This pin will send out a signal that could be used to identify the driver status.

Nothing should be connected to this pin. It should be left open individually.

BS0

BS1

These pins are MCU interface selection input. See the following table:

BS0 BS1

3-wire Serial 1 0

4-wire Serial 0 0

8-bit 68XX Parallel 1 1

8-bit 80XX Parallel 0 1

20 RES# I

This pin is reset signal input. When the pin is low, initialization of the chip i

executed. Keep this pin pull high during normal operation.

19 CS# I

This pin is the chip select input. The chip is enabled for MCU communication only

when CS# is pulled low.

18 D/C# I

This pin is Data/Command control

pin. When the pin is pulled high, the input at

D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0

will be transferred to the command register.

When the pin is pulled high and serial interface mode is selected, the data at SD

is treated as data. When it is pulled low, the data at SDIN will be transferred

the command register.

When 3-wire serial mode is selected, this pin must be connected to V

For detail relationship to MCU interface signals, please refer to the Timin

Characteristics Diagrams.

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