恒流LED驱动IC CC1100：低功耗无线解决方案

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恒流LED驱动IC是一种专为LED照明和显示屏应用设计的高性能集成电路，它具有16路等电流恒流输出特性。这种驱动器的核心优势在于其能够通过一个外部电阻精确地调整每个输出通道的电流值，确保LED灯在工作时亮度一致，减少通路间的电流差异，从而实现稳定的光效。它的应用领域广泛，包括广告显示牌、流动显示、仪表显示以及各种通用LED显示器，特别适合对颜色一致性要求较高的场合。 CC1100SWRS038D是其中一款低功耗的Sub-1GHz射频收发器，设计应用于超低功耗无线通信，如315/433/868/915MHz的工业、科学和医疗(ISM)及短程设备(SRD)频段。该射频模块集成有一个高度可配置的基带调制解调器，支持多种调制格式，数据传输速率可达500千比特每秒（kbps），提供了丰富的硬件支持，如包处理、数据缓冲、突发传输、清晰频道评估和无线唤醒等功能。操作参数方面，CC1100拥有64字节的发送和接收数据缓冲区，这使得它能够处理高效的通信任务，无论是数据的传输还是接收，都能保证在低功耗状态下稳定运行。它在自动计量读取（AMR）、工业监控与控制、智能家居和楼宇自动化等多个领域都发挥着关键作用，适应了现代物联网(IoT)对低功耗无线通信的高度需求。恒流LED驱动IC与CC1100SWRS038D这样的射频器件结合，不仅简化了LED显示系统的复杂性，还提升了系统性能和能效，对于构建高效、稳定的LED照明和显示屏解决方案至关重要。

CC1100

SWRS038D Page 16 of 92

4.7 Analog Temperature Sensor

The characteristics of the analog temperature sensor at 3.0 V supply voltage are listed in Table 10

below. Note that it is necessary to write 0xBF to the PTEST register to use the analog temperature

sensor in the IDLE state.

Parameter Min Typ Max Unit Condition/Note

Output voltage at –40°C

0.651 V

Output voltage at 0°C

0.747 V

Output voltage at +40°C

0.847 V

Output voltage at +80°C

0.945 V

Temperature coefficient 2.45

mV/°C Fitted from –20 °C to +80 °C

Error in calculated

temperature, calibrated

-2

0 2

°C From –20 °C to +80 °C when using 2.45 mV / °C,

after 1-point calibration at room temperature

The indicated minimum and maximum error with 1-

point calibration is based on simulated values for

typical process parameters

Current consumption

increase when enabled

0.3 mA

Table 10: Analog Temperature Sensor Parameters

4.8 DC Characteristics

Tc = 25°C if nothing else stated.

Digital Inputs/Outputs Min Max Unit Condition

Logic "0" input voltage 0 0.7 V

Logic "1" input voltage VDD-0.7 VDD V

Logic "0" output voltage 0 0.5 V For up to 4 mA output current

Logic "1" output voltage VDD-0.3 VDD V For up to 4 mA output current

Logic "0" input current N/A –50 nA Input equals 0V

Logic "1" input current N/A 50 nA Input equals VDD

Table 11: DC Characteristics

4.9 Power-On Reset

When the power supply complies with the requirements in Table 12 below, proper Power-On-Reset

functionality is guaranteed. Otherwise, the chip should be assumed to have unknown state until

transmitting an SRES strobe over the SPI interface. See Section 19.1 on page 42 for further details.

Parameter Min Typ Max Unit Condition/Note

Power-up ramp-up time. 5 ms From 0V until reaching 1.8V

Power off time 1 ms Minimum time between power-on and power-off

Table 12: Power-On Reset Requirements

CC1100

SWRS038D Page 18 of 92

Pin # Pin Name Pin type Description

11 AVDD Power (Analog) 1.8 -3.6 V analog power supply connection

12 RF_P RF I/O Positive RF input signal to LNA in receive mode

Positive RF output signal from PA in transmit mode

13 RF_N RF I/O Negative RF input signal to LNA in receive mode

Negative RF output signal from PA in transmit mode

14 AVDD Power (Analog) 1.8 - 3.6 V analog power supply connection

15 AVDD Power (Analog) 1.8 - 3.6 V analog power supply connection

16 GND Ground (Analog) Analog ground connection

17 RBIAS Analog I/O External bias resistor for reference current

18 DGUARD Power (Digital) Power supply connection for digital noise isolation

19 GND Ground (Digital) Ground connection for digital noise isolation

20 SI Digital Input Serial configuration interface, data input

Table 13: Pinout Overview

6 Circuit Description

BIAS

RBIAS XOSC_Q1 XOSC_Q2

CSn

SO (GDO1)

XOSC

SCLK

LNA

FREQ

SYNTH

ADC

DEMODULATOR

FEC / INTERLEAVER

PACKET HANDLER

RXFIFO

MODULATOR

TXFIFO

DIGITAL INTERFACE TO MCU

RADIO CONTROL

RF_P

RF_N

GDO2

GDO0 (ATEST)

RC OSC

Figure 2:

CC1100

Simplified Block Diagram

A simplified block diagram of

CC1100

is shown

in Figure 2.

CC1100

features a low-IF receiver. The

received RF signal is amplified by the low-

noise amplifier (LNA) and down-converted in

quadrature (I and Q) to the intermediate

frequency (IF). At IF, the I/Q signals are

digitised by the ADCs. Automatic gain control

(AGC), fine channel filtering and demodulation

bit/packet synchronization are performed

digitally.

The transmitter part of

CC1100

is based on

direct synthesis of the RF frequency. The

frequency synthesizer includes a completely

on-chip LC VCO and a 90 degree phase

shifter for generating the I and Q LO signals to

the down-conversion mixers in receive mode.

A crystal is to be connected to XOSC_Q1 and

XOSC_Q2. The crystal oscillator generates the

reference frequency for the synthesizer, as

well as clocks for the ADC and the digital part.

A 4-wire SPI serial interface is used for

configuration and data buffer access.

The digital baseband includes support for

channel configuration, packet handling, and

data buffering.

CC1100

SWRS038D Page 19 of 92

7 Application Circuit

Only a few external components are required

for using the

CC1100

. The recommended

application circuits are shown in Figure 3 and

Figure 4. The external components are

described in Table 14, and typical values are

given in Table 15.

Bias Resistor

The bias resistor R171 is used to set an

accurate bias current.

Balun and RF Matching

The components between the RF_N/RF_P

pins and the point where the two signals are

joined together (C131, C121, L121 and L131

for the 315/433 MHz reference design [5].

L121, L131, C121, L122, C131, C122 and

L132 for the 868/915 MHz reference design

[6]) form a balun that converts the differential

RF signal on

CC1100

to a single-ended RF

signal. C124 is needed for DC blocking.

Together with an appropriate LC network, the

balun components also transform the

impedance to match a 50 Ω antenna (or

cable). Suggested values for 315 MHz, 433

MHz, and 868/915 MHz are listed in Table 15.

The balun and LC filter component values and

their placement are important to keep the

performance optimized. It is highly

recommended to follow the CC1100EM

reference design [5] and [6].

Crystal

The crystal oscillator uses an external crystal

with two loading capacitors (C81 and C101).

See Section 27 on page 53 for details.

Additional Filtering

Additional external components (e.g. an RF

SAW filter) may be used in order to improve

the performance in specific applications.

Power Supply Decoupling

The power supply must be properly decoupled

close to the supply pins. Note that decoupling

capacitors are not shown in the application

circuit. The placement and the size of the

decoupling capacitors are very important to

achieve the optimum performance. The

CC1100EM reference design ([5] and [6])

should be followed closely.

Component Description

C51 Decoupling capacitor for on-chip voltage regulator to digital part

C81/C101 Crystal loading capacitors, see Section 27 on page 53 for details

C121/C131 RF balun/matching capacitors

C122 RF LC filter/matching filter capacitor (315 and 433 MHz). RF balun/matching

capacitor (868/915 MHz).

C123 RF LC filter/matching capacitor

C124 RF balun DC blocking capacitor

C125 RF LC filter DC blocking capacitor (only needed if there is a DC path in the antenna)

L121/L131 RF balun/matching inductors (inexpensive multi-layer type)

L122 RF LC filter/matching filter inductor (315 and 433 MHz). RF balun/matching inductor

(868/915 MHz). (inexpensive multi-layer type)

L123 RF LC filter/matching filter inductor (inexpensive multi-layer type)

L124 RF LC filter/matching filter inductor (inexpensive multi-layer type)

L132 RF balun/matching inductor. (inexpensive multi-layer type)

R171 Resistor for internal bias current reference.

XTAL 26MHz - 27MHz crystal, see Section 27 on page 53 for details.

Table 14: Overview of External Components (excluding supply decoupling capacitors)

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恒流LED驱动IC CC1100：低功耗无线解决方案

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