NCP81239, NCP81239A
www.onsemi.com
5
Table 2. MAXIMUM RATINGS Over operating free−air temperature range unless otherwise noted
Rating UnitMaxMinSymbol
Driver 1 and Driver 2 Positive Rails BST1,
BST2
−0.3 V wrt/PGND
−0.3 V wrt/VSW
37 V, 40 V (20 ns) wrt/PGND
5.5 V wrt/VSW
V
High Side Driver 1 and Driver 2 HSG1,
HSG2
−0.3 V wrt/PGND
−0.3 V wrt/VSW
37 V, 40 V (20 ns) wrt/GND
5.5 V wrt/VSW
V
Switching Nodes and Return Path of Driver 1 and
Driver 2
VSW1,
VSW2
−5.0 V 32 V, 40 V (20 ns) V
Low Side Driver 1 and Driver 2 LSG1,
LSG2
−0.3 V 5.5 V
PMOSFET Driver PDRV −0.3 32 V, 40 V (20 ns) V
Voltage Differential AGND to
PGND
−0.3 0.3 V
CSP1−CSN1, CSP2−CSN2 Differential Voltage CS1DIF,
CS2DIF
−0.5 0.5 V
PDRV Maximum Current PDRVI 0 10 mA
PDRV Maximum Pulse Current
(100 ms on time, with > 1 s interval)
PDRVIPUL 0 200 mA
Maximum VCC Current VCCI 0 80 mA
Operating Junction Temperature Range (Note 1) TJ −40 150 °C
Operating Ambient Temperature Range TA −40 100 °C
Storage Temperature Range TSTG −55 150 °C
Thermal Characteristics (Note 2)
QFN 32 5mm x 5mm
Maximum Power Dissipation @ TA = 25°C
Maximum Power Dissipation @ TA = 85°C
Thermal Resistance Junction−to−Air with Solder
Thermal Resistance Junction−to−Case Top with Solder
Thermal Resistance Junction−to−Case Bottom with Sol-
der
PD
PD
RQJA
RQJCT
RQJCB
4.1
2.1
30
1.7
2.0
W
W
°C/W
°C/W
°C/W
Lead Temperature Soldering (10 sec):
Reflow (SMD styles only) Pb−Free (Note 3)
RF 260 Peak °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The maximum package power dissipation limit must not be exceeded.
2. The value of QJA is measured with the device mounted on a 3in x 3in, 4 layer, 0.062 inch FR−4 board with 1.5 oz. copper on the top and
bottom layers and 0.5 ounce copper on the inner layers, in a still air environment with T
A = 25°C.
3. 60−180 seconds minimum above 237°C.
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