The preparation of AZO/a-Si/c-Si heterojunction structure
on p-type silicon substrate for solar cell application
Shuoshuo Xu
a,
n
, Zongcun Liang
a,
n
, Hui Shen
a,b
a
Institute for Solar Energy Systems, Sun Yat-Sen University, Guangzhou 510275, P.R. China
b
ShunDe SYSU Institute for Solar Energy, Foshan 528300, P.R. China
article info
Article history:
Received 30 May 2014
Accepted 17 September 2014
Available online 26 September 2014
Keywords:
Thin films
AZO/a-Si/c-Si heterojunction
Passivation
Solar energy materials
abstract
An AZO/a-Si/c-Si heterojunction structure was prepared by PECVD and MBE systems. The electrical
properties of the AZO/a-Si/c-Si heterojunction structure have been carried out by means of I–V and
minority carrier lifetime measurements. The AZO/a-Si/c-Si heterojunction devices annealed in low
temperatures lead to effects of the passivation of the surface and bulk of Si, while the annealing of
AZO/a-Si/c-Si heterojunction devices in higher temperatures will cause a larger dark current and lower
minority carrier lifetime.
& 2014 Elsevier B.V. All rights reserved.
1. Introduction
Zinc oxide (ZnO) is a promising wide-band-gap semiconductor
for various applications such as hetero-junction solar cells [1],
light-emitting diodes [2], and transparent conducting electrodes
[3]. The characteristics of ZnO/p-Si heterojunction [4–6] and
n-ZnO nanorods/p-Si heterojunction [7–9] devices have been
widely investigated for the fabrication of efficient and low-cost
optoelectronic devices. At the same time, the ZnO/Si hetero-
junction solar cells have been studied for its potentially
high conversion-efficient and cost-effective solar cells [1,10,11].
However, the ZnO/Si heterojunction solar cells always apply a ZnO/
n-Si heterojunction structure, and the ZnO/p-Si heterojunction
solar cells have been hardly reported for the conversion efficient
performance. At the same time, using the ZnO thin film as an
emitter layer will cause a high interface state density, resulting in a
lower open circuit voltage (V
oc
) [10]. To obtain a lower interface
state density, a SiO
x
layer is deposited to passivate the surface of Si
[11,12]. However, the thickness of the SiO
x
layer deposed in a very
high temperature with best passivation is always limited to
about 2 nm [11] , which is hard to control precisely.
The heterojunction with intrinsic thin layer (HIT) solar cells
have a very high conversion efficiency of over 23.0% by the
deposition of a high quality intrinsic amorphous silicon (a-Si)
layer [13]. This a-Si layer could drastically reduce surface recom-
bination and passivate the surface of c-Si [14], leading to the best
passivation results so far. The a-Si layer is always deposited by
the conventional plasma enhanced chemical vapor deposition
(PECVD) process. The deposition of a-Si layer is a low temperature
(below 230 1C) processing and the thickness is about 10 nm
[13,15], which is easy to control. However, the a-Si thin film in a
high temperature environment will cause that the hydrogen ions
to overflow from the a-Si [16]. The high temperature in the
deposition [5,6,10,17] or annealing process [1,17] of the ZnO thin
film prevents the ZnO/a-Si/c-Si structure from an efficient p–i–n
heterojunction. For preparing an efficient p–i–n heterojunction,
the temperature in the deposition of the ZnO thin film should be
chosen for the best device performance.
In this study, p-Si substrat es, on which the main commercial
photov oltaic production was based for low-cost produce, were used
to form an aluminum doped ZnO (AZO)/a-Si/c-Si hetero-
junction structure as an efficient p–i–njunctionbydepositingan
intrinsic a-Si thin film about 10 nm and an AZO thin film of n-type
behavior on p-Si substrates in low temperatures (below 230 1C). For
choosing the suitable temperatures of the deposition, the samples
were annealed at different temperatures to understand the behavior of
passivation of a-Si thin film and the device performance of the p–i–n
heterojunction which were prepared with different temperatures. The
annealing of AZO/a-Si/c-Si heterojunction devices in a low processing
temperature (250 1C) will enhance the surface passivation of Si wafer ,
while annealing in a higher temperature (above 340 1C) will drastically
reduce the passiv ation.
2. Material and methods
p-Type (100) Si (3.6–3.8 Ω cm) wafer was cleaned by HF (10%)
for 2 min. Then, an intrinsic a-Si layer of a thickness of about
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journal homepage: www.elsevier.com/locate/matlet
Materials Letters
http://dx.doi.org/10.1016/j.matlet.2014.09.066
0167-577X/& 2014 Elsevier B.V. All rights reserved.
n
Corresponding author.
E-mail addresses: xushuoshuo00@163.com (S. Xu),
liangzc@mail.sysu.edu.cn (Z. Liang).
Materials Letters 137 (2014) 428–431