leadframe technology
时间: 2024-06-05 12:09:11 浏览: 24
Leadframe technology is a manufacturing process used in the semiconductor industry to package integrated circuits (ICs). Leadframes are thin metal frames that provide a physical and electrical connection between the IC and the outside world. The leadframes are made of a copper-based alloy and are typically coated with a layer of nickel or palladium to prevent corrosion.
The leadframe technology involves a series of steps, including stamping, plating, and forming. The stamping process cuts the leadframe from a strip of metal, while the plating process adds a layer of metal to the leadframe to improve its electrical conductivity. The forming process shapes the leadframe into the required configuration for the specific IC package.
Leadframe technology is widely used in the production of small and medium-sized IC packages, such as quad flat packages (QFPs) and small outline integrated circuits (SOICs). It offers several advantages over other packaging technologies, including low cost, high reliability, and good thermal performance.
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