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PCI Express M.2 Specification
PCI Express M.2 Specification | 17
Revision 1.1, March 7, 2016
Table 36. Socket 3 System Interface Signal Table .............................................................................. 151
Table 37. Socket 3 SATA-based Module Pinouts (Module Key M) ..................................................... 154
Table 38. Socket 3 PCIe-based Module Pinouts (Module Key M)....................................................... 155
Table 39. BGA SSD System Interface Signal Table ............................................................................ 156
Table 40. DC Specification for 3.3 V Logic Signaling .......................................................................... 163
Table 41. DC Specification for 1.8 V Logic Signaling .......................................................................... 164
Table 42. Power Ramp Timing ............................................................................................................ 166
Table 43. Power Rail Slew Rate .......................................................................................................... 167
Table 44. Key Regulated Power Rail Parameters ............................................................................... 168
Table 45. Key VBAT Power Rail Parameters ...................................................................................... 168
Table 46. Power Rating Table for M.2 Modules with Connectors........................................................ 169
Table 47. Mechanical Key Assignments .............................................................................................. 171
Table 48. Socket 1 Versions ................................................................................................................ 172
Table 49. Display Port Based Socket 1 Pinout Diagram (Mechanical Key A) On Platform ................ 174
Table 50. SDIO Based Socket 1 Pinout Diagram (Mechanical Key E) On Platform ........................... 176
Table 51. Socket 2 Module Configuration Table .................................................................................. 178
Table 52. Socket 2 Pinouts Diagram (Mechanical Key B) On Platform ............................................... 180
Table 53. Socket 2 Pinout Diagram (Mechanical Key C) on Platform ................................................. 182
Table 54. Socket 3 SSD Pinout (Mechanical Key M) On Platform ...................................................... 183
Table 55. Signal Integrity Requirements and Test Procedures for M.2 ............................................... 193
Table 56. Example of Prepared Wire with Plug, Unit: mΩ ................................................................... 205
Table 57. Contact Resistance for the Sample Wires/Plugs, Unit: mΩ ................................................. 206
Table 58. Assumptions for Typical Components and Dissipation........................................................ 207
Table 59. Maximum Dissipation for WWAN Modules .......................................................................... 208
Table 60. Generic Assumptions for Package Designations and Types Expected to
Populate Modules ................................................................................................................ 208
Table 61. Assumptions for Generic System Environments ................................................................. 209
Table 62. Slot Definitions, Systems with Fans ..................................................................................... 210
Table 63. Slot Definitions, Systems without Fans ................................................................................ 210
Table 64. Example Use Case Applicable to Modules for Notebooks .................................................. 213
Table 65. Thermal Design Power Response – Notebook Category .................................................... 217
Table 66. Skin Temperature Limit Assumptions, Notebook ................................................................. 217
Table 67. Skin Temperature Effect of Module Position ....................................................................... 218
Table 68. Use Cases Applicable to Modules for Thin Platform Notebook with Fan ........................... 218
Table 69. Thermal Design Power Response – Thin Platform Notebook with Fan Category ............... 223
Table 70. Skin temperature limit assumptions, Thin platform notebook with Fan ............................... 223
Table 71. Use Cases Applicable to Modules for Tablet without Fan ................................................... 224
Table 72. Thermal Design Power Response—Tablet Category .......................................................... 227
Table 73. Skin Temperature Limit Assumptions, Tablet without Fan .................................................. 228