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Q/W ××—2008
I
目录
前言 ...............................................................................................................................................................................I
1 范围.......................................................................................................................................................................1
2 规范性引用文件...................................................................................................................................................1
3 术语和定义...........................................................................................................................................................1
3.1
定义
...............................................................................................................................................................1
3.1.1 电阻...........................................................................................................................................................................1
3.1.2 电容...........................................................................................................................................................................1
3.1.3 电感...........................................................................................................................................................................1
3.1.4 晶振...........................................................................................................................................................................1
3.1.5 IC................................................................................................................................................................................1
3.1.6 电连接器...................................................................................................................................................................1
3.1.7 BGA ...........................................................................................................................................................................1
3.2
封装术语缩写
...............................................................................................................................................1
4 焊盘命名规范.......................................................................................................................................................2
4.1 SMD
焊盘命名规范
.......................................................................................................................................2
4.1.1 长方形/正方形焊盘命名规范 ..................................................................................................................................2
4.1.2 椭圆/圆形焊盘命名规范 ..........................................................................................................................................3
4.1.3 自定义 SMD 焊盘的命名规范.................................................................................................................................3
4.2 PTH
焊盘命名规范
........................................................................................................................................4
4.2.1 PTH 焊盘 ...................................................................................................................................................................4
4.2.2 定位孔.......................................................................................................................................................................5
4.2.3 过孔...........................................................................................................................................................................5
4.2.4 自定义 PTH 焊盘命名规范......................................................................................................................................6
4.3 NPTH
焊盘命名规范
.....................................................................................................................................6
4.3.1 规则 NPTH 焊盘命名规范.......................................................................................................................................6
4.3.2 不规则 NTPH 焊盘命名规范...................................................................................................................................7
5 PCB 封装命名规范 ...............................................................................................................................................7
5.1
电阻类封装命名规范
...................................................................................................................................7
5.1.1 SMD 电阻 ..................................................................................................................................................................7
5.1.2 SMD 排阻 ..................................................................................................................................................................8
5.1.3 SMD 电位器 ..............................................................................................................................................................8
5.1.4 DIP 电阻 ....................................................................................................................................................................8
5.1.5 SIP 电阻 .....................................................................................................................................................................9
5.1.6 DIP 电位器.................................................................................................................................................................9
5.2
电容类封装命名规范
...................................................................................................................................9
5.2.1 SMD 无极性电容 ......................................................................................................................................................9
5.2.2 SMD 无极性排容 ....................................................................................................................................................10