Absolute Maximum Ratings
V
DD18
to EP* .......................................................-0.3V to + 1.9V
V
DDIO
to EP* ........................................................-0.3V to +3.6V
V
DDA
TO EP*........................................................ -0.3V to +1.1V
V
DDD
to EP* .........................................................-0.3V to +1.1V
SIOAP, SIOAN, SIOBP, SIOBN to EP* .................. -0.3V to 1.9V
GPIO, PWDNB, TXOUT to EP*
X1/OSC, X2 to EP*................................................. -0.3V to 3.6V
SIOAP, SIOAN, SIOBP, SIOBN short circuit to EP or
VDD18..................................................................-0.3V to +1.9V
Continuous Power Dissipation, TA = +70°C ( Multi-Layer Board
(derate 40mW/°C above +70°C)) ................................ 3200m/W
Operating Temperature Range ........................-40ºC to +105 ºC
Junction Temperature .....................................................+150°C
Storage Temperature Range............................ -40°C to +150°C
Soldering Temperature (reflow).......................................+260°C
*EP connected to IC ground
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Package Information
56-Pin TQFN
Package Code T5688+6
Outline Number 21-0135
Land Pattern Number 90-100041
Thermal Resistance, Single-Layer Board:
Junction to Ambient (θ
JA
) 35°C/W
Junction to Case (θ
JC
) 1°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
) 25°C/W
Junction to Case (θ
JC
) 1°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
( V
DD18
= 1.7V to 1.9V, V
DDD
= V
DDA
= 0.95V to 1.05V, V
DDIO
= 1.7V to 3.6V, R
L
= 100Ω +1% (differential), T
A
= -40°C to +105°C, EP connected to
PCB ground, typical values are at V
DD18
= V
DDIO
= 1.8V, V
DDD
= V
DDA
= 1.0V, T
A
= 25°C, unless otherwise noted. (Note 1) )
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC ELECTRICAL CHARACTERISTICS / Reverse Channel Serial Outputs (SIOA±, SIOB±)
High drive with register settings for
187.5Mbps
190 250 310
Output Voltage Swing V
OD
High drive with register settings for
1.5Gbps
280 370 460
mV
MAX96752/MAX96754 GMSL2 Deserializer with Dual LVDS (oLDI) Output
www.maximintegrated.com
Proprietary and Confidential. Preliminary Information -
subject to change without notice.
Maxim Integrated | 4