"上海博通BK3266蓝牙音频SoC芯片详细资料"

The BK3266 Datasheet V1.1.pdf provides detailed information about the BK3266 Bluetooth Audio SoC developed by Beken Corporation in Shanghai, China. This audio chip is designed for use in Bluetooth headphones, speakers, and true wireless stereo (TWS) devices. The datasheet, marked as proprietary and confidential, contains 42 pages of technical specifications, circuit diagrams, and performance details. The Beken Corporation, located at 41,1387 Zhangdong Rd, Shanghai 201203, China, can be contacted at phone number (86)21 5108 6811 and fax number (86)21 6087 1089. The company's disclaimer states that the information in the datasheet is confidential and should not be shared without written permission. Overall, the BK3266 Bluetooth Audio SoC is a cutting-edge solution for audio products, providing high-quality sound and reliable Bluetooth connectivity. Its features and performance make it a preferred choice for manufacturers seeking to create innovative and advanced audio devices. With its proprietary technology and commitment to quality, Beken Corporation continues to be a leader in the audio semiconductor industry.