System on a Chip设计：设备与组件概览

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"高清英文版Design of System on a Chip——Devices & Components" 本书是关于系统级芯片（System on a Chip, SOC）设计的一部专业著作，由Ricardo Reis和Jochen A. G. Jess编辑，涵盖了从基础到高级的各种主题。SOC是一种将多个电子系统集成在单个芯片上的技术，广泛应用于数字电路设计、微控制器单元（MCU）和超大规模集成电路（VLSI）领域。书中内容包括： 1. **Designs of System on a Chip - Introduction**：这部分由R. Reis和J. A. G. Jess撰写，为读者提供了SOC设计的基础知识，包括概念、设计流程、挑战以及未来发展趋势。它强调了在有限的空间和功耗限制下，如何高效地整合多种功能模块。 2. **BJT Modeling with VBIC**：C.C. McAndrew探讨了双极型晶体管（BJT）的VBIC（垂直双极集成电路）模型。VBIC是一种用于模拟BJT行为的电路模型，对于混合模拟-数字电路的设计和仿真至关重要。 3. **A MOS Transistor Model for Mixed Analog-digital Circuit Design and Simulation**：M. Bucher、C. Lallement、F. Krummenacher和C. Enz介绍了MOS晶体管模型，这种模型专为混合模拟-数字电路设计和仿真而设计，对于理解和优化这类电路的性能具有重要意义。 4. **Efficient Statistical Modeling for Circuit Simulation**：C.C. McAndrew进一步讨论了电路模拟中的统计建模方法，这是在处理工艺变化和不确定性时提高设计效率的关键。 5. **Retargetable Application-driven Analog-digital Block Design**：J. E. Franca阐述了可重定向的应用驱动模拟-数字块设计，这是一种灵活的设计方法，允许根据特定应用需求定制SOC的组件。 6. **Robust Low Voltage Power Analog VLSI Design**：T. B. Tarim、C.H. Lin和M. Ismail专注于低电压电源模拟VLSI设计，这对于实现低功耗和高能效的电子设备至关重要。 7. **Ultralow-Voltage Memory Circuits**：K. Itoh介绍了工作在极低电压下的内存电路设计，这些电路能够在极端条件下保持数据存储，是便携式和物联网设备的重要组成部分。 8. **Low-Voltage Low-Power High-Speed I/O Buffers**：R. Leung研究了低电压、低功耗、高速输入/输出缓冲器的设计，这是连接SOC内部和外部世界的关键，同时满足速度和能效要求。 9. **Microelectronics Toward 2010**：这部分可能探讨了2010年前后微电子技术的前景和趋势，包括技术进步、市场发展以及可能面临的挑战。该书不仅适合于学术研究人员，也适用于电子工程领域的工程师和学生，他们可以通过这些深入的章节了解和掌握SOC设计的最新进展和技术。通过这本书，读者可以学习到如何应对设计复杂性、降低功耗、提高性能以及实现更高效的电路集成。

1.Design o f Systems on a Chip: Introduction 15

enabling everybody to assemble websites from locally distributed data. This

way there arises a web of contents, where the physical links are no longer

visible (and relevant) and are replaced by conceptual links, which are

supposed “to make sense”. Together with powerful browsers, servers,

routers and a versatile mail facility (enhanced by the “attachment” option) a

new world has been opened spawning a wealth of business activity. Today

the makers of consumer products, mobile phones and the computer industry

are engaged in a fierce competition for a major share in web technology.

It is not surprising that the simultaneous appearance of mobile phones

and web services on the market created a major shockwave by itself. To

begin with the social opposition to the technological innovation was low.

While problems like the energy shortage, global warming and traffic

congestion created powerful oppositional activities the complaints against

information technology touched issues like the possible radiation damage by

the use of mobile phones or the density of antennas for mobile

communication on buildings. Also there was the traditional criticism on the

content of the media (notably television) and the fear regarding the

disruption of social structures by the overuse of communication media. But

all this did not coagulate to a movement powerful enough to put a halt to the

enthusiasm of the public when adapting the new media. The public

resistance that belongs to the daily grief of managers in the nuclear and

chemical industry and the board chairmen of the car and airplane

manufacturers (and that’s not to mention the managers of airports!) was

almost totally absent when it came to Internet and mobile phones. Indeed,

many of those technologies were deemed capable of resolving some of the

mobility and congestion problems we experience every day. Looking at the

market developments the term “new economy” reached the newspaper

columns and talk show presentations, denoting the combined phenomenon of

steep economic growth and low inflation rates (at least in the US and

Europe!).

In the meantime (in the summer of 2001) we seem to be back to the old

economy again. The year 2001 definitely stopped the boom of the

information technology. In Central Europe and the US inflation is back on

the agenda. The growth of Internet use stagnates. The sales in computers and

mobile equipment decrease spectacularly. The transition to the third

generation of mobile phone service, the so-called “Universal Mobile

Telecommunication Service” (UMTS), may have to be postponed for several

years. This undermines the financial position of a number of European

telecommunication service providers, who had to acquire sizable loans to

buy the licenses for the appropriate frequency bands and to prepare for the

huge investments in new technical infrastructure. Those phenomena backfire

on the chipmakers. Sales of chips have been down by thirty percent or more

16 Chapter 1

recently. Fabrication lines run on half of their usual load. Consequently large

orders for chip manufacturing equipment have been cancelled.

As if all this wasn’t enough this went along with a major collapse of the

stock market. It started with a major shakeout between Internet providers

and servers for “Electronic Commerce” with insufficiently stable business

models. It then reached out for the telecommunication providers. The shares

of some of those lost 90% of their value within a few months. Thus there

evaporated the potential to finance new infrastructure by issuing new shares.

Is this the end of information technology? Is roadmapping a pointless

exercise from now on? It is hard to believe. But there is no doubt that growth

rates such as those of the most recent years will not come back for some

time. Eventually the roadmap may experience some delay. This delay is not

the result of physical limitations or our inability to install the technology.

Rather the market will impose its pace of acceptance of the new products

and services. Yet the potential of the Silicon technology is far from

exhausted. More than that: there is a growing need of products and services

for communication in view of the limits of mobility end energy in order to

maintain the world trade. But it may be necessary to pay more attention to

the voice of the market. Rather than just putting down a roadmap for the

technology, coordinated planning between technologists, product makers and

service providers may be necessary to control the business risk. For instance

the total infrastructure of optical fiber backbones is reported to exhibit an

overcapacity of two to three orders of magnitude. The rates for international

calls (or even intercontinental calls) are in the same range as those for local

calls. On the other hand the bandwidth limitations in the residential

subscriber loop are still impairing the use of Internet for the common user.

On one hand DSL and ADSL are expensive for such a user. On the other

hand the common user is likely to have requests needing a lot of bandwidth.

While he can acquire a digital camcorder for a reasonable price he hardly

can afford to mail even small pieces of his videos to his friends and relatives

as an attachment to a mail message. Also the downloading or display of

video content via Internet meets with serious bandwidth limitations.

If investment is scarce it may be worthwhile to complement the

semiconductor roadmap with service and bandwidth roadmaps. The results

of such a planning activity may guide investments to more long-term profit

to the benefit of everybody. The gold rush phenomenon of the late nineties

may prove too wasteful and may destroy the investment into many years of

research.

1.Design o f Systems on a Chip: Introduction 1

5. THE FIRST BOOK: SEMICONDUCTOR

DEVICES AND COMPONENTS

This book is the first of two volumes addressing the design challenges

associated with new generations of the semiconductor technology. The

subjects deal with issues closely related to the epicenter of. The various

chapters are the compilations of tutorials presented at workshops in Brazil in

the recent years by prominent authors from all over the world. In particular

the first book deals with components and circuits. To begin with device

models have to satisfy the conditions to be computationally economical in

addition to being accurate and to scale over various generations of

technology. Colin McAndrew’s paper addresses bipolar transistors while

Matthias Bucher and Christian Enz deal with MOS transistor models.

An important problem is that of statistical variations of process

parameters. Those variations translate into variations of circuit behavior

which are directly related to the so-called “parametric yield loss” associated

with the mass production of chips. In a second contribution by Colin

McAndrew we learn about how to deal with statistical variations when

performing circuit simulation. This is a matter of computational efficiency

and sound physical analysis and eventually may decide about the issue of

“design for manufacturability”.

The next level of complexity is that of circuit components. The fast

transition between consecutive generations of technology and causes the

complete redesign of circuits for every new technology generation to be

uneconomical. Therefore José Franca discusses an approach to generate

blocks like data converters, amplifiers and filters and assemble them to form

systems matching a range of applications and technologies. The four main

ingredients of such a methodology are optimized system level partitioning,

technology adaptation by appropriate component design, efficient Silicon

area use by sophisticated area planning techniques and finally advanced wire

analysis and route planning.

While it obvious that the main advances in technology are associated

with the shrinking of the lateral pitches of transistors and wires technologists

decided that the small features could actually only put to use if the signal

levels would be scaled down. So from 1994 onwards the standard supply

voltage of 5 Volt was replaced by 3 Volts. The further progress of Silicon

technology shows a continued decrease of supply voltage levels all the way

to 0,9 Volt. This is the essential measure to control power dissipation in the

Silicon structures. Yet the threat is in contaminating phenomena that don’t

scale with the supply voltage such as for instance random parameter

variations. A group of authors headed by M. Ismail deals with low power

low voltage square law CMOS composite transistors and design techniques

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