侧泵浦脉冲LD镁锂石榴石电光谐振腔dumped 1123 nm Nd: YAG激光器:高峰值功率短脉宽

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"这篇研究论文报道了一种利用脉冲激光二极管(LD)侧泵浦的MgO掺杂的LN晶体电光调制器实现的腔弃式1123纳米Nd:YAG激光器,该激光器具有窄脉冲宽度和高峰值功率。通过优化808纳米脉冲激光二极管侧泵浦的陶瓷Nd:YAG棒的折叠双凹腔结构设计,实验中得到了最大脉冲能量39.6 mJ和峰值功率9.73 MW的输出脉冲,对应的重复频率为100 Hz,脉冲宽度为4.07 ns。" 这篇研究涉及的知识点包括: 1. **电光调制器(Electro-Optic Modulator, EOM)**:MgO:LN电光调制器在激光系统中起到了关键作用,它利用电场对光波的折射率进行改变,从而控制光的相位或振幅,实现对激光的调制。在这种情况下,它被用于腔弃式激光器中,以控制激光的输出脉冲。 2. **腔弃式激光器(Cavity-Dumped Laser)**:腔弃式激光器是一种特殊类型的激光器,它通过在激光谐振腔内插入一个可开关的元件(如电光调制器)来选择性地允许某些激光脉冲通过,而将其他脉冲“抛弃”,从而实现对激光脉冲的控制,例如调整脉冲宽度和重复频率。 3. **Nd:YAG激光器**:Nd:YAG(钕掺杂钇铝石榴石)是一种常见的固态激光材料,Nd离子作为激活剂,能够吸收808纳米的泵浦光并发射1123纳米的激光。在本文中,陶瓷Nd:YAG棒作为激光介质,由脉冲激光二极管侧泵浦,提高了效率和稳定性。 4. **脉冲激光二极管(Pulsed Laser Diode, Pulsed LD)**:与连续工作的激光二极管不同,脉冲激光二极管可以提供短脉冲的高能量光输出,适合用于泵浦固态激光器。文中提到的808纳米脉冲激光二极管用于激发Nd:YAG棒。 5. **光学谐振腔设计**:研究中采用的是折叠双凹腔设计,这种结构有助于提高激光器的增益,并优化光束质量,同时允许在有限的空间内实现高功率输出。 6. **激光参数**:文章报告的最大脉冲能量39.6 mJ和峰值功率9.73 MW,以及100 Hz的重复频率和4.07 ns的脉冲宽度,这些都是评估激光性能的重要指标。高脉冲能量和峰值功率表明该激光器能在短时间内释放大量能量,适用于高能应用;而窄脉冲宽度意味着更高的时间分辨率,对某些应用(如激光加工、测距或医学成像)至关重要。 7. **开放获取出版**:该论文在《高功率激光科学与工程》期刊上发表,遵循Creative Commons Attribution许可证,允许无限制的再使用、分布和复制,只要原始工作得到适当引用,这符合开放获取出版的原则。 8. **科研机构**:研究者来自中国西北大学的多个实验室,包括国家光电技术与功能材料重点实验室(文化基地)、陕西省固体激光及应用工程技术研究中心和陕西省光电技术省级重点实验室,这些机构在中国激光科技领域具有重要地位。 该研究展示了在电光调制器的帮助下,如何通过精细设计激光器结构来实现高性能的脉冲Nd:YAG激光器,这对于需要高功率、窄脉冲的工业和科研应用具有重要意义。

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n the present research, a hybrid laser polishing technology combining pulsed laser and continuous wave laser was applied to polish the surface of laser directed energy deposition (LDED) Inconel 718 superalloy components. The surface morphology, microstructure evolution and microhardness of the as-fabricated, the single pulsed laser polishing (SPLP) and the hybrid laser polishing (HLP) processed samples were investigated. The results revealed that the as-fabricated sample has a rough surface with sintered powders. In the matrix, the NbC carbide and Cr2Nb based Laves phase array parallel to the build direction and the small γʺ-Ni3Nb particles precipitate in matrix uniformly. The surface roughness of the as-fabricated sample is 15.75 μm which is decreased to 6.14 μm and 0.23 μm by SPLP and HLP processing, respectively. The SPLP processing refines the grains and secondary phase significantly in the remelted layer which is reconstructured with the cellular structure and plenty of substructures. The HLP processing also refines the grain and secondary phase but the secondary phases still exhibit array distribution. In addition, the tangled dislocations pile up along the interface of secondary phases. Compared with the as-fabricated sample, the SPLP processing decreases the surface microhardness but the HLP processing increases the surface microhardness, and the Young's elasticity modulus of surface layer is improved by SPLP and HLP processing to 282 ± 5.21 GPa and 304 ± 5.57 GPa, respectively. 翻译

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