Electronics, Volume 38, Number 8, April 19, 1965
The future of integrated electronics is the future of electron-
ics itself. The advantages of integration will bring about a
proliferation of electronics, pushing this science into many
new areas.
Integrated circuits will lead to such wonders as home
computersor at least terminals connected to a central com-
puterautomatic controls for automobiles, and personal
portable communications equipment. The electronic wrist-
watch needs only a display to be feasible today.
But the biggest potential lies in the production of large
systems. In telephone communications, integrated circuits
in digital filters will separate channels on multiplex equip-
ment. Integrated circuits will also switch telephone circuits
and perform data processing.
Computers will be more powerful, and will be organized
in completely different ways. For example, memories built
of integrated electronics may be distributed throughout the
machine instead of being concentrated in a central unit. In
addition, the improved reliability made possible by integrated
circuits will allow the construction of larger processing units.
Machines similar to those in existence today will be built at
lower costs and with faster turn-around.
Present and future
By integrated electronics, I mean all the various tech-
nologies which are referred to as microelectronics today as
well as any additional ones that result in electronics func-
tions supplied to the user as irreducible units. These tech-
nologies were first investigated in the late 1950s. The ob-
ject was to miniaturize electronics equipment to include in-
creasingly complex electronic functions in limited space with
minimum weight. Several approaches evolved, including
microassembly techniques for individual components, thin-
film structures and semiconductor integrated circuits.
Each approach evolved rapidly and converged so that
each borrowed techniques from another. Many researchers
believe the way of the future to be a combination of the vari-
ous approaches.
The advocates of semiconductor integrated circuitry are
already using the improved characteristics of thin-film resis-
tors by applying such films directly to an active semiconduc-
tor substrate. Those advocating a technology based upon
films are developing sophisticated techniques for the attach-
ment of active semiconductor devices to the passive film ar-
rays.
Both approaches have worked well and are being used
in equipment today.
Cramming more components
onto integrated circuits
With unit cost falling as the number of components per
circuit rises, by 1975 economics may dictate squeezing as
many as 65,000 components on a single silicon chip
By Gordon E. Moore
Director, Research and Development Laboratories, Fairchild Semiconductor
division of Fairchild Camera and Instrument Corp.
The author
Dr. Gordon E. Moore is one of
the new breed of electronic
engineers, schooled in the
physical sciences rather than in
electronics. He earned a B.S.
degree in chemistry from the
University of California and a
Ph.D. degree in physical
chemistry from the California
Institute of Technology. He was
one of the founders of Fairchild
Semiconductor and has been
director of the research and
development laboratories since
1959.
The experts look ahead