Threading dislocation annihilation in the GaN layer on cone patterned
sapphire substrate
S.R. Xu
a,
⇑
, P.X. Li
b
, J.C. Zhang
a
, T. Jiang
a
, J.J. Ma
a,b
, Z.Y. Lin
a
, Y. Hao
a
a
Key Lab of Wide Band-Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi’an 710071, China
b
School of Technical Physics, Xidian University, Xi’an 710071, China
article info
Article history:
Received 14 April 2014
Received in revised form 12 June 2014
Accepted 18 June 2014
Available online 26 June 2014
Keywords:
GaN
PSS
MOCVD
TEM
abstract
The microstructure of an epilayer structure for the blue light-emitting diode grown on a cone patterned
sapphire substrate was characterized by high-resolution X-ray diffraction, atomic force microscopy and
transmission electron microscopy (TEM). Cross-sectional TEM revealed that most of the dislocations,
which originated from planar region, propagated laterally toward the cone region during the lateral
growth process. This change of the propagation direction prevented the dislocations from penetrate
the epitaxy film and thus principally led to a drastic reduction in the threading dislocation density in
GaN films. Particularly, we proposed that the six f1
101g semipolar facets play a very important role dur-
ing the bending process.
Ó 2014 Elsevier B.V. All rights reserved.
Gallium nitride and related compound materials have been
extensively studied because of their importance application in
light-emitting diodes (LEDs), laser diodes, high-frequency, and
high-power devices. Due to the high prices and small size of bulk
GaN substrates [1–4]. GaN is typically grown heteroepitaxially on
foreign substrates. In general, the performance of GaN-based LED
is strongly dependent on threading dislocations (TDs) density,
which is inherent to the epitaxial GaN caused by large mismatch
in lattice constant and thermal expansion coefficient to the sub-
strate. The most famous and useful technology is the epitaxial lat-
eral overgrowth (ELOG) which uses the strip-mask patterns to
block the propagation of TDs [5]. Although the ELOG technique
can reduce the TDs effectively, the process needs to suffer from
growth interruption due to the mask deposition, and there is a high
TDs density window region in the overgrowth layer. In order to
solve this problem, the mask-free patterned substrate (PSS) tech-
nology becomes very popular for high-efficiency InGaN/GaN-based
LEDs of commercial production and institute research [6,7]. How-
ever, most of the studies related to PSS have focused on evaluating
the device’s capability, in-depth understanding the mechanism of
the annihilation of TDs and compared with the traditional ELOG
was lack in the literature [8,9].
This study investigates the distribution and the annihilation
mechanism of defects in GaN film grown on cone shape patterned
sapphire substrates using a high-resolution X-ray diffraction
(HRXRD), scanning electron microscope (SEM), transmission elec-
tron microscope (TEM), atomic force microscopy (AFM). The mech-
anism of TDs reduction due to the TDs bending toward cone
substrates was revealed.
The pattern of the PSS used here was fabricated by standard
photolithography and subsequent inductively coupled plasma dry
etching to form an array of cone on the c-plane surface. The height
of the cone ranged from 1.4
l
m to 1.5
l
m. This type PSS is formed
smoothly and arranged uniformly as shown in Fig. 1. The epitaxial
structures of the LED structure on PSS and planar substrate
reported here was grown in a low-pressure metal organic chemical
vapor deposition (MOCVD) reactor. The substrate was cleaned
under H
2
ambient at 1040 °C. Then, a 25 nm thick low temperature
GaN nucleation layer was grown at 560 °C. The LED structures con-
sist of an unintentionally doped GaN layer (GaN: ud, 4
l
m), a Si-
doped n-type GaN layer (n-GaN:Si, 3
l
m), a five-period InGaN/
GaN MQW active region (250 nm), and finally a Mg-doped p-type
GaN (p-GaN:Mg) hole injection layer (200 nm). The TEM samples
were prepared by mechanical polishing before ion beam thinning
to electron transparency in cross-section, and the TEM images
were acquired on a Tecnai G2 F20 S-Twin.
Fig. 2(a and b) shows HRXRD
x
-scan rocking curves of the sym-
metric (002) and asymmetric (102) reflections for both LEDs
structures on PSS and planar substrates, respectively. The full
width at half maximum (FWHM) of the symmetry (0 02)
x
-scan
rocking curve for GaN on PSS (258 arc sec) was found to be smaller
than that of on the planar substrates (268 arc sec), whereas the
FWHM of the asymmetry (102) rocking curve on PSS was much
http://dx.doi.org/10.1016/j.jallcom.2014.06.113
0925-8388/Ó 2014 Elsevier B.V. All rights reserved.
⇑
Corresponding author. Fax: +86 029 88201660.
E-mail address: shengruixidian@126.com (S.R. Xu).
Journal of Alloys and Compounds 614 (2014) 360–363
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