5G时代PCB设计新挑战：材料选择与解决方案详解

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"《ROGERS-FEB-E-Book-2018.pdf》是一本专注于5G移动通信系统设计的电子书，特别强调了PCB（印制电路板）在新一代无线网络中的关键角色。5G技术对性能的极高要求对PCB设计提出了前所未有的挑战，包括但不限于天线部分和放大器电路部分的设计。书中指出，传统的PCB效应，如铜箔表面粗糙度、介电常数（Dielectric Constant, DK）变化、散热问题、无源互调（Passive Intermodulation, PIM）、热膨胀系数和材料厚度的稳定性等，对5G电路系统的性能影响显著，远超以往几代通信技术。该电子书由John Coonrod和Rogers Corporation的其他专家合作撰写，他们提供了关于射频/微波材料的最新技术和解决方案。例如，章节"挑选5G电路材料"探讨了如何根据不同的5G功率放大器工作频率选择最适合的电路材料，如RO3003、RO4350B、RO4003C以及各种复合材料，如PTFE/WGDk3.2和PTFE/WG/Ceramic，以及FR-4标准，强调了温度变化对材料性能的影响。 "5G:是否已经准备起飞?"一章由James Kimery撰写，可能涉及5G技术在大规模机器类型通信（MTC）和超可靠低延迟通信（URLLC）场景下的应用，以及这些应用对PCB设计需求的具体分析。此外，Art Aguayo的章节"5G和物联网材料的机会"可能会深入讨论5G技术与物联网（IoT）融合时，如何通过优化PCB材料来提升系统的整体性能和可靠性。这本书为5G时代的PCB设计师提供了实用的指导，帮助他们理解和应对5G带来的设计难题，确保下一代无线通信系统的高效、稳定和可靠运行。"

but the shape and structure of 5G NR has been crystal-

izing for several months. “Final” solutions will inevitably

need some tweaking to meet the standard; however,

progress toward the creation of the ecosystem has al-

ready started with a path toward commercialization.

Service operators have announced 5G plans in all

shapes and sizes: SKT and KT are gearing up for 5G

trial services to accompany the 2018 PyeongChang

Winter Olympics in South Korea. In the U.S., Verizon

has aggressively purchased spectrum in the 28, 37 and

39 GHz bands and driven the development of the 5GTF

standard, primarily for ber to the premises (FTTP) ap-

plications. Verizon has been trialing pre-commercial

equipment in 11 cities in the U.S. since the beginning

of this year and announced plans for initial commercial

deployments in 2018. T-Mobile, the big winner in this

year’s FCC auction, won 31 MHz of spectrum around

600 MHz and announced plans to build a “nationwide”

5G network using their newly purchased spectrum.

Sprint has approximately 120 MHz of spectrum in the

2.5 GHz band and has been working with Qualcomm

and SoftBank, its parent company, to plan 5G rollouts

in 2019. Meanwhile, AT&T has announced plans for IoT

services in spectrum it currently owns and acquired Fib-

erTower to obtain licenses at 24 and 39 GHz.

Since the 3GPP kicked off the 5G standardization ef-

fort in 2015, the mMTC use case has been deprioritized.

The 3GPP continues to evolve LTE; in release 14, the

3GPP made several enhancements to LTE specically

targeting the mMTC use case, with development of the

NB-IoT and LTE CAT-M standards. The mMTC use case

elevates connectivity as a goal, driving device manufac-

turers to incorporate wireless capabilities into many de-

vices not previously connected, expanding their utility.

We have seen a glimpse of the possibilities with new IoT

devices, but there are signicant challenges: there is no

pervasive or ubiquitous wireless IoT standard. As such,

there are challenges with interoperability and seamless

connectivity to infrastructure and smart devices. With

the 3GPP addressing the mMTC use case in release 14

impacting construction, medicine, manufacturing, re-

tail services and safety. Latency in this context also in-

cludes delivering timely information from the cloud or

deployed sensors to the brains of these devices, so that

decisions can be made on the y to enhance safety. In

this case, the data is delivered real-time, and the control

mechanism is deployed on the device.

In 2015, when the 3GPP kicked off the 5G standard-

ization effort, the group outlined the timelines and

key performance objectives for this new standard. The

3GPP stated unprecedented guiding principles for the

denition process to follow. First, 3GPP broke compat-

ibility with prior releases, setting a goal of forward com-

patibility. By breaking with LTE and prior-generation

standards, the 3GPP opened a path for innovation to

meet these very difcult objectives. Second, the 3GPP

divided 5G into phases. The rst phase, or Phase 1, fo-

cused on mobile access below 40 GHz and set a frame-

work for Phase 2 to investigate spectrum above 40 GHz.

In all, the 3GPP has been working on 3GPP release 15,

also known as 5G New Radio (NR) Phase 1, with an ex-

pected release date of June 2018 (see Figure 2).

WHERE WE ARE TODAY

As I write this article, the 3GPP is closing in on the rst

draft of the physical layer of 5G NR Phase 1, targeted for

December 2017. This rst draft is critically important, as

it establishes the foundation upon which semiconductor,

device, infrastructure, test and measurement and other

wireless ecosystem players will plan and build their busi-

nesses. Until this point, the development has evolved us-

ing system prototypes for eld trails with service operators.

With a rmer standard in place, the players can develop

tangible plans and targets for product and service rollouts.

Interestingly, there have been announcements re-

garding the availability of 5G technologies—speci-

cally by Intel and Qualcomm—and these early develop-

ments are intended to seed other companies to drive

adoption. It may seem strange to announce products

compliant with a standard before the standard is nal,

s Fig. 2 Timeline for 5G radio access network standardization. The rst NR specication release is scheduled for late 2017, with

updates during 2018.

RAN #80

(Rel-15 Completion)

RAN

#78

RAN

#74

RAN

#75

2016 2017 2018

Q4Q3

5G Study

5G NR Work Item

NSA = Non-Standalone = EPC Core (”Option 3”) & LTE Anchor

SA = Standalone

5G NR NSA

Completion

Stage 3 Completion

for Non-Standalone 5G-NR

Stage 3 Completion

for Standalone 5G-NR

NSA Option 3 Family ASN-1 Rel-15 ASN-1 for SA & NSA

5G NR SA

Completion

Further Evolution

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5G时代PCB设计新挑战：材料选择与解决方案详解

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