TS5V330C
www.ti.com
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
PACKAGE THERMAL IMPEDANCE
over operating free-air temperature range (unless otherwise noted)
UNIT
D package
(1)
73
DB package
(1)
82
θ
JA
Package thermal impedance DBQ package
(1)
90 °C/W
PW package
(1)
108
RGY package
(2)
39
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS
(1)
MIN MAX UNIT
V
CC
Supply voltage 4 5.5 V
V
IH
High-level control input voltage (EN, IN) 2 5.5 V
V
IL
Low-level control input voltage (EN, IN) 0 0.8 V
V
ANALOG
Analog input/output voltage 0 Vcc V
T
A
Operating free-air temperature –40 85 °C
(1) All unused control inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TS5V330C