7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage range VCC
–0.3
7 V
Voltage range USB data DxP, DxM
–0.3
5.5 V
Voltage range on BOOST pin BOOST -0.3 1.98 V
Voltage range other pins RX_SEN,CDP_ENZ ,SDA,SCL, RSTN -0.3 5.5 V
Storage temperature, T
stg
–65
150 °C
Maximum junction temperature, T
J (max)
125 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
7.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002
(1)
±2000
V
Charged-device model (CDM), per AEC Q100-011
(2)
±750
(1) AEC Q100-002 HBM ESD Classification Level 2
(2) AEC Q100- 011 CDM ESD Classification Level C4A
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage 2.3 5 6.5 V
T
A
Operating free-air temperature (AEC-Q100)
–40
105 °C
T
J
Junction temperature (AEC-Q100) 115 °C
V
I2C_BUS
I2C Bus Voltage 1.62 3.6 V
DxP, DxM Voltage range USB data 0 3.6 V
BOOST Voltage range BOOST pin 0 1.98 V
DIGITAL Voltage range other pins (SCL, SDA, RSTN, CDP_ENZ, ) 0 3.6 V
RX_SEN Voltage range RX_SEN pin 0 5.0 V
7.4 Thermal Information
THERMAL METRIC
(1)
RWB (X2QFN)
UNIT
12 PINS
R
θJA
Junction-to-ambient thermal resistance 137.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 62 °C/W
R
θJB
Junction-to-board thermal resistance 67.2 °C/W
ψ
JT
Junction-to-top characterization parameter 1.9 °C/W
ψ
JB
Junction-to-board characterization parameter 67.3 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
TUSB216-Q1
ZHCSM71A – APRIL 2019 – REVISED SEPTEMBER 2021
www.ti.com.cn
6 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TUSB216-Q1
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