TI-TUSB216-Q1: 高速USB2.0信号调节器，AEC-Q100汽车级应用

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TI-TUSB216-Q1是一款专为汽车应用设计的高性能USB2.0信号调节器，遵循严格的AEC-Q100标准，确保在极端温度范围内（-40°C至105°C）稳定工作。它具有宽电源电压输入范围，从2.3V到6.5V，旨在降低待机功耗，节省能源。该器件的核心特性包括： 1. **BC1.2控制器支持**：作为USB2.0高速信号的处理核心，TUSB216-Q1兼容多种USB标准，如USB2.0、OTG2.0和BC1.2，能够处理低速、全速和高速数据传输，适合各种接口需求。 2. **信号调节和补偿**：TUSB216-Q1利用专利设计，通过边缘加速器技术提升信号传输速度，同时配备直流升压功能，增强了信号的静态电平，确保信号质量。预均衡功能则提升了接收器的灵敏度，减少因长线缆导致的码间串扰（ISI）。 3. **线缆兼容性和扩展性**：该器件支持长达5米的电缆，并可通过菊花链连接方式扩展，以适应高损耗应用场景。此外，它与TUSB211、TUSB212、TUSB214引脚兼容，提供了多种接口选项。 4. **应用领域广泛**：TUSB216-Q1适用于汽车信息娱乐系统、仪表组、汽车音响主机以及有源电缆、电缆扩展器和背板等场合，满足不同汽车电子设备的信号传输需求。 5. **简化版原理图**：提供的简化版原理图展示了TUSB216-Q1的基本电路结构，包括VCC电源输入、GND接地、USB连接器和USB Host接口，方便用户理解其工作原理和连接方式。 6. **封装细节**：器件采用X2QFN(12)封装，尺寸仅为1.60mmx1.60mm，对于小型化和空间有限的应用设计非常合适。完整的封装选项可在数据表的可订购产品附录中查阅。 TUSB216-Q1是一款功能强大且灵活的USB信号处理解决方案，针对汽车行业的严苛要求，提供了高效、可靠的数据传输和电池充电控制能力。

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage range VCC

–0.3

7 V

Voltage range USB data DxP, DxM

–0.3

5.5 V

Voltage range on BOOST pin BOOST -0.3 1.98 V

Voltage range other pins RX_SEN,CDP_ENZ ,SDA,SCL, RSTN -0.3 5.5 V

Storage temperature, T

stg

–65

150 °C

Maximum junction temperature, T

J (max)

125 °C

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002

(1)

±2000

Charged-device model (CDM), per AEC Q100-011

(2)

±750

(1) AEC Q100-002 HBM ESD Classification Level 2

(2) AEC Q100- 011 CDM ESD Classification Level C4A

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Supply voltage 2.3 5 6.5 V

Operating free-air temperature (AEC-Q100)

–40

105 °C

Junction temperature (AEC-Q100) 115 °C

I2C_BUS

I2C Bus Voltage 1.62 3.6 V

DxP, DxM Voltage range USB data 0 3.6 V

BOOST Voltage range BOOST pin 0 1.98 V

DIGITAL Voltage range other pins (SCL, SDA, RSTN, CDP_ENZ, ) 0 3.6 V

RX_SEN Voltage range RX_SEN pin 0 5.0 V

7.4 Thermal Information

THERMAL METRIC

(1)

RWB (X2QFN)

UNIT

12 PINS

θJA

Junction-to-ambient thermal resistance 137.4 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 62 °C/W

θJB

Junction-to-board thermal resistance 67.2 °C/W

Junction-to-top characterization parameter 1.9 °C/W

Junction-to-board characterization parameter 67.3 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TUSB216-Q1

ZHCSM71A – APRIL 2019 – REVISED SEPTEMBER 2021

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Product Folder Links: TUSB216-Q1

7.5 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

(1)

MAX UNIT

POWER

ACTIVE_HS

High Speed Active Current

USB channel = HS mode. 480 Mbps

traffic. V

supply stable, with Boost =

Max

22 36 mA

IDLE_HS

High Speed Idle Current

USB channel = HS mode, no traffic.

supply stable, Boost = Max

22 36 mA

HS_SUPSPEND

High Speed Suspend Current

USB channel = HS Suspend mode.

supply stable

0.75 1.4 mA

Full-Speed Current

USB channel = FS mode, 12 Mbps traffic,

supply stable

0.75 1.4 mA

DISCONN

Disconnect Power

Host side application. No device

attachment.

0.80 1.4 mA

SHUTDN

Shutdown Power RSTN driven low, V

supply stable 60 115 µA

CONTROL PIN LEAKAGE

LKG_FS

Pin failsafe leakage current for

SDA, RSTN

= 0 V, pin at V

IH, max

10 15 µA

LKG_FS

Pin failsafe leakage current for

RX_SEN

= 0 V, pin at V

IH, max

6 15 µA

LKG_FS

Pin failsafe leakage current for

SCL

= 0 V, pin at V

IH, max

70 nA

INPUT RSTN

High level input voltage 1.5 3.6 V

Low-level input voltage 0 0.5 V

High level input current V

= 3.6 V, R

enabled ±15 µA

Low level input current V

= 0V, R

enabled ±20 µA

INPUT DIGITAL

High level input voltage

(CDP_ENZ)

1.5 3.6 V

Low-level input voltage

(CDP_ENZ)

0 0.5 V

Low level input current V

= 0V ±20 µA

High level input current V

= 3.6 V ±15 µA

INPUT RX_SEN (3-level input, for mid level leave pin floating)

IH(Max)

Maximum High level input

voltage

VCC = 2.3V to 6.5V 5.0 V

IH(Min)

Minimum High level input voltage

VCC > 4.5V 3.3 V

VCC = 2.3V to 4.5V (% of VCC) 75 %

Low level input voltage

VCC > 4.5V 0.75 V

VCC = 2.3V to 4.5V (% of VCC) 15 %

INPUT BOOST

BOOST_LVL0

External pulldown resistor for

BOOST Level 0

160

BOOST_LVL1

External pulldown resistor for

BOOST Level 1

1.5 1.8 2

kΩ

BOOST_LVL2

External pulldown resistor for

BOOST Level 2

3.4 3.6 3.96

kΩ

BOOST_LVL3

External pulldown resistor for

BOOST Level 3 to remove upper

limit for resistor value, can be left

open

7.5

kΩ

OUTPUTS CD, ENA_HS

High level output voltage for CD

and ENA_HS

= –50 µA, VCC >= 3.0V

2.5 V

High level output voltage for CD

= –25 µA, VCC = 2.3V

1.7 V

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TUSB216-Q1

ZHCSM71A – APRIL 2019 – REVISED SEPTEMBER 2021

Submit Document Feedback

Product Folder Links: TUSB216-Q1

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