4
TUSB319-Q1
SLLSEV4 –FEBRUARY 2017
www.ti.com
Product Folder Links: TUSB319-Q1
Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage V
DD
–0.3 6 V
Control pins
CC1, CC2, CURRENT_MODE, ID, DIR –0.3 6
V
VBUS_DET –0.3 4
Storage temperature, T
stg
–65 150 °C
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002
(1)
±3000
V
Charged-device model (CDM), per AEC Q100-0111 ±1500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Supply voltage range 3.8 5.5 V
V
DD(transient)
Transient voltage (with maximum width of 5 ms) 3.5 6 V
V
DD(ramp)
V
DD
ramp time 40 mS
V
BUS
System V
BUS
voltage 0 5 28 V
VBUS_DET VBUS_DET threshold voltage on the pin 3.8 V
T
A
Operating free air temperature range –40 25 85 °C
T
J
Junction temperature –40 105 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC
(1)
TUSB319-Q1
UNITDRF (WSON)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 92.7 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 66.6 °C/W
R
θJB
Junction-to-board thermal resistance 40.8 °C/W
ψ
JT
Junction-to-top characterization parameter 3.4 °C/W
ψ
JB
Junction-to-board characterization parameter 46.3 °C/W
R
θJC(bot)
Junction-to-case (bot) thermal resistance 43.5 °C/W
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